JPS6016117B2 - Circuit board with resistor and its manufacturing method - Google Patents

Description

[Detailed description of the invention] The present invention relates to a circuit board with a resistor and a method for manufacturing the same.

Conventionally, circuit boards with built-in resistors are generally provided in the form of a laminate consisting of an electrically insulating layer, a layer of resistor bonded onto this layer, and a highly conductive layer bonded to the resistor. . In addition, when fabricating the desired resistance circuit pattern, in accordance with the shape of the predetermined circuit pattern, an insulating region (all layers on the insulating layer are removed), a resistive region (only the highly conductive layer is removed), and a conductive region. (Normally, a thin film of noble metal such as gold is further plated on top of this highly conductive material without removing each layer.) It is formed by a direct forming method in which body parts and the like are printed through a screen printing plate having a predetermined pattern shape. By the way, resistor materials in this technical field include carbon-based materials, metal oxide-based materials, metal-based materials, and mixtures thereof.

Methods for forming resistor layers from such materials include printing a paste-like material, such as carbon particles mixed with various resin components, and carbonizing various hydrocarbon compounds under various conditions and vapor deposition. A method of vapor-depositing a metal or a binary or more-component alloy, and a method of sputtering are known. However, in the case of printing a paste-like material, it is difficult to control the resistance value itself, and furthermore, the resistance value varies widely over the entire surface of the circuit board, resulting in poor characteristics.

Further, even with methods using vapor deposition and sputtering, it is difficult to control the resistance value, and the equipment is expensive. Therefore,
In recent years, attention has been focused on a method of efficiently and stably manufacturing resistor layers inexpensively and over a large area by plating.

For example, Jibatsu No. 48-173762 describes a method of manufacturing a resistor made of a nickel-phosphorus alloy by electroplating.
Additionally, Tokukankai No. 50-71513 proposes a method of forming resistor layers made of various binary alloys other than those mentioned above by electroplating. However, it has been found that the above-mentioned alloys have many drawbacks in terms of properties and workability as intended resistor materials. Generally, in a circuit board made of such a metal thin film resistor,
By reducing the thickness of these films, a resistor having a sheet resistance value suitable for the purpose can be obtained.

However, as the metal film becomes thinner, it becomes difficult to obtain microscopic uniformity of the metal film itself, and there is a natural limit to the thickness. For example, the sheet resistance value of the above-mentioned nickel-phosphorus alloy that can be used industrially is usually less than 1000/unit, and it is difficult to obtain one having an even higher sheet resistance value. Moreover, there are serious defects even during the subtractive processing process. In the subtractive method, first, a photoresist is applied to the entire surface of the steel foil (highly conductive material) of the circuit board.

Next, the resist is exposed to light through a photomask such that the resist remains on the intended resistive portions and conductive portions, and then developed. In order to form an insulating region, unnecessary copper and resistor layers are sequentially etched away using respective dedicated etching solutions. Subsequently, the film is exposed to light through a photomask that leaves only the conductor portion, and then developed. By etching away the exposed copper foil (forming a resistance region), the intended circuit board (however, the resist remains in the conductor region) can be obtained. In the above process, when the copper foil in the portion corresponding to the resistor pattern area is removed by etching, it is essential that the material of the resistor is stable to the etching solution and hardly etched.

However, it was discovered that the resistor made of the above-mentioned nickel-phosphorus alloy had poor etching selectivity with the copper foil, and the resistor was also partially etched when the copper foil was etched, resulting in a significant increase in resistance value. . In other words, it has the disadvantage that the intended setting value does not directly correspond to the resistance value after processing/processing. In addition, the above-mentioned hakama Kaisho 50-171513
The various binary alloys shown in the publication were proposed because they would generally provide higher resistance values than single metal plating films, but they have not yet been industrially adopted for the following reasons. Not yet reached. In other words, there is a problem in that it is difficult to balance the increase in resistance value due to the thinning of the film with various properties such as etching selectivity, and it is also difficult to stably produce an alloy plating film with a constant composition without variation in resistance value from conventional plating methods. This is because the problem is extremely difficult. In view of these circumstances, the applicant has already devised a tin-nickel alloy as a resistor material different from the alloys proposed above.

According to this alloy, it is possible to make the film thinner than the above-mentioned proposal, and it is possible to obtain a sheet resistance value of about 300 to 4000/hole, and it also has good etching selectivity, and when formed by electroplating. It was found that it had excellent uniform electrodeposition properties, and was developed. The inventors
In continuing research on resistor materials made of the tin-nickel alloy, it was discovered that a circuit board with a higher sheet resistance value could be obtained by further incorporating sulfur into the tin-nickel alloy, which led to the completion of this invention. . That is, the present invention provides a circuit board having a structure in which a highly conductive material is bonded to at least one side of an electrically insulating layer via a resistor layer, in which the resistor is made of a ternary alloy of tin-nickel-di-sulfur. The present invention relates to a characteristic circuit board with a resistor.

According to the above-mentioned ternary alloy of the present invention, in addition to obtaining good etching selectivity and excellent uniform electrodeposition during electroplating as in the case of the tin-nickel alloy, it is also possible to obtain circuit boards with extremely high sheet resistance values. It can be manufactured easily and with good stability. For example, in the case of the above-mentioned tin-nickel alloy, if the sheet resistance value is about 1000/mouth, the film thickness should be reduced to several hundred △ or less, or about 300 to 400
For products with a thickness of about 0/mouth, it had to be made even thinner than the above.

On the other hand, according to the ternary alloy of the present invention, by simply setting the content of sulfur atoms in the alloy appropriately, the thickness of the film can be reduced to 5000 to 200 to 300A or more even with a thickness of several thousand A without making the thickness very thin. It becomes possible to obtain a sheet resistance value of about /□. On the other hand, if the film thickness is made thinner, the above-mentioned sheet resistance value generally becomes larger, and a sheet resistance value of up to about 1 piQ'□ can be easily and stably obtained. Furthermore, the circuit board of the present invention has excellent resistance stability by using the above-mentioned ternary alloy as the resistor material, and the rate of change in resistance value when left at high temperature or under high temperature is 4. Also from this point of view, there is an advantage that a highly reliable circuit board can be provided.

At present, it is not necessarily clear why the resistor made of the ternary alloy of the present invention is able to produce the above-mentioned effects.

It is speculated that this is due to the refinement of the crystal grains of the above-mentioned alloy and the change in the crystal structure due to the inclusion of sulfur atoms as a non-metallic component. Copper foil is the most common highly conductive material used in this invention, but other conventionally known materials such as nickel foil, tin-plated steel foil, and zinc foil can be widely used.

Further, the manufacturing method of these highly conductive materials is not particularly limited, and materials manufactured by various methods can be applied. The layer of the resistor made of the ternary alloy in the present invention is generally formed on the high conductive material by electroplating, and the alloy composition includes 30 to 85% tin in the total amount of tin and nickel. % by weight, preferably from 35 to 8 % by weight
and 70-15% by weight of nickel, preferably 65-2% by weight of nickel, relative to the parenthetical nickel content.
Relative intensity ratio measured from 5 to 70%, preferably from 10 to 6
It is desirable that it contains sulfur in the range of 0%.

If the nickel and tin contents deviate from the above range,
The sheet resistance value of the circuit board is not sufficiently high, making it difficult to obtain good results in terms of circuit characteristics. Furthermore, if the sulfur concentration is too low, the sheet resistance value will not be so high, and if it is too high, good results will not be obtained in terms of circuit characteristics, particularly in terms of long-term moisture resistance. Note that the ESCA measurement described in this specification refers to ElectronSpectrosCopyf
It is an abbreviation that stands for orChemicalAnal$is (electron spectroscopy for chemical analysis), and it is actually d
uPont - Shimadzu's X-ray photoelectron spectrometer ESC
The X-rays were actually measured by measuring the photoelectron spectrum using MgKQ rays using the A65 ship.

Furthermore, in this actual measurement, the highly conductive material of the circuit board was removed by etching to expose the resistor layer, and the photoelectron spectrum was measured from this exposed surface side. This type of ESCA measurement is often used to express the relative content of a specific metal by its relative strength. The formation of the layer of the resistor by electroplating uses a plating solution containing potassium pyrophosphate, a sulfur-containing amino acid or a salt thereof, and preferably a Q-amino acid or a salt thereof, together with a tin salt and a nickel salt. A layer of a resistor is electrodeposited on a highly conductive material by electroplating from a liquid.

Examples of the above-mentioned tin salts include stannous chloride, stannous pyrophosphate, stannous sulfate, etc., and each can be used alone or in a mixture of two or more.

Usage amount is 2 to 50 evenings/night, preferably 3 to 4 in terms of metal.
0 evening/sleeves. Further, examples of the nickel salt include nickel chloride, nickel pyrophosphate, and nickel sulfamate, and each can be used alone or in a mixture of two or more. The amount used is 1.5 to 25 evenings per day, more preferably 3 to 20 nights per day in terms of metal. Potassium pyrophosphate is used to dissolve tin and nickel salts as pyrophosphate salts, and its addition amount should be in the range of 100 to 400 m/s, considering the total amount of tin and nickel salts added above. preferable. Sulfur-containing amino acids or their salts are used to contain sulfur atoms in the alloy plating film, and include cysteine, homocysteine, cysteine hydrochloride, thiol/histidine, glutathione, homocysteine/thiolactan hydrochloride, cystathionine, methionine, Examples include ethionine, cystine, homocystine, cystine disulfoxide, cystic acid, etc.
Each can be used alone or in a mixed system of two or more.

The amount used is 0.05 evening/more than saturated concentration,
Preferably it is 0.1 to 15 days/sleeve. Furthermore, examples of the Q-amino acid that may be added as necessary include guIJ sine, histidine hydrochloride, phenylalanine, leucine, aspartic acid, and glutamic acid.

The amount added is in the range of 0 to 50 times per month, preferably 5 to 30 times per day, and each can be used alone or in a mixture of two or more types. In order to improve plating efficiency, characteristic values, etc., suitable amounts of hydrochloric acid, sulfuric acid, sulfamic acid, pyrophosphoric acid, aqueous ammonia, potassium hydroxide, etc. can be added as bait conditioners for plating. In electroplating using the above plating solution, the plating temperature is in the range of 20 to 60 oo, and the plating current density is 0.01 A/d or more.
It is preferable to perform the final plating at a total plating electricity amount of 5 to 1000 coulombs/d.

Particularly preferably, in consideration of plating workability and cost issues, the plating current density is 0.05 to 0.05, as shown in FIG.
5. Ship/dwa, plating electricity amount is 10 to 400 coulombs/
The dth range is better. If the finalizing bath temperature is not appropriate or the current density is too low, the stability of the plating rating will be impaired, causing variations in the resistance value of the resulting resistor and deterioration of various characteristic values. As the material used as the anode, any of insoluble electrodes such as a carbode, platinum-coated titanium electrode, and stainless steel electrode, and soluble electrodes such as a nickel electrode and a nickel-tin alloy electrode can be used. After forming the resistor layer in this manner, an electrically insulating layer is further provided on this layer by a conventional method to obtain a circuit board with a resistor, which is the object of the present invention.

Epoxy resin and other thermosetting resins are suitably used as the material for forming the electrical insulating layer, and these resins can be used as a glass material. Prepreg is used, which is impregnated with carbon fiber and other fibers. By heat-pressing (curing) these materials onto the resistor layer, the electrical properties can be improved.
It can be made into an insulating layer with excellent heat resistance. As described above, according to the present invention, as the manufacturing method of the industrially useful circuit board, the tin salt and the tin salt and the tin salt and 1.
5 to 25 evenings/with its nickel salt, 100 to 400 ta' of potassium pyrophosphate, 0.05 evening/more than sulfur-containing amino acid or its salt up to saturation concentration and 0 to 50 evening/
Provided is a method for manufacturing a circuit board with a resistor, which uses a plating solution containing the Q-amino acid or its salt, and forms a resistor layer on a highly conductive material by electroplating the plating solution. It is possible.

FIG. 1 shows a process diagram for manufacturing a circuit board from the circuit board of the present invention obtained as described above, and this manufacturing process is not particularly different from the conventional circuit board.

That is, first, in step (3), a photoresist 4 is formed on the high conductivity body 1 of the circuit board having a structure in which the high conductivity body 1 is bonded to one side of the electrical insulation layer 3 via the resistor layer 2, and then the photoresist 4 is formed on the high conductivity body 1. In step {B}, the film is exposed to light through a photomask and developed to form a predetermined pattern.

Thereafter, in step 'C}, nickel plating 5 and gold plating 6 are applied to the resist-removed portions to form a plurality of one-to-two electrodes 7. Then, in step (2), the photoresist 4 between the electrodes 7, 7 is exposed again through a photomask and developed. Continue with the above ■ in the 'E} process.
The highly conductive material 1 and the resistive material layer 2 exposed in the portion where the resist is removed in the process are etched away to expose the electrical insulating layer 3. Furthermore, in the 'F' step, the photoresist 4 between the electrodes 7, 7 is removed, and the exposed high conductor 1 is (
G) Remove by etching in step. Thus electrode 7
, 7 is left as a resistive element, and a protective film 8 is formed thereon in step (H) to produce a circuit board. As detailed above, one of the major features of the circuit board with resistors of the present invention is that resistors having a high area resistance value of 1000 to 1000/unit or more can be freely used with any film thickness. The object of the present invention is to provide a circuit board that can be formed, has good heat resistance, wire resistance, etc., and has excellent reliability of resistors. In particular, it was difficult to obtain a resistance of 4000/□ or more, preferably 500 to 300, which was difficult to obtain with the resistor layer made of tin-nickel alloy that this worldly person proposed earlier.
There is an advantage that a circuit board having a sheet resistance value of 0.00/unit and excellent resistance stability can be manufactured with stable quality. EXAMPLES Below, examples of the present invention will be described in more detail. Note that this invention is not limited only to the following examples. Example 1 After cutting 35R thick electrolytic steel foil into a size of 20mm x 20mm, an adhesive protection sheet for masking was crimped onto the entire surface of the drum side during the production of the steel foil (roll shape), and this was It was immersed in a cleaning solution (an aqueous solution diluted at a ratio of 1 volume of NutraClean 68 manufactured by Shipley Co., Ltd. to 1 volume of water) at room temperature for 3 minutes.

Thereafter, it was washed with running water, and further washed with deionized water. Next, it was immersed for 2 minutes in an aqueous solution consisting of 200 parts of ammonium persulfate and 10 parts of concentrated sulfuric acid (hereinafter simply referred to as ammonium persulfate treatment solution), and immediately after washing with water, the current density was 0. A layer of a resistor was formed by plating a tin alloy of Matsu/d at a constant temperature of 25 oo for a predetermined period of time. The following bath composition was used for plating. Stannous chloride (SnC12・Group 20
) 30 evenings/nickel chloride (NiC12/mother LO) 30 evenings/potassium pyrophosphate (KP
207) 200 polyglycine (NH21CH
2COOH) 20T'Z cysteine hydrochloride (
HSCH2CH (NH2) COO day. HC1/day 20)
1.5 pm/Then, after peeling off the protective sheet on one side of the copper foil, on the resistor layer,
A circuit board with a resistor was obtained by laminating epoxy resin-impregnated glass cloth (commonly known as prepreg) and heat cross-bonding using a laminating press. Using the circuit board in which the plating time for forming the resistor in Example 1 was set at 15 minutes, the composition of the ternary alloy constituting the resistor was investigated by the following method. The results were as shown in Table 1. <Measurement of alloy composition> The entire surface of the copper foil of the test board was coated with Nutra Etch V1 (copper etching solution manufactured by Shipley; 50:00, pH = 7.6).
~7.8) to remove it by etching.

After thorough washing with water, two skin corners were cut from the central part, washed thoroughly with water again, and dried to prepare a sample for ESCA measurement.The sulfur concentration contained in the alloy was measured as a relative strength to the nickel atoms contained. On the other hand, after thoroughly washing the remaining part of the sample with water again, add 30% of concentrated nitric acid and 70% of deionized water.
The tin and nickel concentrations were measured by atomic absorption spectrophotometry after complete dissolution using a dissolving solution made from a mechanical solution. Table 1 Next, in the above Example 1, the plating time was 30~
Circuit boards were produced by the following method using various substrates obtained by setting 25 sand spaces.

The results of examining the heat resistance and vertical resistance of this circuit board (which had a predetermined resistance value by setting the plating time) were as shown in Table 2 below. In addition, heat resistance is the resistance change rate (%) when left at 100℃ for 10 hours.
40℃, 90%R
The figure shows the rate of change in resistance (%) when left under H for 10 feeding hours. Further, the results of examining the correlation between the average resistance value of the entire board surface of the circuit board and the surface distribution (range of variation) of the resistance value and the plating time were as shown in FIG. 2.

<Production of circuit board with resistor> The circuit board with resistor was immersed in the above-mentioned cleaning solution for 3 minutes, then washed with water and dried.

After that, AZ-111 (positive photoresist manufactured by Shipley) was dipped at a pulling speed of 5 to 10 minutes.
A photoresist film was formed on the surface of the copper foil by coating and drying by heating at 80 qo for two nights. Next, the photolgist film was irradiated with an integrated light amount of 45 hi/by an ultra-high pressure mercury lamp (HMW-N6-3 manufactured by Oak Seisakusho Co., Ltd., irradiation distance: 6 & average) of shoes W, and a large number of resistors were A predetermined pattern for applying nickel plating and gold plating to each electrode portion of the device was formed.

After that, it was developed for 3 minutes at room temperature using AZ-303 (an alkaline developer manufactured by Shipley) to remove the photoresist film on each of the electrodes, and then washed with running water and deionized water for 30-6 minutes. did. Thereafter, it was treated with the above-mentioned ammonium persulfate treatment solution at room temperature for 3 cycles, and then washed with water.
Nickel plating is applied to this removed part under the conditions of 2A/d〆, 5030, and 6 minutes, and then 0.
．． After gold plating was performed under the conditions of 05 A/d, 40 qo, and 2 minutes, it was washed with water and dried to form a plurality of one-to-two electrodes. Next, the photoresist film of each resistive element portion is exposed to light using the exposure device under the same conditions as described above through a photo mask that leaves the photoresist film on each resistor element portion, and then the same development and water washing treatment as described above is performed. The photoresist film other than the resistor element portion was removed.

After that, Nutra Etch V1 (copper etching solution manufactured by Shippray Co., Ltd.; 50 qo, pH = 7.6-7.8)
The electrolytic steel foil exposed in the removed portion was etched away. After washing with water, 335 ml of concentrated sulfuric acid, 15 ml of concentrated nitric acid, 50 ml of concentrated hydrochloric acid, 10 ml of hydrogen peroxide, and 5 ml of deionized water.
The layer of the resistor exposed in the area where the copper foil was removed was etched away using an etchant made of zero core. Subsequently, the photoresist film remaining on each resistor element portion was removed using acetone at room temperature with 10 to 2 sand, and then the copper foil exposed in this removed portion was etched with the same etching solution (Nutra Etch VI) as described above. The etching process was performed, the film was thoroughly washed with water, and then dried.

In this way, the layer of each resistor that connects one pair of two electrodes is exposed, and this exposed resistor is used as a resistor element, and solder resist tint is screen printed on this element and a part of the electrode part near this element. It was applied by. By heating and curing this under predetermined conditions, the intended circuit board with a resistor was created. Table 2 Comparative Example 1 Same as Example 1 except that cysteine hydrochloride was not added to the resistor plating solution and the plating conditions were 0.5 A/d〆, 2500, and 4 to 3 current stages. A circuit board with a resistor was made in exactly the same way.

Alloy composition of the resistor of this board (sunama at plating time 15)
are also listed in Table 1 above. Furthermore, a circuit board was made from this board in the same manner as in Example 1, and the relationship between the plating time and the resistance value of each circuit obtained was determined. The results are shown in Figure 3, and the resistance values are
It was found that 300Q'□ was the limit. Further, as a characteristic test, heat resistance and moisture resistance tests similar to those in Example 1 were conducted, and the results were as shown in Table 2 above. Example 2 The process was carried out in exactly the same manner as in Example 1, except that glycine was not added and cystine 2.0/cystine was added instead of cysteine hydrochloride as the plating solution for the resistor. A circuit board with a resistor was fabricated.

The alloy composition of the resistor of this board was investigated in the same manner as in Example 1, and the results were 70.2% by weight of tin and 29.8% by weight of nickel, and the iodine content was 19% by weight relative to nickel in ESCA measurement. It was .2%. Next, a circuit board was prepared from the above substrate in the same manner as in Example 1, and the relationship between the resistance value of this circuit board and the plating time was investigated, and the results were as shown in FIG.

Further, the heat resistance and moisture resistance were investigated in the same manner as above, and the results were as shown in Table 3 below. Table 3 Examples 3 to 6 As a plating solution for resistor alloy plating, as shown in Table 4 below, stannous chloride was used in a range of 6 to 45 m/m and nickel chloride was added in a range of 15 to 54 m/m. Moreover, the sum of both is 60
A circuit board with a resistor was prepared in exactly the same manner as in Example 1, except that a plating solution adjusted to be resistant to heat was used, and 1.1 μl/ml of homocystine was added instead of cysteine hydrochloride. .

The alloy composition of this board was investigated in the same manner as above, and the results of a characteristic test on a circuit board made from the above board and having a resistance value of approximately 4500' are shown in Table 4 below. It was as shown in Table 4 Comparative Example 2 Completely the same as Example 4, except that the plating solution for resistor plating was one in which nickel chloride was added for 6 days/day and stannous chloride was added for 54 times. A circuit board with a resistor was fabricated using the same method.

The alloy composition of this substrate is also listed in Table 4 above. Further, a circuit board was obtained from this board in the same manner as described above, and the plating time (8~
The relationship between the resistance value of the obtained circuit board and the resistance value of the obtained circuit board was determined. As shown in Figure 5, the result is a resistance value of 1000'.
It was very low, less than a mouthful. For reference, the resistance value is 600/
The results of examining the heat resistance and bubble resistance of the mouthpieces are also listed in Table 4 above. Comparative Example 3 Except for using a plating solution for resistor plating in which stannous chloride was not added and nickel chloride was added at 60/Z.
Plating of a resistor was carried out in exactly the same manner as in Example 4.

However, at 0.5 A/d, there was almost no plating after 5 minutes of plating, and only a blackish appearance was observed, which is thought to be the cause of discoloration. For reference, only the alloy composition of the resistor obtained by long-term plating is also listed in Table 4 above. Example
7-10 Circuit boards with resistors were obtained in the same manner as in Example 1, except that the plating solution shown in Table 5 below was used as the plating solution for resistor alloy plating.

The results of investigating the alloy composition of this board, and of conducting a characteristic test on a circuit board made from this board with a resistance value of approximately 6000/unit, are as shown in Table 5 below. Ta. Table 5 Examples 11 to 15 Except that the plating solution for the resistor alloy was one containing 0.1 to 12 hours of cysteine instead of cysteine hydrochloride, and the plating time was 100 seconds. Example 1
A circuit board with a resistor was fabricated in the same manner as above.

The results of examining the alloy composition of this substrate and the heat resistance and moisture resistance of a circuit board made from this substrate are as shown in Table 6 below. Further, FIG. 6 illustrates the relationship between the amount of cystine added and the sheet resistance value. Table 6 Examples 16 to 19 The same procedure as Example 1 was carried out except that various sulfur-containing amino acids shown in Table 7 below were used instead of cysteine hydrochloride as the plating solution for resistor alloy plating. A circuit board with a resistor was fabricated.

The results of investigating the alloy composition of this X substrate, as well as the results of investigating the heat resistance and moisture resistance of a circuit board made from this substrate and having a resistance value of approximately 5000', are listed in Table 7. It was as expected. Table 7 Examples 20 to 24 The plating conditions were set to 0.1 to 24 as shown in Table 8 below.
A circuit board with a resistor was produced in exactly the same manner as in Example 13, except that the thickness was 2.5 A'd and 30 to 6,000.

Table 8 shows the results of investigating the alloy composition of this board, and the heat resistance and green resistance of a circuit board made from this board with a resistance value of approximately 8000/piece. Met. Table 8

[Brief explanation of drawings]

- Figures 1A-1 are process diagrams for forming a predetermined circuit board from the circuit board with a resistor of the present invention, and Figures 2, 4, and 6 are diagrams of the circuit board with a resistor of the present invention. Characteristic diagrams showing the performance, Figures 3 and 5 are characteristic diagrams showing the performance of a circuit board with a resistor different from the present invention, and Figure 7 shows the formation of the resistor layer in the circuit board with a resistor of the present invention. FIG. 3 is an explanatory diagram showing a range of suitable plating conditions for the purpose of the present invention. 1... High conductor, 2... Resistor layer,
3... Electrical insulation layer. Figure 1 Figure 2 Figure 3 Figure 5 Figure 6 Figure 7

Claims (1)

[Scope of Claims] 1. A circuit board having a structure in which a highly conductive material is bonded to at least one side of an electrically insulating layer via a resistor layer, wherein the resistor is made of a ternary alloy of tin-nickel-sulfur. A circuit board with a resistor featuring the following. 2 The ternary alloy contains 30 to 30 tin in the total amount of tin and nickel.
85% by weight and 70-15% by weight of nickel,
The circuit board with a resistor according to claim 1, which contains sulfur in a relative intensity ratio of 5 to 70% based on ESCA measurement with respect to the nickel contained therein. 3. When manufacturing a circuit board having a structure in which a highly conductive material is bonded to at least one side of an electrically insulating layer via a resistor layer,
2 to 50 g/l of tin salt and 1.5 to 25 g/l of metal equivalent
nickel salt, 100 to 400 g/l of potassium pyrophosphate, 0.05 g/l or more of a saturated amino acid or its salt, and 0 to 50 g/l of α-amino acid or its salt. A method for producing a circuit board with a resistor, characterized in that a layer of a resistor is formed on a highly conductive material by electroplating from this plating solution.