JPS60161626A - Detector for disconnection - Google Patents
Detector for disconnectionInfo
- Publication number
- JPS60161626A JPS60161626A JP59015206A JP1520684A JPS60161626A JP S60161626 A JPS60161626 A JP S60161626A JP 59015206 A JP59015206 A JP 59015206A JP 1520684 A JP1520684 A JP 1520684A JP S60161626 A JPS60161626 A JP S60161626A
- Authority
- JP
- Japan
- Prior art keywords
- currents
- wire
- coupler
- discharge
- photo
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/78268—Discharge electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は断線検出技術、特に、ワイヤボンダーによるペ
レット等へのワイヤボンディング時における断線の検出
に適用して効果のある技術に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a wire breakage detection technique, and particularly to a technique that is effective when applied to detect wire breakage during wire bonding to pellets or the like by a wire bonder.
ワイヤボンダーによるボンディングを行う場合。 When performing bonding with a wire bonder.
ワイヤがクランパに引っ掛かったりすること等により断
線不良を生じることがある。この断線が発生した場合に
は不及的速やかに断線検出を行ってボンディングを中断
しないと、いわゆる空打ちが行われてしまい、大量のボ
ンディング不良を生じてしまうことになる。Wire breakage may occur due to the wire getting caught in the clamper, etc. When this disconnection occurs, if the disconnection is not detected as soon as possible and the bonding is interrupted, so-called blank bonding will occur, resulting in a large number of bonding defects.
そこで、ワイヤ毎に断線検出を行うことが考えられ、そ
の中にはワイヤクランパの電位を検出する方式あるいは
放電トーチを用いる場合に放電の有無を検出する方式が
考えられる。Therefore, it is possible to detect disconnection for each wire, including a method of detecting the potential of a wire clamper or a method of detecting the presence or absence of discharge when a discharge torch is used.
しかし、ワイヤ毎の断線検出を行う場合にも。However, also when detecting disconnection for each wire.
断線検出を何らかの理由で誤ったとすれば、空打ちによ
り未配線不良が多量に発生し１作業者が気付くまで不良
の発見ができないという問題があることを本発明者は見
い出した。The present inventor has found that if disconnection detection is erroneous for some reason, a large number of unwired defects will occur due to blank firing, and the defects will not be discovered until one operator notices them.
特に、ワイヤボンダーに放電トーチを用いる場合にはそ
のための電源が必要となるが、その場合に７オトカプラ
罠直接放電電流を流すことも考えられるが、７オトカプ
ラに流れる電流は発光ダイオード側でたとえば数十ｍＡ
の小さい電流に制限されるという問題があることを本発
明者は見い出した。In particular, when a discharge torch is used in the wire bonder, a power source is required.In that case, it may be possible to flow the discharge current directly into the 7-oto coupler trap, but the current flowing through the 7-oto coupler is connected to the light-emitting diode side, for example. 10mA
The inventor has discovered that there is a problem in that the current is limited to a small current.
本発明の目的は、［光検出範囲の大きい断線検出装置を
提供することにある。An object of the present invention is to provide a disconnection detection device with a large photodetection range.
本発明の前記ならびにその他の目的と新規な特徴は、本
明細書の記述および添付図面から明らかになるであろう
。The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.
本願において開示される発明のうち代表的なものの概要
を簡単に説明すれば、次の通りである。A brief overview of typical inventions disclosed in this application is as follows.
すなわち、放電電流を分流できる分流手段を設け、断線
検出手段へ規格以上の電流が流れないようにすることに
より、広範囲な放電電流に対応して断線の検出が可能な
技術を提供することができる。That is, by providing a shunting means that can shunt the discharge current and preventing a current exceeding the standard from flowing to the wire breakage detection means, it is possible to provide a technology that can detect wire breakage in response to a wide range of discharge currents. .
〔実施例〕
図は本発明の一実施例である断線検出装置の説明図であ
る。[Embodiment] The figure is an explanatory diagram of a disconnection detection device which is an embodiment of the present invention.
こノ実施例において、ワイヤボンダーによりペレットの
電極部とリードフレームのインナーリード部等との間に
ボンディングされるワイヤ１はキャピラリー２に挿通さ
れて供給され、その下端は電極３に接近し、両者間で放
電電流を生じる。In this embodiment, a wire 1 to be bonded between an electrode part of a pellet and an inner lead part of a lead frame by a wire bonder is inserted through a capillary 2, and its lower end approaches an electrode 3, so that both A discharge current is generated between the two.
このワイヤボンダーの放電電流を検出することによりワ
イヤの断線検出を行うため、本実施例では、断線検出手
段として、抵抗ｒ１と、フォトカプラ４と、このフォト
カプラ４への電流を分流する可変抵抗形の外付抵抗Ｒと
、抵抗ｒ２と、コンデンサＣと、電源５と、抵抗ｒ、と
、フォトカプラ４の出力を増巾する増巾器６とが設けら
れている。In order to detect wire breakage by detecting the discharge current of the wire bonder, in this embodiment, the breakage detection means includes a resistor r1, a photocoupler 4, and a variable resistor that shunts the current to the photocoupler 4. A shaped external resistor R, a resistor r2, a capacitor C, a power supply 5, a resistor r, and an amplifier 6 for amplifying the output of the photocoupler 4 are provided.
次に、本実施例の作用について説明する。Next, the operation of this embodiment will be explained.
ワイヤ１と電極３との間でスパークすると放電電流Ｉが
流れ、フォトカプラ４には電流■１が流れ、一方外付抵
抗Ｒにも電流■２が分流される。When a spark occurs between the wire 1 and the electrode 3, a discharge current I flows, a current 1 flows through the photocoupler 4, and a current 2 is also shunted to the external resistor R.
フォトカプラ４のトランジスタは電Ｋ Ｉ ＋が流れる
とＯＮ状態になり、ハイレベルを出力する。The transistor of the photocoupler 4 is turned on when the current K I + flows, and outputs a high level.
したがって１本実施例にお（・ては、放電により大きい
放電電流が流れても、その電流は外付抵抗Ｒにより分流
させられるので、フォトカプラ４には規格値以下の電流
しか流れず、フォトカプラ４の破壊は防止される。Therefore, in this embodiment, even if a large discharge current flows due to discharge, the current is shunted by the external resistor R, so only a current below the standard value flows through the photocoupler 4, and the photo Destruction of the coupler 4 is prevented.
特に、外付抵抗Ｒは可変であるので、その抵抗値の調整
により放電電流の大小を同じフォトカプラで広範囲に検
出できる。In particular, since the external resistor R is variable, the magnitude of the discharge current can be detected over a wide range with the same photocoupler by adjusting its resistance value.
（１）断線検出手段への電流を分流する分流手段を備え
てなることにより、断線検出手段への電流を所定値以内
に抑制でき、大電流から小電流まで広範囲の電流を検出
し、確実な断線検出が可能である。(1) By being equipped with a shunting means that shunts the current to the disconnection detection means, the current to the disconnection detection means can be suppressed within a predetermined value, and a wide range of current from large currents to small currents can be detected, ensuring reliable Disconnection detection is possible.
（２）断線検出手段をフォトカプラとすることにより、
さらに正確な断線検出を行うことができ、しかもその破
壊を防止できる。(2) By using a photocoupler as the disconnection detection means,
Furthermore, it is possible to detect wire breakage more accurately and prevent its destruction.
（３）分流手段が外付可変抵抗であることにより、その
抵抗値を調整することによって放電電流の大小を同じ断
線検出素子で広範囲に検出できる。(3) Since the shunt means is an external variable resistor, by adjusting its resistance value, the magnitude of the discharge current can be detected over a wide range with the same disconnection detection element.
（４）断線検出素子の出力をトランジスタやＩＣに直接
接続でき、高圧ライン（放電ライン）とロジックライン
を分離できる。(4) The output of the disconnection detection element can be directly connected to a transistor or IC, and the high voltage line (discharge line) and logic line can be separated.
以下本発明者によってなされた発明を実施例に基づき具
体的に説明したが、本発明は前記実施例に限定されるも
のではなく、その要旨を逸脱しない範囲で種々変更可能
であることはいうまでもない。The invention made by the present inventor has been specifically explained below based on examples, but it goes without saying that the present invention is not limited to the above-mentioned examples and can be modified in various ways without departing from the gist thereof. Nor.
たとえば、断線検出素子としてはフォトカプラ以外にも
、トランジスタ等を使用することもでき、分流手段も可
変の外付抵抗に限定されない。For example, in addition to a photocoupler, a transistor or the like may be used as the disconnection detection element, and the shunting means is not limited to a variable external resistor.
以上の説明では主として本発明者によってなされた発明
をその背景となった利用分野であるワイヤボンダーに適
用した場合について説明したが。In the above description, the invention made by the present inventor was mainly applied to a wire bonder, which is the field of application to which the invention is based.
それに限定されるものではなく、たとえば、それ以外に
も放電トーチ、放電回路を利用した断線検出に適用でき
る。The present invention is not limited to this, and can be applied to, for example, disconnection detection using a discharge torch or a discharge circuit.
図は本発明の一実施例である断線検出装置の回路図であ
る。
１・・・ワイヤ、２・・・キャピラリー、３・・・電極
、４・・・フォトカプラ（断線検出素子）、訃・・電源
、６・・・増巾器、Ｒ・・・可変の外付抵抗（分流手段
）。The figure is a circuit diagram of a disconnection detection device which is an embodiment of the present invention. 1... Wire, 2... Capillary, 3... Electrode, 4... Photocoupler (disconnection detection element), End... Power supply, 6... Amplifier, R... Variable outside Attached resistor (shunting means).
Claims (1)
おいて、ワイヤボンダーの放電電流を検出する断線検出
手段と、この断線検出手段への電流を分流する分流手段
とを備えてなることを特徴とする断線検出装置。 ２、断線検出手段が７オトカプラであることを特徴とす
る特許請求の範囲第１項記載の断線検出装置。 ３、分流手段が可変抵抗であることを特徴とする特許請
求の範囲第１項記載の断線検出装置。[Scope of Claims] 1. A wire breakage detection device in a wire bonder is provided with a wire breakage detection means for detecting a discharge current of the wire bonder, and a shunt means for shunting a current to the wire breakage detection means. Characteristic disconnection detection device. 2. The wire breakage detection device according to claim 1, wherein the wire breakage detection means is a 7-oto coupler. 3. A wire breakage detection device according to claim 1, wherein the shunt means is a variable resistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59015206A JPS60161626A (en) | 1984-02-01 | 1984-02-01 | Detector for disconnection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59015206A JPS60161626A (en) | 1984-02-01 | 1984-02-01 | Detector for disconnection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60161626A true JPS60161626A (en) | 1985-08-23 |
Family
ID=11882392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59015206A Pending JPS60161626A (en) | 1984-02-01 | 1984-02-01 | Detector for disconnection |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60161626A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH079136U (en) * | 1993-07-19 | 1995-02-10 | 株式会社レイメイ藤井 | Book stand |
-
1984
- 1984-02-01 JP JP59015206A patent/JPS60161626A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH079136U (en) * | 1993-07-19 | 1995-02-10 | 株式会社レイメイ藤井 | Book stand |
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