JPS60171612A - Multi-element thin film magnetic head - Google Patents

Abstract

PURPOSE:To reduce crosstalks of a multi-element thin film magnetic head and, at the same time, to manufacture the magnetic head through a simple process by forming the 1st and 2nd thin films of a magnetic substance on a non-magnetic substrate, then, the 3rd and 4th thin films of the magnetic substance on them in interposing a magnetic gap between them. CONSTITUTION:Holes 12a and 12b for windings are provided through a non-magnetic substrate 11 of ferrite, etc., and the 1st and 2nd thin films 13a and 13b of a magnetic substance, such as ''Sendust'', etc., are formed on the substrate 11. The substrate 11 is covered with a non-magnetic substance 14 and the 3rd and 4th thin films 17a and 17b of the magnetic substance are formed on the non-magnetic substance with magnetic gaps 15a and 15b between the non-magnetic substance 14 and thin films 17a and 17b. Then coils 18a and 18b are wound around them through the holes 12a and 12b. Since the thins films 13a and 17a and 13b and 17b of the magnetic substance having thicknesses of ten to serveral tens micrometer are used as the head core and core facing areas between adjacent magnetic head elements are small and, at the same time, the thin films of the magnetic substance are sufficiently separated trom each other, crosstalks can be minimized sufficiently. Moreover, since the number of the thin films used is small, this magnetic head can be manufactured through simple processes.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a multi-element thin film magnetic head, and more particularly to a multi-element thin film magnetic head having a structure suitable for reducing crosstalk.

[Background of the invention]

FIG. 1 is a perspective view of a conventional multi-element magnetic head. 1st
In the figure, 1α, 2α and 1b, 2b are magnetic gaps 6α and 3h made of non-magnetic material, respectively. Magnetic helad cores are combined to form a complete magnetic gap, 4α and 4A are winding windows, and 5α and 5b are windings. Magnetic head core 1 with wire coil
A magnetic head element consisting of α, 2α, a magnetic gap 6α, and a winding coil 5a, and a magnetic head element consisting of a magnetic helad core jA, 2A, a magnetic gap 3h, and a winding coil 5b have a track spacing! The multi-element magnetic head is entirely configured by placing them adjacent to each other and separated from each other.

However, with this configuration, when performing high-density recording,
Since the core facing area of each adjacent magnetic head element is large, the track spacing! There is a drawback that as the value becomes smaller, the crosstalk increases and the reliability of the recording and reproducing characteristics is impaired.

Another conventional example in which losstalk is completely reduced is a multi-element thin film magnetic head having the configuration shown in FIG. In FIG. 2, 6 is a non-magnetic substrate.

7a and 7b are lower magnetic bodies, f3a and 8h are magnetic gaps, 9α and 9A are upper magnetic bodies, and 10α and 10h are signal coils.

However, in the multi-element thin film magnetic head with the configuration shown in FIG. 2, thin film sound is used as the magnetic materials 7α, 7b, 9α, and 9b, so compared to the case where bulk materials are used as shown in FIG. If the area facing the magnetic core of each magnetic head element is sufficiently small, crosstalk can be reduced.
1 magnetic gap 8α, 8b1 upper magnetic body 9α, 9h
% signal coil 10α.

10A To form the entire structure, it is necessary to sequentially stack layers in a predetermined shape using thin film formation technology, photo etching, etc.
As the number of laminated layers increases, the manufacturing process becomes more complex and difficult.
There is a problem that manufacturing yield is reduced.

[Purpose of the invention]

The present invention has been made in view of the above, and its purpose is to provide a multi-element thin film magnetic head that can completely reduce crosstalk and can be manufactured using a simple manufacturing process. be.

[Summary of the Invention] The features of the present invention are as follows. A first winding hole of a predetermined shape is formed between a non-magnetic substrate having a second winding hole and the first and second winding holes on the non-magnetic substrate and spaced apart from each other by a predetermined distance.
a second magnetic thin film; The entire magnetic circuit is formed through a portion on the second magnetic thin film, a magnetic gap and a rear connection portion, respectively. The third winding was formed so as to pass through the outside to the second winding. a fourth magnetic thin film;
Above 1. The structure is different from that of a coil in which each coil is wound using the entire second winding.

[Embodiments of the Invention] The present invention will be explained in detail below using the embodiments shown in FIGS. 3 and 4.

FIG. 3 is a perspective view showing an embodiment of the multi-element thin film magnetic head of the present invention. In Fig. 3, 11 is the winding hole 12α
, 12h, a non-magnetic substrate 13a.

15J is the track spacing between the winding holes 12α and 12b of the nonmagnetic substrate 11! First and second magnetic thin films stacked apart, 14 is a nonmagnetic material for flattening the entire surface of the nonmagnetic substrate 11, 17α and 17b are first and second magnetic thin films i5a and 13b, respectively. The winding holes 12α, 12h constitute a magnetic circuit through the upper part, the magnetic gaps 154, 15A, and the rear connection parts 16a, 16Ai, respectively.
third and fourth magnetic thin films passing through the entire outside of the 18
α and 18b are coils wound through winding holes 12α and 12b'i, respectively.

Hereinafter, a method for manufacturing the multi-element thin film magnetic head according to the present invention shown in FIG. 6 will be explained. As the nonmagnetic substrate 11, ferrite, ceramic, glass, etc. are used, and the winding holes 12a,
12A1 by machining or etching. In addition, the winding hole 12α.

It goes without saying that 12h may be formed in the final manufacturing process. Furthermore, if photosensitive glass (the etching rate varies depending on the degree of sensitivity) is used as the substrate 11, etching can be performed with higher precision. Next, a magnetic thin film of sendust, amorphous, permalloy, or the like is formed on the substrate 11, and the first and second magnetic thin films 16α and 15bf are formed into a predetermined shape by etching or lift-talking. Next, SiO, A7 is applied to the parts other than the magnetic thin films 16α and 15b on the substrate 11.
? A non-magnetic material 14 such as 03 is laminated, and the entire surface is flattened by lapping or the like. Next, put the magnetic gear horn 15 on top of it.
After forming a non-magnetic material having a predetermined thickness of α and 15h, the first .alpha. All the magnetic thin films made of the same material as the second magnetic thin films 16α and 13b are laminated and etched into the predetermined shape shown in FIG. 3 to form the third and fourth magnetic thin films 17α.
.

It will be 17 hours. Finally, although not shown in FIG. 3, after the entire protective film is formed, the coils 18α and 18bi are wound.

In the multi-element thin film magnetic head of the present invention constructed as described above, the bed core has a film thickness of 10 to several tens of
Micron magnetic thin films 13α, 17α and 15h, 1
7Ak is used, the core facing area between adjacent magnetic head elements is small, and in addition, the third. Since the fourth magnetic thin films 17α and 176 are sufficiently spaced apart, crosstalk can be sufficiently reduced.

Furthermore, compared to conventional multi-element thin film magnetic heads, the number of laminated thin film layers is smaller, and the manufacturing process can be simplified.

In addition, in FIG. 3, 1. Second magnetic thin film 16α
, 13h and 6th. Fourth magnetic thin film 17α.

17A may be configured upside down, and the same effect can be obtained.

4 is a perspective view of a non-magnetic substrate showing another embodiment of the present invention. In FIG. 4, photosensitive glass is used as the non-magnetic substrate 11, and winding holes 12α, 12A) are formed in the substrate 11.
- In addition to providing grooves 19α and 19 for embedding magnetic thin films.
Ai is formed, a magnetic thin film is laminated on this substrate 11,
Thereafter, lapping is performed to completely remove and flatten the magnetic thin film in areas other than the grooves 19α and 19h, and form the first and second magnetic thin films 16α and 13Ai into predetermined shapes, respectively. According to FIG. 4, the non-magnetic material 14 for flattening shown in FIG. 6 is unnecessary, and the manufacturing process can be further simplified.

〔Effect of the invention〕

As explained above, according to the present invention, crosstalk can be reduced, and furthermore, it is possible to manufacture with a simple manufacturing process.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a conventional multi-element magnetic head, FIG. 2 is a perspective view of a conventional multi-element thin film magnetic head, and FIG. 6 is a perspective view of an embodiment of the multi-element thin film magnetic head of the present invention. FIG. 4 is a perspective view of a nonmagnetic substrate showing another embodiment of the present invention. 11...Nonmagnetic board 12α, 12h...Winding hole 1
3α, 13h... 1st. Second magnetic thin film 14...
Non-magnetic material i5 (!, 15A...magnetic gap 16α, 16h...rear connection portion 17!, 17b...third and fourth magnetic thin films 18α,
18h...Coil 19α, 19b...Group for embedding magnetic thin film Akio Takahashi Patent attorney Figure 1 Figure 2

Claims (1)

[Claims] 1. 1. A non-magnetic substrate provided with a second winding hole, and a first coil having a regular shape are formed spaced apart from each other by a predetermined distance between the first and second winding holes on the non-magnetic substrate. A second magnetic thin film, a part of the first magnetic thin film, and a portion of the second magnetic thin film pass through the magnetic gap and the rear connection portion, respectively, to form a magnetic circuit. The sixth wire was formed so as to pass i++n outside the second winding hole. a fourth magnetic thin film;
．． A multi-element thin film magnetic head comprising a coil each wound using a second winding. 2. Said 1. 2. The multi-element thin film magnetic head according to claim 1, wherein each of the second magnetic thin films has a width dimension that matches the track width. . 3. A multi-element thin film magnetic head according to claim 1 or 2, wherein the non-magnetic substrate is made of photosensitive glass. 4. Said 1. Claim 1, 2, or 3, wherein the second magnetic thin film is laminated in each embedding groove formed on the upper surface of the non-magnetic substrate and has a surface wrapped. Multi-element thin film magnetic head.