JPS60132314A - Chip type electrolytic condenser - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] The present invention relates to a chip type electrolytic capacitor.

In a conventional chip type electrolytic capacitor, as shown in FIG. 1, an anode lead-out lead 2 led out from a capacitor element 1 is inserted into an elastic sealing body 3, and a cathode lead-out lead 4 led out from a capacitor element 1 is inserted into a metal. The condenser element 1 was housed in the metal case 5 by welding to the bottom of the case 5, and the sealing portion was sealed with a seam, followed by molding and encasing with resin.

6 is an anode terminal, 7 is a cathode terminal, and 8 is an exterior resin such as Ebogishi. However, the above-mentioned chip type electrolytic capacitor has the drawback that it requires multiple 1L manufacturing steps and is expensive. For this reason, various attempts have been made, such as using a resin case instead of the internal metal case or applying liquid resin, but since the capacitor element is impregnated with electrolyte, the structure becomes complex and the airtightness is not sufficiently satisfied. There were problems such as electrolyte leakage and cracks in the exterior resin.

The present invention solves the above-mentioned problems and provides a chip-type electrolytic container with high productivity and reliability.

The present invention will be explained below with reference to embodiments shown in FIGS. 2 to 7.

Figure 2 shows a condenser element 9 in which an anode electrode foil and a cathode electrode foil are wound facing each other with a separator such as electrolytic paper interposed therebetween, and this is flattened and impregnated with an electrolyte. 10 is connected to the anode electrode foil. The anode lead lead 11 is a cathode lead lead connected to the cathode electrode foil. Next, as shown in FIG.
An anode lead 1o and a cathode lead 11 are welded to each of the leads 3 and 3. In this case, the anode terminal 12 and the cathode terminal 13 are formed into a frame shape by punching a single solderable metal plate so that a plurality of anode terminals 12 and cathode terminals 13 are arranged facing each other with a predetermined space between them. is used.

Next, the two parts of the resin cases 14a and 14b made of synthetic resin such as epoxy resin, which have been molded in advance, and the non-liquid soft rubber 15 provided inside them are joined from above and below and heated to form a structure as shown in FIG. Seal tightly. In addition, this unliquid soft rubber 15 may be used in electrolyte solutions such as EPDM (ethylene propylene diene monomer), EPT (ethylene propylene copolymer) rubber made of EPM (ethylene propylene monomer), IIR (inbutylene isobutyne rubber), etc. Those that have no negative effects are used.

At this time, the lead 1 led out from the capacitor element 9
0.11 and terminals 12 and 13 are bonded by heating with unliquid soft rubber in close contact with both surfaces.

Chip-type electrolytic capacitor 1J of the present invention is manufactured as described above.

Therefore, the capacitor element 9 has an anode lead 10
The lead-out portion of the cathode drawer 11 is covered with a non-liquid soft rubber 15, and when heated, the liquid comes into close contact with the soft rubber 15, so that it is reliably sealed.

Therefore, there are no accidents such as leakage of the electrolytic solution impregnated into the capacitor element 9 or cracking of the exterior resin, and the electrical properties, especially loss and electrostatic charge, are stable, and the thisozo electrolyte has high heat resistance and airtightness. Nilindensa is obtained.

Figures 5 and 6 show other embodiments, with resin horns 1
Four parts are formed at the junction of 4a and 14b to prevent the unliquid soft rubber from flowing out and improve airtightness.

The table shows the results of immersing chip-type electrolytic capacitors of the present invention and conventional products with a rating of 16 V and 10 μF in molten solder at 260° C. to check for leakage. The numbers in the table are the number of defects/number of tests.

Table 7 shows the results of a high-temperature load test in which the product of the present invention and the conventional product were compared by applying a rated voltage at a temperature of 85° C. and applying continuous current.

As is clear from the table and FIG. 7, the dip-type electrolytic capacitor of the present invention was demonstrated to be extremely superior in heat resistance and reliability.

As described above, the chip-type electrolytic capacitor of the present invention has a capacitor element having lead leads formed in two parts.
In a chip-type electrolytic capacitor housed in a resin case consisting of two parts, the resin case is bonded to at least the lead-out part of the lead-out lead via unliquid rubber, and the capacitor is sealed each time it is heated. It is extremely advantageous in terms of soldering heat resistance and reliability, and is of great industrial and practical value.

[Brief explanation of the drawing]

Figure 1 is a cross-sectional view of a conventional chip-type electrolytic capacitor;
The figure is a perspective view of a chip-type electrolytic capacitor element according to the present invention, FIG. FIG. 5 is a cross-sectional view of a main part of another embodiment of the manufacturing process of the chip-type electrolytic capacitor of the present invention, and FIG. 6 is a cross-sectional view of the chip of the present invention shown in FIG. Figure 7 is a cross-sectional view of a chip-type electrolytic capacitor, and Figure 7 is an example of a high-temperature load test of a chip-type electrolytic capacitor comparing the product of the present invention and a conventional product.
is a loss-time characteristic diagram. 9: Capacitor element 10.11: Drawer leads 14a, 14b: Resin case 15: Non-liquid soft rubber Patent applicant Nippon Condenza Industry Co., Ltd.;゛Do 1 Figure 1j-Figure 5Figure 5 2j'36 Figure 7 (A) Time open (N time closed) (Ladle procedure amendment (method) % formula% 1 Table of cases 1988 Patent Application No. 2415001 -32 Name of the invention Chip-type electrolytic capacitor 3 Relationship with the supplementary IE case Patent applicant March 7, 1980 (@Sent to Japan March 27, 1980) 5
, Subject of correction Full text correction #] Kutsu

Claims (1)

[Claims] In a chip-type electrolytic capacitor in which a capacitor element having a drawer lead is housed in a resin case consisting of two pre-molded parts, the resin case is bonded to at least the lead-out part of the drawer lead via unwashed rubber and heated. A chip-type electrolytic capacitor that is characterized by its hermetic seal.