JPS5940520A - Chip type electrolytic condenser - Google Patents

Chip type electrolytic condenser

Info

Publication number
JPS5940520A
JPS5940520A JP15134582A JP15134582A JPS5940520A JP S5940520 A JPS5940520 A JP S5940520A JP 15134582 A JP15134582 A JP 15134582A JP 15134582 A JP15134582 A JP 15134582A JP S5940520 A JPS5940520 A JP S5940520A
Authority
JP
Japan
Prior art keywords
resin
lead
chip
layer
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15134582A
Other languages
Japanese (ja)
Other versions
JPH0216569B2 (en
Inventor
伊藤 泰穂
三原 正城
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichicon Corp
Original Assignee
Nichicon Capacitor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichicon Capacitor Ltd filed Critical Nichicon Capacitor Ltd
Priority to JP15134582A priority Critical patent/JPS5940520A/en
Publication of JPS5940520A publication Critical patent/JPS5940520A/en
Publication of JPH0216569B2 publication Critical patent/JPH0216569B2/ja
Granted legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明はチップ状電解コンデンサに関するものである。[Detailed description of the invention] The present invention relates to a chip-shaped electrolytic capacitor.

近年電子桟器はIC,LSIなどの半導体技術の進歩に
よってセットの小形化、薄形化とともに使用電子部品の
自動挿入や自動搭載技術の普及も著るしい。
In recent years, advances in semiconductor technology such as IC and LSI have led to the miniaturization and thinning of electronic stand-piece sets, as well as the rapid spread of automatic insertion and mounting technology for electronic components.

コンデンサの分野でも各種チップタイプが考案され、そ
の一部はすでに実用化されている。
Various chip types have been devised in the field of capacitors, some of which are already in practical use.

しかし電解コンデンサの場合には電解液が用いられてい
るためにチップ化を図ることが困難で、その構造も複雑
なものとなっていた。このため従来は第1図に示すよう
にあらかじめ引出リード2を接続した一対のアルミニウ
ム電極2C1間にセパレータを介して巻回した素子1に
電解液を含浸して内装ケース3に収納して密閉した後、
引出リード2に外部端子用金属電極4を接続し、外装用
樹脂5なとてモールド成形したものがよく知られていた
However, since electrolytic capacitors use an electrolyte, it is difficult to make them into chips, and their structure is complicated. For this reason, conventionally, as shown in FIG. 1, an element 1 is wound with a separator between a pair of aluminum electrodes 2C1 to which a lead-out lead 2 is connected in advance, and the element 1 is impregnated with an electrolytic solution and then housed in an inner case 3 and sealed. rear,
It is well known that a metal electrode 4 for an external terminal is connected to a lead-out lead 2 and molded with a resin 5 for the exterior.

上述のようにして製造された従来のチップ状電解コンデ
ンサは引出リード2と外部端子用金属電極4との接続部
を有するため、その製造工程上製品の出来上り寸法にも
制約が生ずるほか、さらに引出リード2は第1図のよう
に内装用樹j指ケース3の側壁面を貫通するため内部の
気密が維持ijI能なよう抽々対策を購しても未だ完全
なものは得られておらず、電気特性の改良にも眼界を生
ずるなと多くの欠点を有していた。
Since the conventional chip-shaped electrolytic capacitor manufactured as described above has a connecting part between the drawer lead 2 and the external terminal metal electrode 4, there are restrictions on the finished dimensions of the product due to the manufacturing process. As shown in Fig. 1, the lead 2 penetrates the side wall surface of the interior wood case 3, so even if we have taken measures to maintain the internal airtightness, we have not yet been able to obtain a perfect product. However, even though the electrical characteristics were improved, there were many drawbacks such as not creating an ocular field.

本発明は上述の欠点を除去し、小形で耐熱性の高いチッ
プ状電解コンデンサを提供するものである。
The present invention eliminates the above-mentioned drawbacks and provides a chip-shaped electrolytic capacitor that is small and has high heat resistance.

以下、本発明を第2図および第3図に示す実施例により
説明する。
The present invention will be explained below with reference to the embodiments shown in FIGS. 2 and 3.

第2図は製造工程中におけるチップ状1fi解コンデン
サの斜視図、第3図はチップ状電解コンデンサの断面図
で、あらかじめ陽極箔および陰極箔に引出リード2をそ
れぞれ接続した後、セパレータを介して巻回して形成し
たコンデンサ素子1をテフロンなど耐熱性の優れた熱収
縮性の樹脂チューブ6内に挿入し、両端部の引出リード
2にゴムなどの弾性体7を挿通させた後、加熱収縮させ
て素子1およびゴムなどの弾性体7を締めつけ固定する
。しかるのち両端開口部にエポキシ系、ウレタン系など
の液状樹脂8を塗布、硬化する。なお、弾性体7の代り
に熱硬化性、熱=if塑性樹脂などの封口体を用いても
よい。
Fig. 2 is a perspective view of a chip-shaped 1fi capacitor during the manufacturing process, and Fig. 3 is a cross-sectional view of a chip-shaped electrolytic capacitor. The capacitor element 1 formed by winding is inserted into a heat-shrinkable resin tube 6 with excellent heat resistance such as Teflon, and after inserting an elastic body 7 such as rubber into the pull-out leads 2 at both ends, the tube is heated and shrunk. The element 1 and the elastic body 7, such as rubber, are tightened and fixed. Thereafter, a liquid resin 8 such as epoxy or urethane is applied to the openings at both ends and hardened. Note that instead of the elastic body 7, a sealing body made of thermosetting resin, heat=if plastic resin, or the like may be used.

このようにして製造されたものをさらに外装用樹脂5で
モールド成形する。次に第3図に示すよ  ゛うに両端
部の引出リーに2およびその端面に銀ペーストなどを塗
布、硬化し導電層9を形成する。
The product thus manufactured is further molded with exterior resin 5. Next, as shown in FIG. 3, a conductive layer 9 is formed by applying silver paste or the like to the drawer reel 2 at both ends and its end face and hardening.

そしてニッケル、銅などはんだ1・j゛けij能な金属
からなる無電解メッキ処理を施して、−1−記棉電層9
および引出リード2上に無電解メッキ層10を形成した
後、はんだメッキ層11を形成して完成する。
Then, an electroless plating process made of a metal capable of soldering, such as nickel or copper, is applied to form the -1- printed conductor layer 9.
After forming an electroless plating layer 10 on the lead-out lead 2, a solder plating layer 11 is formed to complete the process.

上記外部電極の形成方法によればその下地は非鉄金属や
樹脂などいずれの場合も処理Ij■能である。
According to the method for forming the external electrode described above, the base material can be treated regardless of whether it is a non-ferrous metal or a resin.

従って引出リード2は電極箔に接続されたアルミニウム
のまま引出すことがiJ能となり、従来品のように引出
リードの溶接などの接続部を有しないばかりか、熱収縮
性の樹脂チューブ6の収縮力によって巻回コンデンサ素
子1の全体か締めつけられるため、巻回した陽極箔、陰
極箔の電極間がせばめられることになり、電気特性の向
」二も可能となった。
Therefore, the extraction lead 2 can be pulled out with the aluminum connected to the electrode foil, and not only does it not have a connecting part such as welding of the extraction lead like conventional products, but also has the shrinkage force of the heat-shrinkable resin tube 6. Since the entire wound capacitor element 1 is tightened, the distance between the wound anode foil and cathode foil electrodes is narrowed, making it possible to improve the electrical characteristics.

また引出リード2の導出部は弾性体7または封11体7
および液状樹+Iir 8によって二重に気密が保たれ
るため極めて信頼性の高いチップ状電解コンデ/すが得
られた。
Further, the lead-out portion of the lead-out lead 2 is formed by an elastic body 7 or a seal 11 body 7.
A highly reliable chip-shaped electrolytic capacitor/condenser was obtained since the liquid tree + Iir 8 ensured double airtightness.

次に上述の実施例に基づいて定格25V、3.3μFの
チップ状電解コンデンサを製作し、温度260での溶融
はんだ中に10秒間浸漬した後、5げ廊印加したまま8
5’Cの雰囲気中に放置してその経時変化を/fill
定し、従来品と比較した結果を表に示す。
Next, a chip-shaped electrolytic capacitor with a rating of 25V and 3.3μF was manufactured based on the above-mentioned example, and after immersing it in molten solder at a temperature of 260℃ for 10 seconds, it was
Leave it in an atmosphere of 5'C and observe its change over time /fill
The table shows the results compared with conventional products.

表 表から明らかなように本発明品は、従来品に比べ高温負
荷による寿命試験においても極めて安定した特性を示す
ことが確認された。
As is clear from the table, it was confirmed that the products of the present invention exhibit extremely stable characteristics compared to conventional products even in life tests under high-temperature loads.

蒸上のように本発明のチップ状電解コンデンサは、熱収
縮性の樹脂チューブの収縮力によるコンデンサ素子の締
めっけと、封口部の弾性体または封口体および樹脂層で
気密が保持されるとともtc。
As described above, the chip-shaped electrolytic capacitor of the present invention has two advantages: the capacitor element is tightened by the contraction force of the heat-shrinkable resin tube, and airtightness is maintained by the elastic body of the sealing part or the sealing body and the resin layer. Tomo tc.

引出リードと外部端子を形成するはんだメッキ層との一
体化が可能となり、特性の優れたコンデンサの製造が可
能となり、工業的ならびに実用価値の大なるものである
It becomes possible to integrate the lead lead and the solder plating layer forming the external terminal, and it becomes possible to manufacture a capacitor with excellent characteristics, which is of great industrial and practical value.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のチップ状電解コンデンサの断面図、第2
図は本発明の製造工程中におけるチップ状電解コンデン
サの斜視図、第3図は本発明のチップ状電解コンデンサ
の一実施例の断面図である。 1:コンデンサ素子 2:引出リード 5,8:樹脂 
6:熱収縮性の樹脂チューブ 9:導電層 10:無電
解メッキ層 11:はんだメッキ層 特許出願人 日本コンデンサ工業株式会社
Figure 1 is a cross-sectional view of a conventional chip electrolytic capacitor;
The figure is a perspective view of a chip-shaped electrolytic capacitor during the manufacturing process of the present invention, and FIG. 3 is a sectional view of an embodiment of the chip-shaped electrolytic capacitor of the present invention. 1: Capacitor element 2: Output lead 5, 8: Resin
6: Heat-shrinkable resin tube 9: Conductive layer 10: Electroless plating layer 11: Solder plating layer Patent applicant Nippon Capacitor Industry Co., Ltd.

Claims (1)

【特許請求の範囲】[Claims] 陽極箔および陰極箔をセパレーターを介して対向させて
コンデンリ素子を形成し、該素子に電解液を含浸すると
ともに、該素子より相反する二方向に4出した引出リー
ドをゴムなどの弥性体または樹脂などの封口体に挿通さ
せ熱収縮性の樹脂チューブに収納して加熱収縮し、さら
にこれを包囲するよう樹脂層を形成し、該南脂層上両端
部の引出リード突出部分に導電層、無電解メッキ層、は
んだメッキ層を順次形成して電極を形成し、該電極と上
記引出リードが接続されていることを特徴とするチップ
状電解コンデンサ。
A condenser element is formed by making an anode foil and a cathode foil face each other with a separator interposed therebetween, and the element is impregnated with an electrolytic solution, and the four lead-out leads extending from the element in two opposite directions are made of an amenophobic material such as rubber or the like. A resin tube is inserted through a sealant such as resin, and the heat-shrinkable resin tube is heated and shrunk, and a resin layer is formed to surround this, and a conductive layer is formed on the protruding parts of the drawer leads at both ends of the southern resin layer. A chip-shaped electrolytic capacitor characterized in that an electrode is formed by sequentially forming an electroless plating layer and a solder plating layer, and the electrode is connected to the above-mentioned lead.
JP15134582A 1982-08-30 1982-08-30 Chip type electrolytic condenser Granted JPS5940520A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15134582A JPS5940520A (en) 1982-08-30 1982-08-30 Chip type electrolytic condenser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15134582A JPS5940520A (en) 1982-08-30 1982-08-30 Chip type electrolytic condenser

Publications (2)

Publication Number Publication Date
JPS5940520A true JPS5940520A (en) 1984-03-06
JPH0216569B2 JPH0216569B2 (en) 1990-04-17

Family

ID=15516533

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15134582A Granted JPS5940520A (en) 1982-08-30 1982-08-30 Chip type electrolytic condenser

Country Status (1)

Country Link
JP (1) JPS5940520A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011165961A (en) * 2010-02-10 2011-08-25 Nichicon Corp Solid electrolytic capacitor and method of manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011165961A (en) * 2010-02-10 2011-08-25 Nichicon Corp Solid electrolytic capacitor and method of manufacturing the same

Also Published As

Publication number Publication date
JPH0216569B2 (en) 1990-04-17

Similar Documents

Publication Publication Date Title
US7359181B2 (en) Solid electrolytic capacitor
US4591951A (en) Mounting arrangement for electronic components
JPS626332B2 (en)
US4558399A (en) Electrolytic capacitor and a process for producing the same
JPS5940520A (en) Chip type electrolytic condenser
JP3160921B2 (en) Method for manufacturing solid electrolytic capacitor
US3731371A (en) Solid electrolytic capacitors and process
JP3433478B2 (en) Solid electrolytic capacitors
JPS60148104A (en) Electronic part
JPS6025893B2 (en) Chip type electrolytic capacitor
JP2850819B2 (en) Manufacturing method of chip type solid electrolytic capacitor
JPH0310663Y2 (en)
EP0182319A2 (en) Electrolytic capacitor and method for the manufacture of the same
JPS5937854B2 (en) Manufacturing method for chip-type electronic components
JPH0115165Y2 (en)
JP3441817B2 (en) Chip electronic components
JP3125366B2 (en) Method for manufacturing solid electrolytic capacitor
JPS6158227A (en) Chip type electrolytic condenser
JPS60201617A (en) Electronic part
JPH05267107A (en) Manufacture of solid electrolyte capacitor
JPH0216568B2 (en)
JPS6184823A (en) External insertion of electrolytic capacitor
JPH04354318A (en) Production of chip-shaped solid-state electrolytic capacitor
JPH0388314A (en) Manufacture of solid electrolytic capacitor
JPS58119629A (en) Chip type aluminum electrolytic condenser