JPS60166166U - 発光素子アレイヘツド - Google Patents

発光素子アレイヘツド

Info

Publication number
JPS60166166U
JPS60166166U JP1984052757U JP5275784U JPS60166166U JP S60166166 U JPS60166166 U JP S60166166U JP 1984052757 U JP1984052757 U JP 1984052757U JP 5275784 U JP5275784 U JP 5275784U JP S60166166 U JPS60166166 U JP S60166166U
Authority
JP
Japan
Prior art keywords
light emitting
emitting element
element array
array head
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984052757U
Other languages
English (en)
Inventor
俊二 坂井
博司 古谷
Original Assignee
沖電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 沖電気工業株式会社 filed Critical 沖電気工業株式会社
Priority to JP1984052757U priority Critical patent/JPS60166166U/ja
Publication of JPS60166166U publication Critical patent/JPS60166166U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は本考案の実施例の平面図、第２図は従来の発光
素子アレイヘッドの平面図である。 １１？　　１２ｔ　−−−−−−ｗ　　１　ｎ−ＬＥＤ
アレイ、２１．２２．・・・・・・、　２ｍ・・・発光
部、３１，３２．・・−・・・、　３ｍ・・・個別電極
、４・・・セラミック基板、１１１．１１２．・・・・
・・、１１ｍ・・・厚膜帯状電極パターン、１２１，１
２２．・・・・・・、１２ｍ・・・ワイヤボンディング
。 −゛補正昭５９．７．２３　　　　　　−′、−図面の
簡単な説明を次のように補正する。　　−゛明細書第７
頁第４行目に一１発光部１、とあるの番−′−−１’Ｌ
ＥＤＪと補正する一一、−

Claims (1)

    【実用新案登録請求の範囲】
  1. 発光部とその個別電極とを有する発光素子の複数個を列
    状に形成した発光素子アレイと、複数の前記発光素子ア
    レイを整列搭載するセラミック基板と、当該セラミック
    基板上であって且つ前記発光素子アレイの並び方向の両
    側に前記発光素子アレイの列と平行に形成された複数の
    帯状電極とを有し、各発光素子アレイでの同一配置関係
    にある各発光素子の前記個別電極と所定の前記帯状電極
    とを対応させワイヤボンディング接続してなる発光素子
    アレイヘッド。
JP1984052757U 1984-04-12 1984-04-12 発光素子アレイヘツド Pending JPS60166166U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984052757U JPS60166166U (ja) 1984-04-12 1984-04-12 発光素子アレイヘツド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984052757U JPS60166166U (ja) 1984-04-12 1984-04-12 発光素子アレイヘツド

Publications (1)

Publication Number Publication Date
JPS60166166U true JPS60166166U (ja) 1985-11-05

Family

ID=30572989

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984052757U Pending JPS60166166U (ja) 1984-04-12 1984-04-12 発光素子アレイヘツド

Country Status (1)

Country Link
JP (1) JPS60166166U (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5660024A (en) * 1979-10-22 1981-05-23 Hitachi Ltd Composite type semiconductor device
JPS5728379A (en) * 1980-06-25 1982-02-16 Pitney Bowes Inc Light emitting diode assembly

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5660024A (en) * 1979-10-22 1981-05-23 Hitachi Ltd Composite type semiconductor device
JPS5728379A (en) * 1980-06-25 1982-02-16 Pitney Bowes Inc Light emitting diode assembly

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