JPS60154592A - Circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a circuit board, and in particular to an L8I having a multi-electrode structure for wireless bonding, or a circuit equipped with mounting electrodes for mounting electronic components such as ICs. Regarding the board.

(Prior art) A board material for printed wiring has a predetermined printed wiring board terminal structure, and a terminal structure for mounting electronic components, which is electrically connected to the printed wiring in a predetermined manner, is formed or attached. Installing electronic parts.

Most of the electronic component mounting mentioned above are semiconductor electronic components,
That is, it is dominated by semiconductor electronic components such as ICs, M8Is, and LSIs, and it is well known that the usage rate of LSIs has been increasing in recent years.

As the degree of integration of semiconductor electronic components used in this way has increased significantly and the functions included have become more complex, the terminal structure of semiconductor electronic components necessary for transmitting and receiving input/output signals and power supply voltages, etc. The number of electrodes in an electrode structure is also increasing significantly, from ICs with a few IO to around 20 electrodes, to semiconductor electronic components with a few dozen electrodes, and even hundreds of electrodes. The number of electrodes in LSI semiconductor electronic components is increasing significantly. In order to provide up to 100 of these electrodes on semiconductor electronic components, a large number of protruding electrodes (bumps) are required.
), etc. to form an electrode structure, and it is well known that wireless bonding is used in which bumps and the like are directly connected to a conductor layer of a substrate.

In an electrode structure constructed using such wireless bonding, a large number of electrodes, such as bump ore, hemispherically raised gold or copper, are used.

These bumps range from about 10 to 20 to 30 in the vertical and horizontal directions.
The electrode structure of a semiconductor electronic component has several hundred bumps, which are formed to a certain degree.

A mounting electrode with the same number of electrodes facing and contacting each of the electrode poles by such wireless bonding is pre-attached or formed into a part of the circuit board itself, and these two IE & structures are usually Attached lines are connected by process.

FIGS. 1(2) and 1 are respectively a perspective view of a semiconductor electronic component having a bump electrode structure and a perspective view of a circuit board having a mounting electrode structure.

In FIG. 1(2), bumps 101 formed for the above-mentioned wireless bonding are arranged on one side of the semiconductor electronic component 1 in the vertical and horizontal directions.

Further, the circuit board 2 shown in FIG. 10 is formed with mounting electrodes 3 for mounting the semiconductor electronic component 1 shown in FIG. An electrode 301 formed in %
The poles 301 are connected to other semiconductor electronic components, circuits, etc. mounted on the circuit board via printed wiring buttons (not shown).

To connect the bump 101 to the electrode 301,
The semiconductor electronic component 1 is placed on the connecting portion 3001 of the semiconductor electronic component 1, which has been previously bonded with solder by dipping in a solder bath or the like, and is then aligned and faced.・1 Then, while the soldered electrode 301 and the pan ft01 are in opposing contact, the environmental temperature is raised to a degree slightly exceeding the melting point of the solder, for example, about 200 degrees Celsius, and soldering is performed. ing.

For such wireless bonding, the electrode structure is suitable for wire bonding, and compared to other structures, it is possible to form a large number of vL poles at the same time, and the workability in electrode formation is good, as well as reliability. Although it has the characteristics of
When soldering semiconductor electronic components and circuit boards, the mounting state cannot be seen from the outside, so the only way to check whether the connection is good or bad is to conduct a wiring inspection using an electrical inspection after all electronic components are mounted on the circuit board and the circuit is completed. However, there is a disadvantage that finding defects and making repairs becomes extremely inefficient.

(Objective of the Invention) An object of the present invention is to eliminate the above-mentioned drawbacks, and to provide a circuit board having mounting electrodes for mounting semiconductor electronic components having a wireless bonding electrode structure, in which a plurality of electrodes constituting the mounting electrodes are provided. By dividing and forming sub-electrodes, it is possible to constantly check the connection status even when semiconductor electronic components are mounted one after the other, and the efficiency of wiring inspection can be significantly improved. Our goal is to provide circuit boards.

(Structure of the Invention) The circuit board of the present invention is a circuit board provided with a mounting electrode for mounting an electronic component having a wireless bonding electrode structure, in which the mounting electrode corresponding to the electrode of the electronic component is connected to a plurality of sub-electrodes. It is constructed by dividing and forming.

(Example of the invention) Next, the present invention will be described in detail with reference to the drawings.

FIG. 2 is a top view showing an embodiment of the present invention.

The circuit board 2' shown in FIG. 2 includes two mounting electrodes 3', and these two mounting electrodes 3' allow semiconductor electronic components having bump-type electrodes to be mounted thereon. . In this embodiment, the number of mounting electrodes 3' to be used is two, but this number may be one or any number may be set. It can be arbitrarily set as desired depending on the contents of the information, etc.

Now, each of the two mounting electrodes 3' has N electrodes 301' in the vertical and horizontal directions, so each has a structure having N2 electrodes in total, and these electrodes 301' Each sub-electrode is divided into two, and one of these sub-electrodes has a check pattern 5 and 1j!, respectively. Continued. For example, in FIG. 2, a pair of electrodes 301' are connected to one sub-electrode by the circuit pattern 4, and the other sub-electrodes are also connected to the check pattern 5, making them conductive to the check terminals a and b. Regarding the other electrodes 301' constituting the mounting electrode 3', to which the circuit pattern 4 is connected, the connection is made so that one of the sub-electrodes is always connected to the corresponding circuit pattern 4 or check pattern 5. , through which you can check the connection status.

The mounting electrode 301', in which each electrode is divided into two sub-electrodes, is connected to the semiconductor electronic component 1 to be connected by the same connection method as explained with reference to FIG.
The electrode 101 and solder are connected.

FIG. 3 is a side view showing the connection state of the semiconductor electronic component 1 on the circuit board of the present invention shown in FIG.

The electrodes 301' of the two mounting electrodes 3' provided on the circuit board 2' have two sub-electrodes each connected to the circuit pattern 4.
and the check pattern 5, whereas the electrode 10 of the semiconductor electronic component 1 having a bump electrode structure
1 with soldering indicates a connected state. As is clear from FIG. 3, it is impossible to visually check the condition of the soldered electrode portions. This problem of not being able to be visually confirmed occurs in the same way whether the mounting electrode is a sub-electrode as in the present invention or a single electrode as in the past, but the circuit board according to the present invention is This problem is solved as follows by using the mounting 1 electrode 3', the circuit pattern 4, and the check pattern 5.

FIG. 4 is a Y-direction view of the electrode connection portion in FIG. 3.

One of the electrodes 101 of the semiconductor electronic component 1 is soldered to an electrode 301' consisting of two sub-electrodes as shown in FIG. ing. Similarly, the second
Other mounting electrode 3' connected to check terminal a shown in the figure
The state of connection between the two electrodes 301' connected via the circuit pattern 4 can be easily determined by checking the conductivity between the two electrodes 301'. Regarding the other electrodes 301', by using one of the sub-electrodes and the check pattern 5, it is possible to easily check the connection state of each electrode 301' by checking the connected check terminals.

Note that, in general, the above-mentioned check pattern 5 is not necessarily necessary, and it is clear that this becomes unnecessary if the connection state can be checked in the same way through the circuit pattern 4 connected to the sub-electrode. be.

Further, in the embodiment of the present invention shown in FIG. 2 described above, two mounting electrodes 301' are formed on the circuit board 2', but the number may be any number. In this embodiment, a case where a semiconductor electronic component 1 having a bump electrode structure is mounted is taken as an example, but this can be carried out in almost the same way for a semiconductor electronic component 1 having an electrode structure by other wireless bonding. This is obvious, and furthermore, in this embodiment, the mounting electrode 3' is divided into two sub-electrodes, but the number of divisions depends on the size of the mounting electrode 3' to be formed on the circuit board 2' and the circuit. It is obvious that any number of shapes that can be selected in consideration of the content etc. can be easily implemented, and it is also obvious that the shape can be arbitrarily selected.

(Effects of the Invention) As explained above, according to the present invention, in a circuit board to which a semiconductor electronic component or the like having a wireless bonding electrode structure is mounted, each of the mounting electrodes for mounting the semiconductor electronic component or the like is By configuring the device by dividing it into a plurality of sub-electrodes and by providing a button that connects to at least one of these sub-electrodes, it is possible to easily check the connection state even when a single semiconductor electronic component is being mounted. This has the effect of slowing down the realization of a circuit board that can significantly improve the efficiency of wiring inspection.

[Brief explanation of drawings]

1(A) and 2 are respectively a perspective view of a semiconductor electronic component having a bump electrode structure and a perspective view of a circuit board having a mounting electrode structure, FIG. 2 is a top view of an embodiment of the present invention, and FIG. The figure is a side view showing the connection state of the semiconductor electronic component in the embodiment of the present invention, and FIG. 4 is a view of the electrode connection portion viewed from the Y arrow in FIG. 3. 1... Semiconductor electronic components, 2.2'...
Circuit board, 3.3'... Mounting electrode, 4...
...Circuit bang, 5...Check button, 10
1,301.301'... Electrode.

Claims (1)

[Claims] A circuit board equipped with a mounting electrode for mounting an electronic component having a wireless bonding electrode structure, characterized in that the mounting electrode corresponding to the electrode of the electronic component is divided into a plurality of sub-electrodes. circuit board.