JPS60167391U - Heat dissipation structure - Google Patents
Heat dissipation structureInfo
- Publication number
- JPS60167391U JPS60167391U JP5341384U JP5341384U JPS60167391U JP S60167391 U JPS60167391 U JP S60167391U JP 5341384 U JP5341384 U JP 5341384U JP 5341384 U JP5341384 U JP 5341384U JP S60167391 U JPS60167391 U JP S60167391U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat dissipation
- dissipation structure
- generating circuit
- circuit element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の放熱構造を示す分解斜視図、第２図及び
第３図は本考案の一実施例の分解斜視図及び部分断面図
、第４図は本考案の他の実施例の分解斜視図、第５図は
本考案の更に他の実施例の部分断面図である。
１・・・・・・印刷配線板、２．２０．３０・・・・・
・金属シャーシ、３ａ、 ３ｂ、 ３ｃ、 ３ｄ
・・・・・・トランジスタ、３ｅ・・・・・・３端子レ
ギユレータ、６，１６，２６・・・・・・板バネ部材、
６１．６６．６８・・・・・・固定部、６２．６７、６
９・・・・・・押圧部、８１，８２゜８３．８４，８５
・・・・・・接触部、９１，９２，９３．９４・・・・
・・切欠部。Figure 1 is an exploded perspective view showing a conventional heat dissipation structure, Figures 2 and 3 are exploded perspective views and partial sectional views of one embodiment of the present invention, and Figure 4 is an exploded perspective view of another embodiment of the present invention. The perspective view and FIG. 5 are partial cross-sectional views of still another embodiment of the present invention. 1...Printed wiring board, 2.20.30...
・Metal chassis, 3a, 3b, 3c, 3d
...Transistor, 3e...3 terminal regulator, 6, 16, 26...Plate spring member,
61.66.68... Fixed part, 62.67, 6
9... Pressing part, 81, 82° 83. 84, 85
...Contact part, 91, 92, 93.94...
...Notch.
Claims (3)
発熱回路素子の温度上昇を抑制する放熱構造において、
前記発熱回路素子を前記放熱部材に押圧されるバネ部材
を備えたことを特徴とする放熱構造。(1) In a heat dissipation structure that conducts heat emitted from a heat generating circuit element to a heat dissipating member and suppresses a rise in temperature of the heat generating circuit element,
A heat dissipation structure comprising a spring member that presses the heat generating circuit element against the heat dissipation member.
回路素子を押圧する押圧部を有する金属性の板バネ部材
であることを特徴とする実用新案登録請求の範囲第（１
）項記載の放熱構造。(2) The spring member is a metallic plate spring member having a fixing part fixed to the heat dissipating member and a pressing part pressing the heat generating circuit element.
) The heat dissipation structure described in section.
に対応する複数の接触部と該接触部間に設けられた切欠
部とを有するものであることを特徴とする実用新案登録
請求の範囲第（２）項記載の放熱構造。(3) A request for registration of a utility model characterized in that the pressing part of the leaf spring member has a plurality of contact parts corresponding to each of the plurality of heat generating circuit elements and a cutout part provided between the contact parts. The heat dissipation structure described in range (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5341384U JPS60167391U (en) | 1984-04-13 | 1984-04-13 | Heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5341384U JPS60167391U (en) | 1984-04-13 | 1984-04-13 | Heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60167391U true JPS60167391U (en) | 1985-11-06 |
Family
ID=30574253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5341384U Pending JPS60167391U (en) | 1984-04-13 | 1984-04-13 | Heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60167391U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007188998A (en) * | 2006-01-12 | 2007-07-26 | Hitachi Communication Technologies Ltd | Cooling structure of electronic apparatus |
| JP2015118985A (en) * | 2013-12-17 | 2015-06-25 | Tdk株式会社 | Fixing bracket |
| JP2017212275A (en) * | 2016-05-24 | 2017-11-30 | 矢崎総業株式会社 | Electronic component fixing structure |
-
1984
- 1984-04-13 JP JP5341384U patent/JPS60167391U/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007188998A (en) * | 2006-01-12 | 2007-07-26 | Hitachi Communication Technologies Ltd | Cooling structure of electronic apparatus |
| JP4589239B2 (en) * | 2006-01-12 | 2010-12-01 | 株式会社日立製作所 | Electronic equipment cooling structure |
| JP2015118985A (en) * | 2013-12-17 | 2015-06-25 | Tdk株式会社 | Fixing bracket |
| JP2017212275A (en) * | 2016-05-24 | 2017-11-30 | 矢崎総業株式会社 | Electronic component fixing structure |
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