JPS60130652U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS60130652U JPS60130652U JP1827384U JP1827384U JPS60130652U JP S60130652 U JPS60130652 U JP S60130652U JP 1827384 U JP1827384 U JP 1827384U JP 1827384 U JP1827384 U JP 1827384U JP S60130652 U JPS60130652 U JP S60130652U
- Authority
- JP
- Japan
- Prior art keywords
- case
- electrodes
- semiconductor equipment
- mini
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａ及びｂに従来構造によるミニモールドトランジ
スタの平面図、立面図を示す。第２図ａ及びｂに本考案
によるミニモールドトランジスタの平面図、立面図を示
す。第３図、第４図、第５図には、本考案によるミニモ
ールドトランジスタの複数個一体化した実装方法の例を
示す。
１・・・・・・電極、２・・・・・・ケース、３・・・
・・・ケースと一体化して形成した突起、を示す。FIGS. 1a and 1b show a plan view and an elevation view of a mini-mold transistor having a conventional structure. FIGS. 2a and 2b show a plan view and an elevation view of a mini-mold transistor according to the present invention. FIGS. 3, 4, and 5 show an example of a mounting method for integrating a plurality of mini-mold transistors according to the present invention. 1...electrode, 2...case, 3...
... indicates a protrusion formed integrally with the case.
Claims (1)
該トランジスタケースの同一側面に形成し、これと向い
あう側面には電極を形成せず、該ケースと一体化してモ
ールド形成した突起を設けた構造をとることにより、電
極の存在しない該ケース側面同志を互いに接着して、複
数のミニモールドトランジスタを一体化したことを特徴
とした半導体装置。In a mini-mold transistor, all external electrodes are formed on the same side of the transistor case, no electrodes are formed on the opposite side, and a structure is provided in which a protrusion is molded integrally with the case. A semiconductor device characterized in that a plurality of mini-mold transistors are integrated by bonding side surfaces of the case where no electrodes are present to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1827384U JPS60130652U (en) | 1984-02-10 | 1984-02-10 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1827384U JPS60130652U (en) | 1984-02-10 | 1984-02-10 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60130652U true JPS60130652U (en) | 1985-09-02 |
Family
ID=30506752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1827384U Pending JPS60130652U (en) | 1984-02-10 | 1984-02-10 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60130652U (en) |
-
1984
- 1984-02-10 JP JP1827384U patent/JPS60130652U/en active Pending
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