JPS60170245A - Substrate conveying truck - Google Patents

Substrate conveying truck

Info

Publication number
JPS60170245A
JPS60170245A JP2500684A JP2500684A JPS60170245A JP S60170245 A JPS60170245 A JP S60170245A JP 2500684 A JP2500684 A JP 2500684A JP 2500684 A JP2500684 A JP 2500684A JP S60170245 A JPS60170245 A JP S60170245A
Authority
JP
Japan
Prior art keywords
substrate
holder
chamber
susceptor
truck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2500684A
Other languages
Japanese (ja)
Inventor
Yoshimasa Kondo
近藤　芳正
Kazuo Sato
一雄 佐藤
Sumio Yamaguchi
山口　純男
Yasuhiro Shiraki
靖寛 白木
Muneo Mizumoto
宗男 水本
Sumio Okuno
澄生 奥野
Naoyuki Tamura
直行 田村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2500684A priority Critical patent/JPS60170245A/en
Publication of JPS60170245A publication Critical patent/JPS60170245A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)

Abstract

PURPOSE:To prevent a substrate from contaminating, to accelerate a processing speed and to facilitate a maintenance by separately providing a substrate holder which places substrates before growing and after growing, composing the holder of a high melting point material, and separating it from a truck body. CONSTITUTION:A rail 14 is mounted in a conveying chamber, and a truck 15 is reciprocatingly moved by a suitable drive type thereon. A susceptor brought into a vacuum tank from a guide chamber is placed on the first holder 16 side mounted on the truck 15. Then, the truck 15 is moved to preparing and analyzing chamber or a growing chamber, and the susceptor and hence the substrates are delivered by a manipulator to the chamber. The grown substrates are again placed on the truck 15 in the reverse order to the previous order. The susceptor which holds the grown substrate is heated to a high temperature, and various molecules are bonded. This susceptor is placed on the second holder 17 side. The holders 16, 17 are made of a high melting point metal such as Mo, Ta.

Description

【発明の詳細な説明】 〔発明の利用分野１ 本発明は１分子線エピタキシャル装置等における。に空
中での店仮搬送において、基板を清浄に保つのに好適な
搬送台車に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention 1] The present invention relates to a single molecule beam epitaxial device and the like. The present invention relates to a transport vehicle suitable for keeping substrates clean during temporary transport in the air.

〔発明の片景〕[A glimpse of invention]

分子線エピタキシャル装置では、第１図に示すように高
真空あるいは超高真空となる導入室ｌ、準備分析室２、
成長室３、搬送室４、等の各室に基板を搬送する手段が
必要である。その際、エピタキシャル層の格子欠陥の原
因となる基板への塵の付着を極力避けるため、従来は基
板を垂直に立てて搬送する方法がとられていたが、この
方法では基板の受渡しがむずかしいという欠点があった
。In a molecular beam epitaxial apparatus, as shown in Fig. 1, there are an introduction chamber 1 which is under high vacuum or ultra-high vacuum, a preparation analysis chamber 2,
A means for transporting the substrate to each chamber, such as the growth chamber 3 and the transport chamber 4, is required. At that time, in order to avoid as much as possible the adhesion of dust to the substrate, which can cause lattice defects in the epitaxial layer, the conventional method was to transport the substrate vertically, but this method makes it difficult to transfer the substrate. There were drawbacks.

また、基板表面を下向きにして搬送する方法もある。こ
の方法は第２図に示すように、基板９は剛性の高いサセ
プタ１０に貼付けられ、基板が下向きになるように、搬
送台車１１に搭載される。台車により基板は移送され、
所定の位置でマニピュ　ル−タ１２によりサセプタと共
ルこ受渡される。There is also a method of transporting the substrate with its surface facing downward. In this method, as shown in FIG. 2, a substrate 9 is attached to a highly rigid susceptor 10, and is mounted on a transport carriage 11 with the substrate facing downward. The board is transported by a trolley,
It is delivered together with the susceptor by the manipulator 12 at a predetermined position.

ところが、エピタキシャル成長を行うと基板の周囲のサ
セプタ表面にも分子が付着する。このサセプタが搬送台
車に移載されると、その付着物質は台車の上に塵として
、付着する。また、サセプタは８００℃程度まで加熱さ
れており、台車への熱的影響↓こよるダメージが大きく
、一層台車の汚れを助長する。この台車に、新しく未成
長の基板が貼付けられたサセプタが搭載されると、基板
が下向きにもかかわらず１台車に付着した物質による基
板表面への汚染が無視できなくなり、基板の格子欠陥の
原因となる可能性が大きくなる。以上、述べたように、
従来の基板下向き搬送台車には大きな欠点があった。However, when epitaxial growth is performed, molecules also adhere to the susceptor surface around the substrate. When this susceptor is transferred to a carrier, the adhering substances adhere to the carrier as dust. In addition, the susceptor is heated to about 800°C, which has a thermal effect on the cart, causing significant damage and further promoting dirt on the cart. When this cart is loaded with a susceptor to which a new, ungrown substrate is attached, the contamination of the substrate surface by substances attached to the cart becomes impossible to ignore even though the substrate is facing downward, causing lattice defects in the substrate. There is a greater possibility that As mentioned above,
Conventional downward-facing substrate transport vehicles had major drawbacks.

〔発明の目的〕[Purpose of the invention]

本発明のｌ」的は分子線エビタギンヤル成長させる基板
を清浄し；保つために最適な搬送台車を提供することに
ある。The object of the present invention is to provide an optimal transport vehicle for cleaning and maintaining a substrate on which molecular beam epitaxy is grown.

〔発明の概要〕[Summary of the invention]

ヒ記の目的を達成するために１本発明においては、基板
を搬送する台車に、成長前と成長後の基板を別々に搭載
する基板ホルダを設け、かつその基板ホルダは熱的に安
定で、しかも台車全体とは分離することが可能であるよ
うに構成したものである。In order to achieve the above object, in the present invention, a substrate holder is provided on a trolley for transporting the substrate, and the substrate holder is provided with a substrate holder on which the substrate before growth and the substrate after growth are separately mounted, and the substrate holder is thermally stable. Moreover, it is constructed so that it can be separated from the entire truck.

〔発明の実施例〕 以下、実施例を用いて、その内容を詳細に説明する。[Embodiments of the invention] Hereinafter, the contents will be explained in detail using examples.

第１回に示したように、基板を取付けたサセプタは導入
室から真空槽内に持ちこまれる。そして、る。各真空槽
はゲートバルブによって搬送室から隔てられている。搬
送室内には基板を搭載して往復する台車が設けられてい
る。As shown in Part 1, the susceptor with the substrate attached is brought into the vacuum chamber from the introduction chamber. And then. Each vacuum chamber is separated from the transfer chamber by a gate valve. Inside the transfer chamber, a cart is provided that carries the substrate and moves back and forth.

さて、本発明による台車を第３図に示す。レール１４は
搬送室に取付けられており、台１ｆ１５はその上を適当
な駆動方式、例えばチェーン、ロープ等により往復運動
ができる。導入室から真空槽内に持ちこまれたサセプタ
は台車上に取付けられている第１のホルダ１６側に載せ
られる。そして、台車は準備・分析室または成長室に移
動し、マニピュレータによりサセプタすなわち基板が各
室に受渡される。さて、成長を終えた基板は、今までの
逆の順序で台車に再び載せられる。この成長済の基板を
保持しているサセプタは高温に熱せられており、また、
種々の分子が付着している。そこで、このサセプタを第
２のホルダ１７側に載せるようにする。つまり、一台の
台車に、未成長基板用のホルダと成長済基板用のホルダ
を別々に設けることにより、未成長基板の塵による汚染
等を極カ避けることができる。本発明の基板ホルダは材
質がＭｏあるいはＴａのように高融・点金属で製作され
ており、熱的にも安定な性質を有している。Now, FIG. 3 shows a truck according to the present invention. The rail 14 is attached to the transfer chamber, and the platform 1f15 can be reciprocated thereon by a suitable drive method, such as a chain or rope. The susceptor brought into the vacuum chamber from the introduction chamber is placed on the first holder 16 mounted on the cart. Then, the cart is moved to a preparation/analysis room or a growth room, and the susceptor, that is, the substrate is delivered to each room by a manipulator. Now, the substrates that have finished growing are placed on the trolley again in the reverse order. The susceptor holding this grown substrate is heated to a high temperature, and
Various molecules are attached. Therefore, this susceptor is placed on the second holder 17 side. That is, by separately providing a holder for ungrown substrates and a holder for grown substrates on one cart, contamination by dust on ungrown substrates can be avoided to a large extent. The substrate holder of the present invention is made of a high melting point metal such as Mo or Ta, and has thermally stable properties.

このため、成長室内で約８００℃に加熱されたホルダを
、成長終了後完全に冷却するまでにまつことなく、基板
搬送用台車上に搭載しても、ホルダの熱変形や表面状態
の変化は生じない。この結果、多数板の基板を処理する
分子線エピタキシ装置において、処理時間の著しい短縮
が可能になった。Therefore, even if the holder heated to approximately 800°C in the growth chamber is mounted on the substrate transport trolley without waiting for it to completely cool down after the growth is completed, the holder will not be thermally deformed or its surface condition will change. Does not occur. As a result, it has become possible to significantly shorten the processing time in a molecular beam epitaxy apparatus that processes multiple substrates.

また、ホルダ１６および１７１ま台車１５にネジ止めさ
れており、容易に取外すことができる。したがって装置
を一定期間運転した後に、汚染したホルダは容易に交換
、洗浄することができる。これ１巳より、装置の稼動率
の著しい向上が可能になった。Furthermore, the holders 16 and 171 are screwed to the trolley 15 and can be easily removed. After a certain period of operation of the device, the contaminated holder can therefore be easily replaced and cleaned. This alone has made it possible to significantly improve the operating rate of the equipment.

〔発明の効果〕〔Effect of the invention〕

以上、説明したごとく、本発明によれば、次のような効
果が得られる。As explained above, according to the present invention, the following effects can be obtained.

（１）成長前の基板は常に洗浄な基板ホルダに搭載され
るので、汚染、塵の付着を防止することができる。(1) Since the substrate before growth is always mounted on a clean substrate holder, contamination and adhesion of dust can be prevented.

（２）成長後の基板を搭載する基板ホルダが熱的に安定
なため、成長後すぐに台車に基板を載せることが可能と
なり、特に多数枚の基板を行う装置において処理のスピ
ードアップが図られる。(2) Since the substrate holder on which the grown substrate is mounted is thermally stable, it is possible to place the substrate on the trolley immediately after growth, which speeds up the processing, especially in equipment that handles a large number of substrates. .

（３）基板ホルダは台車全体とは分離できるため必要な
時に、それだけを取出し洗浄することができ、保守が容
易になる。(3) Since the substrate holder can be separated from the entire cart, it can be taken out and cleaned when necessary, making maintenance easier.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、分子線エピタキシャル装置の構成図、第２図
は従来の基板搬送台車の見取り図、第３図は本発明によ
る基板搬送台車の見取り図である。 ６・・・搬出室、７・・・マニピュレータ、８・・・）
ｙ’　−トＡルブ、１３・・・レール、１４・・・レー
ル、１５・・・台車、１６．１７・・・ホルダ。 第　ｌ　口 第　２　口FIG. 1 is a block diagram of a molecular beam epitaxial apparatus, FIG. 2 is a sketch of a conventional substrate transport vehicle, and FIG. 3 is a diagram of a substrate transport vehicle according to the present invention. 6... Carrying out room, 7... Manipulator, 8...)
y'-ToA rub, 13...Rail, 14...Rail, 15...Dolly, 16.17...Holder. 1st mouth 2nd mouth

Claims (1)

【特許請求の範囲】[Claims] １、分子線エピタキシ成長を行う基板を真空槽内に導入
後、その基板を下向きにして真空槽内の複数位置に搬送
する基板搬送台車において、成長前の基板と成長後の基
板を搭載する基板ホルダをそれぞれ別に設け、その基板
ホルダをタンタル、モリブデンのような高融点材料で構
成し、かつその基板ホルダが台車本体と分離可能である
ことを特徴とした基板搬送台車。1. After introducing a substrate to be subjected to molecular beam epitaxy growth into a vacuum chamber, the substrate is loaded with a substrate before growth and a substrate after growth in a substrate transport vehicle that transports the substrate face down to multiple positions in the vacuum chamber. A substrate transport trolley characterized in that holders are provided separately, the substrate holders are made of a high melting point material such as tantalum or molybdenum, and the substrate holders are separable from the main body of the trolley.
JP2500684A 1984-02-15 1984-02-15 Substrate conveying truck Pending JPS60170245A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2500684A JPS60170245A (en) 1984-02-15 1984-02-15 Substrate conveying truck

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2500684A JPS60170245A (en) 1984-02-15 1984-02-15 Substrate conveying truck

Publications (1)

Publication Number Publication Date
JPS60170245A true JPS60170245A (en) 1985-09-03

Family

ID=12153851

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2500684A Pending JPS60170245A (en) 1984-02-15 1984-02-15 Substrate conveying truck

Country Status (1)

Country Link
JP (1) JPS60170245A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006109479A (en) * 2004-10-01 2006-04-20 Bose Corp Automobile audio system
CN112501688A (en) * 2020-10-30 2021-03-16 松山湖材料实验室 Graphite disc for growing large-size epitaxial wafer and using method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006109479A (en) * 2004-10-01 2006-04-20 Bose Corp Automobile audio system
CN112501688A (en) * 2020-10-30 2021-03-16 松山湖材料实验室 Graphite disc for growing large-size epitaxial wafer and using method thereof

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