JPS6016397U - bubble memory device - Google Patents
bubble memory deviceInfo
- Publication number
- JPS6016397U JPS6016397U JP10775883U JP10775883U JPS6016397U JP S6016397 U JPS6016397 U JP S6016397U JP 10775883 U JP10775883 U JP 10775883U JP 10775883 U JP10775883 U JP 10775883U JP S6016397 U JPS6016397 U JP S6016397U
- Authority
- JP
- Japan
- Prior art keywords
- memory device
- bubble memory
- hole
- finished product
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例を示す斜視図、第２図は第１
図に示すヨークの一例を示す斜視図、第３図は第１図に
示すバブルメモリデバイス組立半製品の折曲加工前の上
面図、第４図は第３図に示すバブルメモリデバイス組立
半製品に折曲加工を施こした一例を示す斜視図、第５図
は本考案の他の実施例で使用するヨークの一例を示す斜
視図、第６図は第５図に示すヨークとに対して本考案の
他の実施例で使用するバブルメモリデバイス組立半製品
の一例を示す斜視図である。
１・・・・・・接地端子、２・・・・・・リード、３，
３′・・・・・・穴、４． ４’・・・・・・ヨーク、
５・・・・・・ハンダ付箇所、６、 ７． ７’、
８． ８’・・・・・・バブルメモリデバイス組立半製
品。
Ｌ−一一一一一
一二域
７”−ｉFig. 1 is a perspective view showing one embodiment of the present invention, and Fig. 2 is a perspective view showing an embodiment of the present invention.
FIG. 3 is a top view of the bubble memory device assembly semi-finished product shown in FIG. 1 before bending processing, and FIG. 4 is a bubble memory device assembly semi-finished product shown in FIG. FIG. 5 is a perspective view showing an example of a yoke used in another embodiment of the present invention, and FIG. 6 is a perspective view showing an example of the yoke shown in FIG. 5. FIG. 3 is a perspective view showing an example of a semi-assembled bubble memory device used in another embodiment of the present invention. 1...Ground terminal, 2...Lead, 3,
3'...hole, 4. 4'...York,
5... Soldering points, 6, 7. 7',
8. 8'・・・Bubble memory device assembly semi-finished product. L-111112 area 7”-i
Claims (1)
モリデバイス組立半製品と、前記バブルメギリゾバイス
組立半製品の磁気シールドを行うとともに引き出された
前記リードの位置に穴を有しこの穴の穴位置で前記リー
ドとハンダ付が行なわれるヨークとを含むことを特徴と
するバブルメモリデバイス。A bubble memory device assembly semi-finished product having a lead that is electrically connected to a ground terminal and pulled out, and a hole located at the position of the lead that is pulled out while magnetically shielding the bubble memory device assembly semi-finished product, and the hole position of the hole. A bubble memory device comprising: a yoke to which the leads and soldering are performed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10775883U JPS6016397U (en) | 1983-07-12 | 1983-07-12 | bubble memory device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10775883U JPS6016397U (en) | 1983-07-12 | 1983-07-12 | bubble memory device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6016397U true JPS6016397U (en) | 1985-02-04 |
Family
ID=30251667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10775883U Pending JPS6016397U (en) | 1983-07-12 | 1983-07-12 | bubble memory device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6016397U (en) |
-
1983
- 1983-07-12 JP JP10775883U patent/JPS6016397U/en active Pending
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