JPH08165599A - Jig for partially plating ceramic package and partial plating method - Google Patents

Abstract

PURPOSE: To easily and efficiently plate only the reaction face by housing a ceramic package in an insulating case so that only the face opposite to the pin of the package is exposed and plating the package in a plating tank. CONSTITUTION: An inner electrode member 4 is laid on an elastic plate-shaped decking member 3 placed on the bottom face of the recess of an insulating case 2, and a ceramic package W is fitted into the recess of the case 2 so that the tip of its pin P is brought into contact with the member 4. An outer electrode part 5 is fixed to the outer wall face of the case 2, and its protrusion 5a is in contact with the inner electrode member 4. The space between the inner wall face 7a of the recess 7 of the case 2 and the outer periphery Wr of the package W is sealed with an elastic seal member 6. The case 2 with only the face Ws opposite to the pin P exposed is placed in the plating tank in this way, and hence the metallic layer Wa of the face Ws is easily and efficiently plated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for partial plating of a ceramic package and a method of partial plating, and more particularly to a ceramic for plating only the surface of a PGA substrate or the like opposite to the pins of the ceramic package. A jig for partial plating of a package and a partial plating method.

[0002]

2. Description of the Related Art Conventionally, when electrolytic plating is applied only to the surface of a ceramic package such as a PGA (pin grid array) substrate opposite to the surface on which the pins are planted, the package is immersed in a plating treatment tank for plating. Since the pins are also plated if they are applied, a dedicated partial plating device is used to pre-tape the parts that are not plated or to prevent the pins from being plated.

As a partial plating device for this type of ceramic package, a plating treatment tank for discharging the plating liquid supplied in a jet state at an overflow weir while maintaining a predetermined liquid surface level, and a plating liquid solution. A masking provided with an upper lid arranged in an inclined state with respect to a surface, having a first plating opening corresponding to a surface to be plated of the ceramic package, and a plurality of first through holes exposing one end to the first plating opening. A plurality of second pads that are mounted on the upper surface of the upper lid, and that communicate with the first plating opening in the upper lid and one end that communicates one end with each first through hole and the other end that faces the plating tank. A device having a through hole has been proposed (see Japanese Patent Application Laid-Open No. 63-238283).

[0004]

However, when a dedicated partial plating apparatus is used as in the conventional partial plating method described above, there are the following problems. That is, the dedicated partial plating apparatus itself becomes large in size and the equipment cost is high, so the cost of the plating process is also high. Since a ceramic package to be subjected to electrolytic plating must be set in a dedicated partial plating apparatus, when electrolytic plating is applied to a large number of ceramic packages, the work efficiency thereof deteriorates. Since this apparatus is configured to spray a plating solution and perform electrolytic plating, it is difficult to obtain a plating having a uniform thickness. And other issues.

The present invention has been made in view of the above-mentioned problems, and its object is to provide a jig for partial plating capable of easily performing partial plating of a ceramic package and the jig. It is to provide a partial plating method using.

[0006]

A jig for partial plating of a ceramic package according to claim 1 of the present invention as a means for achieving the above object is to plate only the surface opposite to the pin of the ceramic package. A jig for partial plating used for forming an insulating case having a recess into which the ceramic package can be fitted, an internal electrode member that can be laid on the bottom of the recess of the insulating case, and an insulating case An external electrode member that is drawn out to the outside and can be electrically connected to the internal electrode member, and a sealing member that can seal between the recess wall surface of the insulating case and the outer peripheral surface of the ceramic package are provided.

A jig for partial plating of a ceramic package according to a second aspect is the jig for partial plating of a ceramic package according to the first aspect, further comprising an elastic insole member which is fitted into a bottom surface of the recess of the insulating case. Then, the internal electrode member is laid on the insole member. A jig for partial plating of a ceramic package according to a third aspect is the jig according to the first or second aspect, wherein the internal electrode member is made of a metal mesh member.

According to a fourth aspect of the present invention, there is provided a method of partially plating a ceramic package, wherein the jig for partial plating of the ceramic package according to any one of the first to third aspects is used to form a bottom surface of a recess of an insulating case of the jig. With the internal electrode member laid, the ceramic package is fitted into the recess of the insulating case with the pin tip in the direction of contacting the internal electrode member, and the recess of the insulating case is provided by the sealing member. After sealing between the wall surface and the outer peripheral surface of the ceramic package, the ceramic package together with the jig is placed in a plating bath for plating.

[0009]

In the jig for partial plating of the ceramic package according to the first aspect of the present invention, the internal end of the ceramic package is laid on the bottom of the recess of the insulating case of the jig, and the tip of the pin of the ceramic package is the internal electrode. The pin of the ceramic package is inserted by fitting the recess of the insulating case in the direction of contact with the member and sealing the gap between the wall surface of the recess of the insulating case and the outer peripheral surface of the ceramic package by the sealing member. The plating tank is connected to the external electrode member via the electrode member and the outer peripheral surface is sealed by the sealing member so that only the surface opposite to the pin is exposed, and the plating tank is held while holding the ceramic package of this jig. The plating can be applied only to the surface of the ceramic package opposite to the pins.

A jig for partial plating of a ceramic package according to a second aspect is the jig according to the first aspect, wherein the internal electrode member is laid on an elastic insole member which is fitted into the bottom surface of the recess of the insulating case. As a result, the pins of the package and the internal electrode members can be reliably brought into contact with each other. Also,
A jig for partial plating of a ceramic package according to claim 3 is the jig according to claim 1 or 2, wherein the internal electrode member is made of a metal mesh member, so that the pin of the ceramic package and the internal electrode member are surely brought into contact with each other. Can be

According to a fourth aspect of the present invention, there is provided a method of partially plating a ceramic package, wherein the jig for partially plating the ceramic package according to any one of the first to third aspects is used as described above. It is possible to carry out electrolytic plating only on the surface of the ceramic package opposite to the exposed pins by placing it in a plating tank while holding it on a jig.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. Here, FIGS.
1 shows an embodiment of the present invention, FIG. 1 is an exploded perspective view of a jig, FIG. 2 is a sectional view, and FIG.
FIG. 4 is an explanatory view of the partial plating method.

The jig for partial plating of a ceramic package of this embodiment is a jig 1 for partial plating used for electrolytically plating only the surface of the ceramic package opposite to the pins. As shown in FIG. 3, the insulating case 2, the insole member 3, the internal electrode member 4, the external electrode member 5, and the sealing member 6 are provided, and the ceramic package W is fixed with its pin P inside. The metal layer Wa on the surface Ws on the side opposite to the pin P is plated in a plating bath set in the tool 1.

The ceramic package W to be electroplated in this embodiment is the PGA package shown in FIG. 1, and a large number of pins P are planted on one surface of the PGA package.
A metal layer Wa is formed on a surface Ws opposite to the surface Ws, and the metal layer Wa is electrically connected to the wiring inside the package W. By energizing the pin P, the metal layer Wa is electroplated. Give.

The insulating case 2 of the jig 1 for partial plating is
A square case 7 into which the ceramic package W can be fitted is formed in a plastic case having chemical resistance. The insole member 3 is formed of a plate-like member having elasticity such as rubber, and has a form that can be fitted into the recess 7 of the insulating case 1 and laid on the bottom surface thereof.

The internal electrode member 4 is formed of a metal mesh member, and has such a size that it can be fitted into the recess 7 of the insulating case 1 and laid on the insole member 3.

The external electrode member 5 is made of a conductive material and is fixed to the outer wall surface of the insulating case 2 so that
A projecting piece portion 5a that penetrates through and contacts the internal electrode member 4 is fixed. The protrusion 5a of the external electrode member 5 is shown in FIG.
As shown in, it is arranged above the insole member 3.
The sealing member 6 is made of a rubber material having elasticity, and is fitted between the inner wall surface 7a of the recess 7 of the insulating case 2 and the outer peripheral surface Wr of the ceramic package W as shown in FIG. It is configured to be sealed.

Next, a method of partially plating only the metal layer Wa on the surface Ws of the ceramic package W opposite to the pin P using the jig 1 for partial plating of this embodiment will be described. First, in the jig 1, the insole member 3 is fitted into at least the bottom surface of the concave portion 7 of the insulating case 2, and then the external electrode member 5 is inserted.
The external electrode member 5 is fixed to the outer surface of the case 2 by inserting the protruding piece portion 5a.

Then, the internal electrode member 4 is laid in the recess 7 of the insulating case 2, while the ceramic package W is fitted into the frame-shaped sealing member 6, and the ceramic package is joined together with the sealing member 6. W is fitted into the recess 7 of the insulating case 2 with the pin P facing forward. As a result, the tip of the pin P of the ceramic package W contacts the internal electrode member 4, and the internal electrode member 4 is electrically connected to the external electrode member 5 via the protruding piece portion 5a. P is connected to the external electrode member 5.

At this time, since the insole member 3 having elasticity is installed on the bottom surface of the concave portion 7 of the insulating case 2, the pin P of the ceramic package W is pushed to surely contact the internal electrode member 4. Further, by forming the internal electrode member 4 with a metal mesh member, the contact between the pin P and the internal electrode member 4 is easy and more reliable.

The outer peripheral surface W of the ceramic package W
Since the sealing member 6 is interposed between r and the inner wall surface 7a of the recess 7 of the insulating case 2 to seal the two, it is possible to prevent the plating solution from entering the recess 7 from the outside. . By thus fitting the ceramic package W into the jig 1, as shown in FIG.
Is held by the jig 1 with only the surface Ws opposite to the pin P exposed.

Therefore, as shown in FIG. 4, the jig 1 is placed in the plating tank 8 while holding the ceramic package W, and a predetermined voltage is applied between the external electrode member 5 and the plating solution 9, Only the metal layer Wa on the surface Ws of the ceramic package P exposed from the jig 1 is electrolytically plated, and the pins P hidden in the jig 1 are not plated. Therefore, partial plating can be performed. it can.

As described above, by setting the ceramic package W on the jig 1 and immersing it in the plating tank, it is possible to plate only the metal layer Wa on the surface Ws opposite to the pins P of the ceramic package W. The partial plating of the ceramic package can be easily performed, and the work efficiency can be improved.

It should be noted that the present invention is not limited to the above-described embodiments, but includes configurations that can be modified and implemented within the scope of the present invention. In the embodiment described above,
The internal electrode member and the insole member may be integrated. The internal electrode member may be formed of a conductive elastic plate or the like in addition to the metal mesh.

[0025]

As is apparent from the above description, according to the jig for partial plating of the ceramic package of claim 1 of the present invention, the internal electrode member is laid on the bottom surface of the recess of the insulating case of the jig. And insert the ceramic package into the recess of the insulating case with the pin tip in the direction of contact with the internal electrode member, and seal between the recess wall of the insulating case and the outer peripheral surface of the ceramic package with a sealing member. By doing so, the pin is connected to the external electrode member through the internal electrode member, and the outer peripheral surface is sealed by the sealing member so that only the surface opposite to the pin can be exposed. By placing the tool in the plating tank while holding the ceramic package, it is possible to plate only the surface opposite to the pin of the ceramic package,
Partial plating can be performed easily and efficiently, and there is an effect that an expensive exclusive partial plating device is unnecessary and cost is reduced.

According to the jig for partial plating of the ceramic package of claim 2, since the internal electrode member is laid on the elastic insole member that fits into the bottom surface of the recess of the insulating case, the internal pin member of the package is There is an effect that the internal electrode member can be surely contacted.

According to the jig for partial plating of the ceramic package of claim 3, since the internal electrode member is formed of the metal mesh member, it is possible to ensure the contact between the pin of the ceramic package and the internal electrode member. Has the effect.

According to a method for partially plating a ceramic package according to a fourth aspect, the jig for partial plating of the ceramic package according to any one of the first to third aspects is used to hold the ceramic package on the jig as described above. Since it can be put in the plating tank in the state and plating can be applied only to the surface opposite to the exposed pins of the ceramic package,
Partial plating can be performed easily and efficiently, and there is an effect that an expensive exclusive partial plating device is unnecessary and cost is reduced.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a jig for partial plating according to an embodiment of the present invention.

FIG. 2 is a sectional view of FIG.

FIG. 3 is an external perspective view of a package set.

FIG. 4 is an explanatory diagram of a partial plating method.

[Explanation of symbols]

1 ... jig for partial plating, 2 ... insulating case, 3
... Insole member, 4 ... Internal electrode member, 5 ... External electrode member, 5a ... Projection portion, 6 ... Sealing member, 7 ...
..Case recesses, 7a ... Inner wall surfaces of recesses, 8 ...
Plating tank, W ... Ceramic package, P ...
-Pin, Ws ... Surface opposite to ceramic package pin, Wr ... Outer surface of ceramic package, Wa
... Metal layer

Claims (4)

[Claims] 1. A jig for partial plating used to plate only a surface of a ceramic package opposite to a pin, the insulating case having a recess into which the ceramic package can be fitted, and the insulating case. An internal electrode member that can be laid on the bottom surface of the recess, an external electrode member that is drawn out of the insulating case and can be electrically connected to the internal electrode member, a recess wall surface of the insulating case, and an outer peripheral surface of the ceramic package. A jig for partial plating of a ceramic package, characterized in that it has a sealing member capable of sealing the space. 2. The ceramic package portion according to claim 1, further comprising an elastic insole member fitted into the bottom surface of the recess of the insulating case, and the internal electrode member being laid on the insole member. A jig for plating. 3. The jig for partial plating of a ceramic package according to claim 1, wherein the internal electrode member is made of a metal mesh member. 4. A partial plating method in which plating is applied only to the surface of the ceramic package opposite to the pins.
3. A jig for partial plating of a ceramic package according to any one of 1 to 3 is used, and the ceramic package has a pin tip inside the inner electrode member laid on the bottom surface of the recess of the insulating case of the jig. The ceramic package is fitted in the recess of the insulating case in a direction of contacting the electrode member and sealed between the recess wall surface of the insulating case and the outer peripheral surface of the ceramic package by the sealing member, and then the ceramic package. Is placed in a plating bath together with the jig to perform plating, and a method for partially plating a ceramic package.