JPS60136203A - Method of producing glass sealed thermistor - Google Patents
Method of producing glass sealed thermistorInfo
- Publication number
- JPS60136203A JPS60136203A JP24605083A JP24605083A JPS60136203A JP S60136203 A JPS60136203 A JP S60136203A JP 24605083 A JP24605083 A JP 24605083A JP 24605083 A JP24605083 A JP 24605083A JP S60136203 A JPS60136203 A JP S60136203A
- Authority
- JP
- Japan
- Prior art keywords
- glass
- thermistor
- encapsulated
- manufacturing
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Thermistors And Varistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、家電機器、住設機器に温度センサとして広く
用いられているサーミスタのうち、主としてオーブン、
ファンヒータ、電子レンジなど比較的高温（３００〜５
００″Ｃ）の温度検知を行うサーミスタとして用いらル
るガラス封入サーミスタの製造方法に関するものである
。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to thermistors that are widely used as temperature sensors in home appliances and housing equipment, and which are mainly used in ovens,
Relatively high temperature (300~500℃) such as fan heater or microwave oven
The present invention relates to a method of manufacturing a glass-encapsulated thermistor used as a thermistor for detecting a temperature of 00''C.
従来例の構成とその問題点
ガラス封入サーミスタの従来の製造工程図を第１図に、
そしてガラス封入サーミスタの断面図ケ第３図に示す。The conventional structure and its problems The conventional manufacturing process diagram of a glass-encapsulated thermistor is shown in Figure 1.
A cross-sectional view of the glass-encapsulated thermistor is shown in FIG.
ガラス封入サーミスタの従来の最も一般的な製造方法は
、ガラス管３内に正方板形のサーミスタチップ１金入れ
、両側からリード線２ではさみ、加熱してガラス管３と
リード線２とを接着するという方法であり、ガラス管３
として鉛ガラス、リード線２としてジュメット線が用い
られ、封入温度は６００°Ｃ程度である。このように、
ガラス管３として鉛ガラスが用いられているため、使用
に当っては鉛ガラスの歪点近傍すなわち４００°Ｃ程度
以下でなけ１ｔは、ガラス管が溶融してガラス封入サー
ミスタが破壊してしまう。換訂すれば、ガラス封入サー
ミスタの１制熱温度はザーミスタチソブ１自体の耐熱性
たけでなく、ガラス管３の耐熱性にも太きく左右さｔす
るわけである。The conventional and most common manufacturing method for glass-encapsulated thermistors is to place a gold square thermistor chip in a glass tube 3, sandwich it between lead wires 2 from both sides, and heat the glass tube 3 and bond the lead wires 2 together. The glass tube 3
Lead glass is used as the lead wire, Dumet wire is used as the lead wire 2, and the sealing temperature is about 600°C. in this way,
Since lead glass is used as the glass tube 3, the temperature must be near the strain point of the lead glass, that is, below about 400° C., or the glass tube will melt and the glass-encapsulated thermistor will be destroyed. In other words, the temperature control temperature of the glass-encapsulated thermistor depends not only on the heat resistance of the thermistor 1 itself, but also on the heat resistance of the glass tube 3.
従って、市場要望の大きいより高耐熱のガラス封入サー
ミスタを得るためには、より高耐熱性のガラス管３が要
求されるのであるが、ガラス管３の耐熱性を上げるにつ
れて必然的に封入温度も土昇してしまうので、サーミス
タチップ１が封入時の高温に耐えなくなるという商題が
発生する。例えば、ガラス封入サーミスタの耐熱性１５
００°Ｃ程度にしようとす几ば、ガラス管３としてはニ
ホウケイ酸ガラスなどが選定されるので、その時の封入
温度は８００〜８５０’Ｃ程度に上昇し、サーミスタチ
ップ１の抵抗値が封入前と比較して数百倍Ｖ？−なって
しまうという現象が発生する。Therefore, in order to obtain a glass-encapsulated thermistor with higher heat resistance, which is in great demand in the market, a glass tube 3 with higher heat resistance is required, but as the heat resistance of the glass tube 3 is increased, the encapsulation temperature also increases. As the temperature rises, a commercial problem arises in that the thermistor chip 1 cannot withstand the high temperature during encapsulation. For example, the heat resistance of a glass-encapsulated thermistor is 15
If the temperature is to be about 00°C, diborosilicate glass or the like is selected for the glass tube 3, so the sealing temperature at that time will rise to about 800 to 850°C, and the resistance value of the thermistor chip 1 will be lower than before the sealing. A few hundred times more V? - This phenomenon occurs.
発明の目的
本発明の目的は、以上に述べた従来の問題点を極めて容
易に解決することのできるガラス封入サーミスタの製造
方法を提供しようとするものである０
発明の構成
本発明のガラス封入サーミスタの製造方法は、結晶化ガ
ラスが結晶化の前後でその融点が変化するという特性に
着目し、結晶化ガラスの非晶質粉末にバインダを加えて
成形した後、バインダ除去した仮焼成形体内にサーミス
タチップとリード線を挿入した後、結晶化ガラスの非晶
質粉末を結晶化後のガラス融点より低い温度で熱処理に
より結晶化させ、同時に封入を行うという構成にするも
のである。OBJECT OF THE INVENTION An object of the present invention is to provide a method for manufacturing a glass-encapsulated thermistor that can extremely easily solve the conventional problems described above.0 Structure of the Invention Glass-encapsulated thermistor of the present invention The manufacturing method focuses on the characteristic that the melting point of crystallized glass changes before and after crystallization, and after adding a binder to the amorphous powder of crystallized glass and molding, the binder is removed and the calcined molded body is heated. After inserting the thermistor chip and lead wires, the amorphous powder of crystallized glass is crystallized by heat treatment at a temperature lower than the melting point of the glass after crystallization, and at the same time, the structure is encapsulated.
実施例の説明
本発明の一実施例を製造工程を示す第２図、前述した断
面図の第３図とともに説明する。本発明におけるガラス
封入サーミスタの製造方法は、前述の通り、結晶化ガラ
スが結晶化の前後でその融点が変化する、一般的には結
晶化したあとの方が融点が高くなるという特性を積極的
に利用するものである。DESCRIPTION OF THE EMBODIMENTS An embodiment of the present invention will be described with reference to FIG. 2 showing the manufacturing process and FIG. 3 showing the aforementioned cross-sectional view. As mentioned above, the manufacturing method of the glass-encapsulated thermistor of the present invention actively takes advantage of the characteristic that the melting point of crystallized glass changes before and after crystallization, and that the melting point generally becomes higher after crystallization. It is used for.
まず、結晶化ガラスの非晶質粉末、例えばＢ２０３−
ＰｂＯ−ＺｎＯ系のガラスにバインダとして例えば酢酸
イソアミルを添加して押出し工法によりパイプ状の成形
体を得る。この後、３０○°Ｃ程度でバインダを除去し
て仮焼成形体を得る。そして、この仮焼成形体内にザー
ミスタチッブ１金入れ、両側から例えばＦｅ−Ｎｉ−Ｃ
ｏ合金のコバールからなるリード線２ではさみ、約７０
０°Ｃ程度に加熱して仮焼成形体を結晶化させ、サーミ
スタチップ１をガラス管３内に封入すると同時にリード
線２と接着するというものである。First, amorphous powder of crystallized glass, for example B203-
For example, isoamyl acetate is added as a binder to PbO-ZnO glass, and a pipe-shaped molded body is obtained by extrusion. Thereafter, the binder is removed at about 30°C to obtain a calcined compact. Then, a single gold thermistor chip is inserted into this calcined body, and from both sides, for example, Fe-Ni-C
o Sandwiched between lead wires 2 made of Kovar alloy, about 70
The calcined compact is crystallized by heating to about 0° C., and the thermistor chip 1 is sealed in the glass tube 3 and simultaneously bonded to the lead wire 2.
発明の効果 本発明による効果は次の通りである。Effect of the invention The effects of the present invention are as follows.
（１） これまでより高耐熱（約４００°Ｃ以上）のガ
ラス封入サーミスタを得ることが非常に困難であったが
、本発明の画期的な製造方法によれＩ′ｆ、極めて容易
に、より高耐熱のガラス封入サーミスタを得ることがで
きる。(1) Until now, it has been extremely difficult to obtain glass-encapsulated thermistors with higher heat resistance (approximately 400°C or higher), but with the innovative manufacturing method of the present invention, I'f, A glass-encapsulated thermistor with higher heat resistance can be obtained.
（１１）結晶化ガラスの非晶質仮焼成形体製造以降の工
程、すなわち封入工程は従来と全く同一の製造設備が使
用できるため、極めて安価に、かつ大阪生産することが
できる。(11) The process after manufacturing the amorphous calcined body of crystallized glass, that is, the encapsulation process, can use the same manufacturing equipment as conventional ones, so it can be produced in Osaka at extremely low cost.
第１図は従来のガラス封入サーミスタの製造工程を示す
図、第２図は本発明のガラス封入サーミ哀夕の製造工程
を示す図、第３図は従来方法および本発明方法により得
らｆＬｆｃガラス封入サーミスタの断面図である。
１・・・・・・サーミスタチップ、２・ ・・リード線
、３・・・・・ガラス管。FIG. 1 is a diagram showing the manufacturing process of a conventional glass-encapsulated thermistor, FIG. 2 is a diagram showing the manufacturing process of the glass-encapsulated thermistor of the present invention, and FIG. 3 is a diagram showing the manufacturing process of the glass-encapsulated thermistor of the present invention. FIG. 2 is a cross-sectional view of an encapsulated thermistor. 1... Thermistor chip, 2... Lead wire, 3... Glass tube.
Claims (1)
の非晶質粉末にバインダを加え、適当な形状に成形した
後、熱処理によりバインダを除去した仮焼成形体内にサ
ーミスタチップと２本のリード線を挿入し、熱処理によ
り仮焼成形体を結晶化させて製造することを特徴とする
ガラス封入サーミスタの製造方法。A binder is added to the amorphous powder of crystallized glass whose melting point increases after crystallization through heat treatment, and after molding into an appropriate shape, the binder is removed through heat treatment, and a thermistor chip and two lead wires are placed inside the calcined molded body. 1. A method for manufacturing a glass-encapsulated thermistor, which comprises inserting a glass-encapsulated thermistor into the glass and crystallizing the calcined compact through heat treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24605083A JPS60136203A (en) | 1983-12-23 | 1983-12-23 | Method of producing glass sealed thermistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24605083A JPS60136203A (en) | 1983-12-23 | 1983-12-23 | Method of producing glass sealed thermistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60136203A true JPS60136203A (en) | 1985-07-19 |
Family
ID=17142715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24605083A Pending JPS60136203A (en) | 1983-12-23 | 1983-12-23 | Method of producing glass sealed thermistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60136203A (en) |
-
1983
- 1983-12-23 JP JP24605083A patent/JPS60136203A/en active Pending
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