JPS60127906U - Epoxy resin molded body - Google Patents

Epoxy resin molded body

Info

Publication number
JPS60127906U
JPS60127906U JP1652784U JP1652784U JPS60127906U JP S60127906 U JPS60127906 U JP S60127906U JP 1652784 U JP1652784 U JP 1652784U JP 1652784 U JP1652784 U JP 1652784U JP S60127906 U JPS60127906 U JP S60127906U
Authority
JP
Japan
Prior art keywords
epoxy resin
resin molded
molded body
insulator
metal conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1652784U
Other languages
Japanese (ja)
Inventor
勲 佐藤
Original Assignee
昭和電線電纜株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 昭和電線電纜株式会社 filed Critical 昭和電線電纜株式会社
Priority to JP1652784U priority Critical patent/JPS60127906U/en
Publication of JPS60127906U publication Critical patent/JPS60127906U/en
Pending legal-status Critical Current

Links

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Insulators (AREA)
  • Cable Accessories (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図面はオく考案の一実施例を示す断面図である。 1・・・エポキシ樹脂絶縁体、2・・・金属導体、3・
・・シリコーン緩衝層。
The drawing is a sectional view showing one embodiment of the invention. 1... Epoxy resin insulator, 2... Metal conductor, 3...
...Silicone buffer layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] エポキシ樹脂絶縁体中に金属導体を埋込んでエポキシ樹
脂成型体において、前記絶縁体に接触する金属導体の一
部又は全面に加硫接着されたシリコーンコム緩衝層を設
けたことを特徴とするエポキシ樹脂成型体。
An epoxy resin molded product in which a metal conductor is embedded in an epoxy resin insulator, and a silicone comb buffer layer vulcanized and bonded is provided on a part or the entire surface of the metal conductor in contact with the insulator. Resin molded body.
JP1652784U 1984-02-07 1984-02-07 Epoxy resin molded body Pending JPS60127906U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1652784U JPS60127906U (en) 1984-02-07 1984-02-07 Epoxy resin molded body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1652784U JPS60127906U (en) 1984-02-07 1984-02-07 Epoxy resin molded body

Publications (1)

Publication Number Publication Date
JPS60127906U true JPS60127906U (en) 1985-08-28

Family

ID=30503378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1652784U Pending JPS60127906U (en) 1984-02-07 1984-02-07 Epoxy resin molded body

Country Status (1)

Country Link
JP (1) JPS60127906U (en)

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