JPS60154144A - Detecting method of excessive glossy surface body - Google Patents

Detecting method of excessive glossy surface body

Info

Publication number
JPS60154144A
JPS60154144A JP995884A JP995884A JPS60154144A JP S60154144 A JPS60154144 A JP S60154144A JP 995884 A JP995884 A JP 995884A JP 995884 A JP995884 A JP 995884A JP S60154144 A JPS60154144 A JP S60154144A
Authority
JP
Japan
Prior art keywords
solder
glossy surface
surface body
signal processing
presence area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP995884A
Other languages
Japanese (ja)
Inventor
Naohiro Kato
直宏 加藤
Kiyoo Takeyasu
武安 清雄
Takashi Kamiyama
隆 神山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Denshi KK
Original Assignee
Hitachi Denshi KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Denshi KK filed Critical Hitachi Denshi KK
Priority to JP995884A priority Critical patent/JPS60154144A/en
Publication of JPS60154144A publication Critical patent/JPS60154144A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N21/95684Patterns showing highly reflecting parts, e.g. metallic elements

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To detect an unnecessary excessive glossy surface body by extracting only the high reflection component of a glossy surface body from a video signal, calculating the actual presence area of the glossy surface body on the basis of the extracted signal, and comparing the actual presence area with a predetermined presence area of the glossy surface body. CONSTITUTION:An image of the object position on a substrate 6 is picked up by a television camera 9 to supply the obtained video signal to a binary coding circuit 11, which performs binary coding operation on the basis of a threshold level for extracting only the high reflection component from a soldering position 2 and a solder sticking position of a solder bridge 2A, etc., and suplies the binary-coded signal to a signal processing part 12. The signal processing part 12 consists of a processor and various kinds of memory, etc., and the processor executes the program in memory to perform signal processing operation; the position of the solder sticking part is judged and compared with the presence area of the soldering position based upon a predetermined standard pattern to detect the sticking of excessive solder at the solder bridge 2A, etc., and a cathode-ray tube display device 13 is controlled according to the detection result to make a prescribed display.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明は、′はんだ〃付着部位等の光沢面を有する物体
が所足の位置以外に存在することを自動的に検出する方
法に関するものである。
[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a method for automatically detecting the presence of an object with a shiny surface, such as a solder attachment site, at a position other than the desired foot position. .

〔従来技術〕[Prior art]

印刷基板等に対するはんだ付の良否を自動的に検査する
ため、従来は、′はんだI付部位に対して一方向からの
み光線を照射し、テレビジョンカメラによシ対象部位を
撮像のうえ、これによって得られた映像信号を2値化し
、この2@化徊号に基づいて1はんだ“付部位の位置お
よび気はんだ1ブリツジ等の不要な1はんだ“の付着を
検出することが行なわれている。
In order to automatically inspect the quality of soldering on printed circuit boards, etc., the conventional method was to irradiate the soldering area with a beam of light from only one direction, image the target area with a television camera, and then The video signal obtained by the method is binarized, and based on this 2@ conversion signal, the position of the solder 1 spot and the adhesion of unnecessary 1 solder such as air solder bridges are detected. .

しかし、従来の手段では、1はんだ“の付着部位のみな
らず、周辺の導体パターンおよびシルク印刷された記号
等も高反射率であり、これらと1はんだ〃付着部位との
判別が不可能となる一万、2値化信号を得るためのスレ
シ、ホールドレベルを高い値に設足すると、1はんだ〃
付着部位の高反射部のみが単独の点状として抽出され、
%けんだ〃付着部位の存在位置検出が不正確となる欠点
を生じている。
However, with conventional means, not only the area where solder 1 is attached, but also the surrounding conductor patterns and silk-printed symbols have high reflectance, making it impossible to distinguish between these and the area where solder 1 is attached. 10,000, if you set the threshold and hold level to a high value to obtain a binary signal, 1 solder
Only the highly reflective parts of the attachment site are extracted as individual dots,
% Kendade has the drawback that detection of the location of the adhesion site is inaccurate.

また、スリット元またはスポット状ビーム光による走査
照射を用い、対象物体の形状を3次元的に認識する手段
も開発されているが、この場合は、装置が大規模かつ高
価となる欠点を生ずる。
In addition, a means for three-dimensionally recognizing the shape of a target object using scanning irradiation using a slit beam or a spot beam has also been developed, but in this case, the disadvantage is that the apparatus is large-scale and expensive.

〔発明の概要〕[Summary of the invention]

本発明は、従来のか\る欠点を根本的に解決する目的を
有し、光沢面物体およびその周辺へ周囲から光線を照射
して撮像を行ない、これによって得られた映像信号から
、光沢面物体の高反射成分のみを抽出し、抽出した信号
に基づき光沢面物体の実在領域をめたうえ、この実在領
域とあらかじめ定めた光沢面物体の存、孔領域とを比較
し、これの結果に応じて不要な光沢面余剰物体の検出を
行なうものとした極めて効果的な、ブC沢面余剰物体の
検出方法を提供するものである。
The purpose of the present invention is to fundamentally solve the drawbacks of the conventional methods. After extracting only the high-reflectance components of the The present invention provides an extremely effective method for detecting unnecessary glossy surface surplus objects.

〔実施例〕〔Example〕

以下、実施例を示す図によって本発明の詳細な説明する
Hereinafter, the present invention will be explained in detail with reference to figures showing examples.

第1図は、光線の照射状況を示す図であシ、導体からな
るランド1上に形成された気はんだ〃付部位2およびそ
の周辺に対し、周囲の各方向斜上方からa数の光源3a
〜3hにより同時に光線を照射しており、光源3a〜3
hとして白熱電球等の高輝度を斗」する点光源に近いも
のを用いれば、′はんだ“付部位2および1ゝはんだ“
ブリッジ2人の表面が光沢面となっているため、′はん
だ“付部位2に光源3a〜3hと対応した高反射部が生
ずると共に、′はんだ”ブリッジ2Aにも高反射部が生
じ、これらの対象部位を目視方向からテレビジョンカメ
ラ等によシ撮像し、1はんだ”付部位2およびゝはんだ
“ブリッジ2Aの光源3a〜3hによる照射に基づく反
射光中高反射成分のみを抽出するスレシホールドレベル
によシ、撮像によって得られた映像信号を2値化すれば
、不要な反射光成分が除去され、この信号に応じて第2
図に示す映像が得られる。
FIG. 1 is a diagram showing the state of irradiation of light beams, in which a number of light sources 3a are applied to the air soldering area 2 formed on the land 1 made of a conductor and its surroundings from diagonally above in each direction around the area.
~3h simultaneously irradiates light rays, and light sources 3a~3
If you use a high-intensity point light source such as an incandescent light bulb as h, the solder area 2 and 1 will be solder.
Since the surfaces of the two bridge members are glossy, high reflection areas corresponding to the light sources 3a to 3h are generated at the 'solder' attachment area 2, and high reflection areas are also generated at the 'solder' bridge 2A. A threshold level for capturing an image of the target part from the visual direction using a television camera, etc., and extracting only the medium and high reflection components of the reflected light based on the irradiation by the light sources 3a to 3h of the soldering part 2 and the soldering bridge 2A. Alternatively, if the video signal obtained by imaging is binarized, unnecessary reflected light components will be removed, and the second
The image shown in the figure is obtained.

すなわち、1はんだ〃付部位2からは、光源38〜3h
と対応してこれらとはソ同数の輝度4a〜4hが高反射
成分によシ得られ、各輝点4a〜4hによVはんだ“付
部位2の位置が示されると共に、輝点4A 、 4 B
により1はんだ“ブリッジ2人の存在が示されるものと
なる。
That is, from 1 soldering part 2, the light source 38 to 3h
Correspondingly, the same number of luminances 4a to 4h as these are obtained by the high reflection component, and each bright spot 4a to 4h indicates the position of the V-solder "position 2", and the bright spots 4A, 4 B
This indicates the existence of two solder bridges.

第3図乃至第5図は、他の実施例を示す光線の照射およ
び撮像状況の図であり、第3図においては、′はんだ”
付部位2およびその周辺の直上を回転中心とするアーム
5により光源3を吊下し、撮像対象部位の周囲を回転さ
せており、光源3の回転と同期して上方側から撮像を反
復して行ない、各撮像によって得た映像信号を前述と同
様に処理のうえ合成すれば、第2図の映像が得られる。
3 to 5 are diagrams of light irradiation and imaging situations showing other embodiments. In FIG. 3, 'solder'
A light source 3 is suspended by an arm 5 whose rotation center is directly above the target area 2 and its surroundings, and is rotated around the area to be imaged. Imaging is repeatedly performed from above in synchronization with the rotation of the light source 3. The image shown in FIG. 2 can be obtained by processing the video signals obtained from each imaging and combining them in the same manner as described above.

第4図は、印刷基板6上に散在する複数の1はんだ“付
部位2a〜2c等を対象とする場合であシ、印刷基板6
の周囲上方から複数の光源3a〜3hにより同時に光線
を照射するものとし、テレビジョンカメラを印刷基板6
と対向させたうえ、信号処理上撮像視野を限足し、気は
んだ〃付部位2a〜2c等の対象とするものに応じて移
動させ、または、テレビジョンカメラを固定し、信号処
理上撮像視野を移動させるものとし、ている。
FIG. 4 shows a case in which a plurality of single solder areas 2a to 2c scattered on the printed circuit board 6 are to be targeted.
A plurality of light sources 3a to 3h simultaneously irradiate light beams from above around the periphery of the printed circuit board 6.
In addition, the imaging field of view is limited for signal processing, and the television camera is moved depending on the target object, such as the soldering parts 2a to 2c, or the television camera is fixed and the imaging field of view is limited for signal processing. shall be moved.

また、第5図においては、リング7およびアーム8によ
す、光源3a〜3hおよびテレビジョンカメラ9を一体
イヒし、図上省略した支持機構にょシ支持のうえ移動自
在とし、目的の対象部位へ全体を同時に移動させるもの
となっている。
In addition, in FIG. 5, the light sources 3a to 3h and the television camera 9 are integrated into a ring 7 and an arm 8, and are movable while being supported by a support mechanism not shown in the figure. The entire system is moved simultaneously.

第6図は、電気的構成を示すブロック図であシ、基板6
の対象部位をテレビジョンカメラ9により撮像し、これ
によって得られた映像信号を2値化回路11へ与えてお
り、こ\において、−はんだ〃付部位2および気はんだ
〃ブリッジ2A等の−はんだ′付着部位からの高反射成
分のみを抽出するスレシホールドレベルにより2値化が
なされ、この2値化信号が信号処理部12へ与えられる
FIG. 6 is a block diagram showing the electrical configuration of the board 6.
The target area is imaged by a television camera 9, and the video signal obtained by this is given to the binarization circuit 11, where the -solder area 2 and air solder bridge 2A etc. 'Binarization is performed using a threshold level that extracts only the high reflection component from the attachment site, and this binarized signal is given to the signal processing section 12.

信号処理部12は、プロセッサおよび各種のメモリ等に
より構成され、メモリ中のプログラムをプロセッサが実
行し、信号処理動作を行なっており、1はんだ〃付着部
位の位置を判断すると共に、あらかじめ足めた標準パタ
ーンに基づく1は人、だ〃付着部位の存在領域との比較
により、1はんだ〃ブリッジ2人等の余剰な1はんだ“
の付着を検出し、これに応じてブラウン管表示装置み1
3を制御し、所定の表示を行なっている。
The signal processing unit 12 is composed of a processor and various types of memory, etc., and the processor executes a program in the memory to perform signal processing operations.1 The signal processing unit 12 judges the position of the solder attachment site, and also determines the position of the solder attachment site. Based on the standard pattern, 1 is a person, and by comparison with the area where the adhesion site exists, there is 1 solder, 2 people on the bridge, etc.
Detects the adhesion of
3 and performs a predetermined display.

第7図は、プロセッサによる信号処理動作のフローチャ
ートであり、2値化回路11からの12値化信号をメモ
リへ格納〃101を行なったうえ、ゝ輝点から1はんだ
”付着会実在領域をめる“102を行ない、−実在領域
と存在領域とを比較′103を行なってから、′実在領
域〉存在領域?〃104のN−0に応じ、巣に嘔実在領
域=存在領域? “105をチェックし、これがYES
であれば良好と判断し、ブラウン管表示装#13により
’OK表示〃106を行なう。
FIG. 7 is a flowchart of the signal processing operation by the processor, in which the 12-valued signal from the binarization circuit 11 is stored in the memory (step 101), and the 1-solder adhesion real area is determined from the bright spot. 102, - Compare the real domain and the existential domain' 103, and then find out whether the real domain is the existential domain? 〃According to N-0 of 104, existential area = existential area? “Check 105, this is YES
If so, it is determined that the condition is good, and an 'OK display' 106 is displayed on the cathode ray tube display #13.

以上に対し、ステップ104がYESであれば、もはん
だ〃ブリッジ2人等の余剰な1はんだ〃付着部位が生じ
ているため、ブラウン管表示装置13により1余剰1は
んだ〃付着・表示〃1o7を行ない、ステップ105O
NOに応じては、所足部位の1はんた“未着を生じてい
るため、ステップ107と同様に1v′はんだ“未着・
表示〃108を行なう。
Regarding the above, if step 104 is YES, since there is a surplus 1 solder adhesion site such as 2 solder bridges, etc., 1 surplus 1 solder adhesion/display 1o7 is performed on the CRT display 13. , step 105O
In response to NO, since 1 solder of the required part is not attached, 1v' solder is not attached or soldered as in step 107.
Display 108 is performed.

たソし、光源3の照射方向は、条件に応じて位色数およ
び照射角度を足めればよく、テレビジョンカメラ9を用
いる11か、他の撮像装置を用いても同様であシ、表示
を表示灯または音響等により行なうことも任意であると
共に、′はんだ”付着部位のみならず、光沢面を有する
各種の物体を対象とすることができる。
However, the irradiation direction of the light source 3 may be determined by adding the chromatic number and the irradiation angle according to the conditions, and the same can be done by using the television camera 9 11 or using another imaging device. It is optional to display the display using an indicator light or sound, and the display can be applied not only to the 'solder' adhesion site but also to various objects having a glossy surface.

また、第7図においては、ステップ104と105とを
入替えてもよく、場合によっては、ステップ104を省
略しても同等の結果が得られる等、本発明は種々の変形
が自在である。
Furthermore, in FIG. 7, steps 104 and 105 may be interchanged, and in some cases, the same result can be obtained even if step 104 is omitted, and the present invention can be modified in various ways.

〔発明の効果〕〔Effect of the invention〕

以上の説明により明らかなとおり本発明によれげ、対象
とする光沢面物体以外からの反射光による影響が排除さ
れると共に、高反射成分に基づいて光沢面物体の存在位
置が確実にめられ、これにしたがう実在領域と標準の存
在領域との比較によシ、光沢面余剰物体の検出が正確に
行なわれるものとなり、各種光沢面物体の自動検査上、
顕著な効果が得られる。
As is clear from the above description, according to the present invention, the influence of reflected light from other than the target shiny surface object is eliminated, and the location of the shiny surface object can be reliably determined based on the high reflection component. By comparing the actual area and the standard existing area according to this, the detection of objects with excessive glossy surfaces can be performed accurately, and this can be used for automatic inspection of various objects with glossy surfaces.
Remarkable effects can be obtained.

【図面の簡単な説明】[Brief explanation of drawings]

図は本発明の実施例を示し、灰、1図はブ0線の照射状
況を示す図、第2図は2値化信七によって得 (られる
映像を示す図、第3図乃至第5図は他の実施例を示す光
線の照射状況および撮像状況の図、泥6図は電気的栴賊
を示すブロック囚、第7図は(g号処理動作のフローチ
ャートでるる。 2.2a〜2c・・・中1はんだ〃付部位(光沢面物体
)、2A・・・・1はんだIブリッジ(光沢面余剰物体
)、3,3a〜3h・・・・光源、9・・・・テレビジ
ョンカメラ、11e・・・2値化回路、12・・・・信
号処理部。 特許出願人 日立電子株式会社 代 理 人 山川政樹(#1か2名) 第1図 30 第4図 第6図
The figures show an embodiment of the present invention. 2.2a to 2c. 2.2a to 2c. 2.2a to 2c. 2.2a to 2c. 2.2a to 2c. ... Middle 1 soldering part (glossy surface object), 2A ... 1 solder I bridge (glossy surface excess object), 3, 3a to 3h ... light source, 9 ... television camera, 11e: Binarization circuit, 12: Signal processing section. Patent applicant: Hitachi Electronics Co., Ltd. Agent: Masaki Yamakawa (#1 or 2) Fig. 1 30 Fig. 4 Fig. 6

Claims (1)

【特許請求の範囲】[Claims] 光沢面物体およびその周辺へ周囲から光線を照射して前
記物体およびその周辺を撮像し、該撮像によって得られ
た映像信号から前記物体の前記照射による反射光の高反
射成分を抽出し、該抽出によって得られた信号に基づき
前記光沢面の実在領域をめ、該実在領域とあらかじめ定
めた前記物体の存在領域とを比較し、該比較結果に応じ
て光沢面余剰物体の検出を行なうことを特徴とする光沢
面余剰物体の検出方法。 □
A glossy surface object and its surroundings are irradiated with light beams from the surroundings to image the object and its surroundings, and a high reflection component of the light reflected by the irradiation of the object is extracted from the video signal obtained by the imaging; The present invention is characterized in that the actual area of the glossy surface is determined based on the signal obtained by the method, the actual area is compared with a predetermined existing area of the object, and an excess object on the glossy surface is detected according to the comparison result. A method for detecting objects with excessive glossy surfaces. □
JP995884A 1984-01-25 1984-01-25 Detecting method of excessive glossy surface body Pending JPS60154144A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP995884A JPS60154144A (en) 1984-01-25 1984-01-25 Detecting method of excessive glossy surface body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP995884A JPS60154144A (en) 1984-01-25 1984-01-25 Detecting method of excessive glossy surface body

Publications (1)

Publication Number Publication Date
JPS60154144A true JPS60154144A (en) 1985-08-13

Family

ID=11734449

Family Applications (1)

Application Number Title Priority Date Filing Date
JP995884A Pending JPS60154144A (en) 1984-01-25 1984-01-25 Detecting method of excessive glossy surface body

Country Status (1)

Country Link
JP (1) JPS60154144A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11654375B2 (en) 2019-08-07 2023-05-23 Universal City Studios Llc Systems and methods for detecting specular surfaces

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4832487A (en) * 1971-09-01 1973-04-28
JPS57198638A (en) * 1981-05-30 1982-12-06 Toshiba Corp Detection of wire bonding state and device therefore

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4832487A (en) * 1971-09-01 1973-04-28
JPS57198638A (en) * 1981-05-30 1982-12-06 Toshiba Corp Detection of wire bonding state and device therefore

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11654375B2 (en) 2019-08-07 2023-05-23 Universal City Studios Llc Systems and methods for detecting specular surfaces

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