JPS60162789A - Plating treatment - Google Patents

Abstract

PURPOSE:To prevent intrusion and sticking of a plating liquid to the local parts of articles and to improve the finish at the edges of the local parts as far as possible by press-sticking and fitting airtightly fitting members each consisting of an elastic material to the local part of the article and subjecting the article to a plating treatment. CONSTITUTION:Fitting members 4, 4 consisting of an elastic material are airtightly press-stuck and fitted to the upper aperture of a through-hole (local part) 1 pierced to a flat plate-shaped article 1 such as a metallic plate, ceramic plate or the like. The members 4 are like plugs to seal hermetically the upper and lower apertures of the hole 1 and are formed to a truncated circular cone shape. Said members are forcibly pushed into the hole 1 from the upper and lower apertures of the hole 1. The article 2 is treated by a known method such as electroless plating or electroplating in this state. Since the hole 1 is airtightly sealed and plugged by the members 4, 4 in this stage, the plating soln. does not intrude into the hole 1. The desired plating treatment in which the circumferential wall 1a of the hole 1 is not plated and only the top and bottom surfaces of the article 2 are formed with plating films 3 is thus accomplished.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a plating treatment method for applying a plating film to an article such as an electronic component made of metal or ceramic by electrolytic plating or electroless plating, except for local parts thereof.

Conventionally, this type of plating treatment method includes, for example, applying a plating film to the entire article, then coating the parts excluding local parts where the plating film is not needed with an organic resin, and removing the said local parts by etching, or applying 7-otoresist. death,
7 A method of dissolving and removing the plating film other than the photosensitive part of the photoresist, a method of activating the surface part of the article excluding the private part, applying a plating film only to this part, and a method of preventing the local part from being plated, Alternatively, depending on the material of the article, it is known that after activating the surface portion of the article except for local areas, plating is performed by applying an organic resin to the local areas where no plating film is required.

However, in any of the above methods, the steps after plating are complicated and time-consuming. Furthermore, in the case of a method of applying an organic resin to a local area, there is a risk that coating defects such as pinholes may occur on the surface coated with the organic resin, which causes problems such as etching errors8. It was made to eliminate the drawbacks of the conventional
By airtightly fitting a fitting member made of an elastic material to the local part of the article, it is possible to prevent the plating solution from penetrating into the local part, simplifying the processing process, and removing the edge part of the local part. The purpose is to improve the finish as much as possible.

Hereinafter, embodiments of the present invention will be described in detail based on the drawings.

Now, as an example of the plating treatment method according to the present invention, as shown in FIG. The membrane 3 is applied to the periphery of the through hole 1! !
! To explain the plating process for the case in which no plating is applied to 1a, first, fitting members 4 made of an elastic material are press-fitted to the upper and lower openings of the through hole 1 in an airtight manner.

Each fitting member 4 is a plug-like member that seals the upper and lower openings of the through hole 1, and is formed in the shape of a truncated cone, and is forced into the hole 1 from the upper and lower openings of the through hole 1. After fitting the fitting members 4 to be pushed into the through hole 1, the flat article 2 is plated by a well-known method such as electroless plating or electrolytic plating. At this time, the through hole 1 is inserted into the fitting member 4.
4, the plating solution cannot enter into the through hole 1. Therefore, through hole 1
No plating is applied to the peripheral wall 1a. When the fitting members 4 are removed from the through holes 1 after the plating process is completed, the desired plating process can be performed in which the plating film 3 is applied only to the upper and lower surfaces of the flat article 2. Incidentally, after the plating treatment, the article 2 may be treated with an organic solvent such as 7 Leon or Trichloride to remove the portion of the fitting member 4 remaining in the through hole 1.

Furthermore, since each of the fitting members 4 is immersed in or in contact with a plating solution, it is necessary to make of an elastic material having chemical resistance, such as natural rubber, silicone rubber, fluorine rubber, plastic, wood, or cork. etc. will be adopted. Among these, fluorine chloride and the like are resistant to chemicals contained in the plating solution and can be used repeatedly.

FIG. 2 shows a case where the local part 1 is a bottomed hole drilled in a flat article 2. In this case, it is only necessary to seal one opening of the hole 1, and therefore the fitting member 4 is It is sufficient to prepare only one device similar to the above embodiment.

FIG.
The fitting member 4 applied in this case is formed in the shape of a bottle with a widened end, and passes through the through hole 1 when it is press-fitted into the through hole 1.

FIG. 4 shows a case where a plating film 3 is applied to the circumferential wall of a cylindrical article 2 except for a part (local area 1), and in this case, the local area 1 is formed in a circumferential shape. Therefore, the fitting member 4 is formed in the shape of a bundle that covers the surface of the local part 1.

Note 1. The above-mentioned embodiments are merely illustrative of typical methods of the present invention; in addition, the shape of the fitting member 4 can be deformed to suit various local shapes. It is possible to apply it to

As described above, according to the present invention, by airtightly fitting a fitting member made of an elastic material into a local part, it is possible to prevent the plating solution from penetrating into the local part when plating an article. This eliminates the need for conventional etching in the plating process, which simplifies the process and eliminates etching errors such as pinholes. can.

Furthermore, even if the article has a relatively intricate shape, if the shape of the fitting member is formed to match the local shape of the article, it is possible to easily form a portion where no plating film is applied, and to make it possible to form a portion where no plating film is applied. It has become possible to improve the finish of the edge parts as much as possible.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal sectional view of the main part showing the first embodiment of the present invention, l'
Figure 2 is a vertical cross-sectional view of the main part showing the second embodiment of the present invention.
Figure iS3 is a longitudinal sectional view of main parts showing the third embodiment of the present invention,
FIG. 4 is a longitudinal cross-sectional view of a main part showing a tIS4 embodiment of the present invention. 1 is a local part, 2 is an article, 3 is a plating film, and 4 is a fitting portion. Applicant: It lη Manufacturing Co., Ltd. Representative: Patent Attorney: Kazuhide Oka 1)

Claims (3)

[Claims] (1) A method of applying a plating film to an article except for a local part thereof, in which a fitting member made of an elastic material is airtightly crimped and fitted to the local part, thereby plating the article. 1. A plating method characterized in that the plating solution is prevented from immersing into the local area during application. (2) The local part is the peripheral wall of the hole, and the fitting member
The plating method according to claim 1, wherein the plating method is formed into a plug shape. (3) The plating method according to claim 1, wherein the local part is formed in the shape of a circumferential surface, and the fitting member is formed in the form of a bundle ring covering the surface of the local part.