JPS6016540U - ワイヤボンデイング装置 - Google Patents

ワイヤボンデイング装置

Info

Publication number
JPS6016540U
JPS6016540U JP1983108369U JP10836983U JPS6016540U JP S6016540 U JPS6016540 U JP S6016540U JP 1983108369 U JP1983108369 U JP 1983108369U JP 10836983 U JP10836983 U JP 10836983U JP S6016540 U JPS6016540 U JP S6016540U
Authority
JP
Japan
Prior art keywords
capillary
wire bonding
tapered
bonding equipment
tapered tube
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983108369U
Other languages
English (en)
Inventor
山口　光男
丹治　幸雄
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP1983108369U priority Critical patent/JPS6016540U/ja
Publication of JPS6016540U publication Critical patent/JPS6016540U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図ａ、　　ｂは従来のワイヤボンディング装置のキ
ャピラリ部分の正面図、第２図ａ、　　ｂは本考案の実
施例のキャピラリ部分の正面図および側面図、第３図ａ
、　　ｂは第２図の温度センサ部の斜視図およびその断
面図である。 図において、１・・・・・・キャピラリホルダ、２・・
・・・・キャピラリ、３・・・・・・押えネジ、４・・
・・・・従来の温度センサ、５・・・・・・カートリッ
ジヒータ、６・・・・・・ワイヤ、７・・・・・・本考
案の温度センサ、８・・・・・・バネ、９・・・・・・
断熱絶縁体、１０・・・・・・熱電対、１１・・・・・
・被覆、１２・・・・・・キャピラリー挿入用テーパー
管、である。

Claims (1)

    【実用新案登録請求の範囲】
  1. テーパ状にした先端から接合すべきワイヤを引出すキャ
    ピラリと、このキャピラリを端部で保持し加熱手段によ
    りこのキャピラリを加熱するキャピラリホルダと、前記
    キャピラリのテーパ状個所に挿入されて保持されるテー
    パ管と、このテーパ管に接触してその温度を検出する感
    温手段と、前記テーパ管を前記キャピラリのテーパ状個
    所に押圧するように前記キャピラリホルダに設けられた
    バネ手段とを含むワイヤボンディング装置。
JP1983108369U 1983-07-13 1983-07-13 ワイヤボンデイング装置 Pending JPS6016540U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983108369U JPS6016540U (ja) 1983-07-13 1983-07-13 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983108369U JPS6016540U (ja) 1983-07-13 1983-07-13 ワイヤボンデイング装置

Publications (1)

Publication Number Publication Date
JPS6016540U true JPS6016540U (ja) 1985-02-04

Family

ID=30252854

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983108369U Pending JPS6016540U (ja) 1983-07-13 1983-07-13 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS6016540U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62251370A (ja) * 1986-04-22 1987-11-02 黒川　耀雄 衛生用品袋

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62251370A (ja) * 1986-04-22 1987-11-02 黒川　耀雄 衛生用品袋

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