JPS60127092A - Brazing material - Google Patents
Brazing materialInfo
- Publication number
- JPS60127092A JPS60127092A JP23389483A JP23389483A JPS60127092A JP S60127092 A JPS60127092 A JP S60127092A JP 23389483 A JP23389483 A JP 23389483A JP 23389483 A JP23389483 A JP 23389483A JP S60127092 A JPS60127092 A JP S60127092A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- brazing
- wax
- total
- brazing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
- B23K35/325—Ti as the principal constituent
Abstract
Description
【発明の詳細な説明】
本発明は、Ｔｉ、Ｚｒ基合金用のろう材に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a brazing filler metal for Ti and Zr based alloys.
Ｔｉ、Ｚｒ基合金などをＡｒ又は真空中の雰囲気中でＡ
ｇろう付すると、Ｔ ｉとＡｇの金属間化合物を作り易
く、Ａｇろう中のＡｇ以外のＣｕ。Ti, Zr-based alloys, etc. are heated in Ar or vacuum atmosphere.
When brazing, it is easy to form an intermetallic compound of Ti and Ag, and Cu other than Ag in the Ag brazing.
Ｍｎ等のＴ ｉへの拡散が早いので、ろうの組成変化が
著しくろう旬が極めて難しいものである。Since the diffusion of Mn, etc. into Ti is rapid, the composition of the wax changes significantly, making wax removal extremely difficult.
本発明は斯かる問題をＩＷ消すへくなされたもので、Ｔ
ｉを他の金属にろう付するに用いた際、ろうと金属間化
合物を作らず、ろうのＴ ｉへの極端な拡散も起さず、
ろう流れが良くて融点も低いろう材を提供せんとするも
のである。The present invention has been made to eliminate such problems, and T
When Ti is used to braze other metals, it does not form intermetallic compounds with the solder and does not cause extreme diffusion of the solder into the Ti.
The purpose of the present invention is to provide a brazing filler metal that has good brazing flow and a low melting point.
本発明のろう祠の１つは、Ｔ ｉ ３５〜７５重量％と
Ｃｕ２〜２０重景％とＮｉ３〜３０重量％とＧａ、Ｇｅ
の少なくとも１種を合計で０．５〜２５重量％と ０．
３重量％以下の不可避不純物より成る。One of the wax shrines of the present invention contains 35-75% by weight of Ti, 2-20% of Cu, 3-30% of Ni, and Ga, Ge.
A total of 0.5 to 25% by weight of at least one of: 0.
Consists of 3% by weight or less of unavoidable impurities.
本発明のろう祠の他の１つは、′Ｉ’ ｉ ３５〜７５
ｉ量％とＣｕ２〜２０重里％とＮ ｉ ３〜３０；７ｄ
ｉｉ％とＳ ｒＩ。Another one of the wax shrines of the present invention is 'I' i 35-75
i amount %, Cu2~20 Shigesato% and N i 3~30;7d
ii% and SrI.
Ｉｎの少なくとも１種を合計０．５〜１５重量％と０．
３重量％以下の不可避不純物より成る。A total of 0.5 to 15% by weight of at least one type of In and 0.5% to 15% by weight of In.
Consists of 3% by weight or less of unavoidable impurities.
本発明のろう材の更に他の１つば、−ｆ’ ｉ ３５〜
７５重量％とＣｕ２〜２０重量％とＮｉ３〜３０重量％
とＧ’ａ 、 （Ｊ ｅの少なくとも１種を合計で０．
５〜２５重址％とＳｎ、Ｉｎの少なくとも１種を合計で
０．５〜１５市量％と０，３重量％以下の不可避不純物
より成る。Yet another brim of the brazing filler metal of the present invention, -f' i 35~
75% by weight, 2-20% by weight of Cu, and 3-30% by weight of Ni.
and G'a, (Je) with a total of 0.
It consists of 5 to 25 weight percent, at least one of Sn and In in total, 0.5 to 15 weight percent, and 0.3 weight percent or less of unavoidable impurities.
これら本発明のろう材に於いて、”Ｉ” ｉ ３５〜７
５重量％とじたのは、ろ・う付するＴ ＋ 、Ｚ ｒ基
合金等の近イ声の組織のろう付部を得る為で、３５重量
％未ｌ茜ではそれができず、７５重量％を超えると母材
との化合物を作り易く、拡散が早くてろう付が困Ｈとな
る。In these brazing materials of the present invention, "I" i 35 to 7
The reason for adding 5% by weight was to obtain a brazed part with a structure similar to that of T+, Zr-based alloys, etc., which is to be brazed. If it exceeds %, it is easy to form a compound with the base material, and diffusion is rapid, making brazing difficult.
Ｃｕ２〜２０Ｌｆｆ量％としたのは、ろうの融点を低く
する為で、２重量％未満ではろうの融点が低くならず、
ろう流れが悪くなり、２０重量％を超えると′］゛ｉと
もろい化合物を作り、ろう付部の強度が低下することに
なる。The reason why the amount of Cu is 2 to 20 Lff is to lower the melting point of the wax, and if it is less than 2% by weight, the melting point of the wax will not be lowered.
If the amount exceeds 20% by weight, a brittle compound will be formed and the strength of the brazed portion will be reduced.
Ｎｉ３〜３０重量％としたのは、Ｔｉへのろう拡散を防
Ｊ１３゛る為とろうの流れ過きを防く為で、３型開％未
八でし、１それかできず、３０市量％を超えるとろうの
副：点が上がり、ろっ流れが悪くなる。The reason why Ni was set at 3 to 30% by weight was to prevent the diffusion of wax into Ti and to prevent the flow of wax. If the amount exceeds the amount %, the waxy vice: the score will increase and the flow will become worse.
Ｇａ、Ｇｅの少なくとも１種を合計で０．５〜２５重量
％とじたのは、ろうの融点を低くし、ろ・う流れを良く
する為で、０，５重量％未ｌ＾δではそれができず、２
５重量％を超えると加」ニ性が悪くなる。The reason why at least one of Ga and Ge is added in a total of 0.5 to 25% by weight is to lower the melting point of the wax and improve the flow of the wax. 2
If it exceeds 5% by weight, the adhesion properties will deteriorate.
Ｓｎ、Ｉｎの少なくとも１種を合計０．５〜１５重量％
としたのはＧａ、Ｇｅの場合と同様ろうの融点を低くし
、ろう流れを良くする為で、０．５車量％未満でばそれ
ができず、１５重量％を超えると加工性が悪くなる。A total of 0.5 to 15% by weight of at least one of Sn and In
The reason for this is to lower the melting point of the solder and improve the flow of the solder as in the case of Ga and Ge, but if it is less than 0.5% by weight, this cannot be achieved, and if it exceeds 15% by weight, the processability is poor. Become.
次に本発明のろう材の具体的な実施例と従来例について
説明する。Next, specific examples and conventional examples of the brazing filler metal of the present invention will be described.
下記の表−１に示す成分組成の実施例１〜３のろう材と
従来例のろう材を用いてステンレス鋼にＴｉをろう何す
る試験を行った処、下記の表−２に示すような結果を得
た。A test was conducted to braze Ti onto stainless steel using the brazing fillers of Examples 1 to 3 and the conventional brazing filler metal with the compositions shown in Table 1 below, and the results were as shown in Table 2 below. Got the results.
表−１
表−２
上記の表−２の結果で明らか゛なように従来例のろう祠
ではろう付部にＴｉとの金属間化合物が多かったのに対
し、実施例１〜３のろう＋Ｊではろう４１部にｉ” ｉ
化合物が無いことが判る。また実施例１〜３のろう材は
、−ろうの流動性が従来例のろう祠に比べて優れ、しか
も実施例１〜３のろう祠は従来例のろう祠よりも著しく
融点が低いことが判る。Table 1 Table 2 As is clear from the results in Table 2 above, in the conventional brazing area, there were many intermetallic compounds with Ti in the brazed area, whereas in Examples 1 to 3, there were many intermetallic compounds with Ti. +J to Deaf 41 section i”i
It turns out that there is no compound. In addition, the brazing fillers of Examples 1 to 3 have superior fluidity compared to the conventional brazing pads, and the melting points of the brazing pads of Examples 1 to 3 are significantly lower than that of the conventional brazing pads. I understand.
以上の説明で判るように本発明のろう祠は、Ｔｉをろう
（＝Ｊするのに用いた際、脆い金属間化合物を作らず、
ろうの組成か著しく変化するような拡散もなく、またろ
うの流動性に優れ、しがも融点が著しく低くてろう付作
業が容易であるので、従来のろう材にとって代わること
のできる画期的なものと云える。As can be seen from the above explanation, the brazing shrine of the present invention does not create brittle intermetallic compounds when Ti is used for brazing (=J).
There is no diffusion that would significantly change the composition of the solder, the fluidity of the solder is excellent, and the melting point is extremely low, making it easy to braze, making it an innovative product that can replace conventional brazing materials. It can be said that it is something.
出願人 田中貴金属工業株式会社Applicant Tanaka Kikinzoku Kogyo Co., Ltd.
Claims (1)
重量％とＮｉ３〜３０市量％とＧａ、−Ｇｅの少なくと
も１種を合計で０．５〜２５重量％と不可避不純物より
成るろう祠。 ２ ） ｉ’ ｉ ３５〜７５ｆｆｉ Ｆｉｔ％とＣｕ
２〜２０重量％とＮｉ３〜３０市贋％とＳｎ、ｌｎの少
なくとも１種を合計で０．５〜１５重量％と、不可避不
純物より成るろう月。 ３ ） ｉ’ ｉ ３５〜７５重量％とＣｕ２〜２０重
量％とＮｉ３〜３（川［％とＧａ、Ｇｅの少なくとも１
種を合計で０．５〜２５重量％とＳｎ、Ｉｎの少なくと
も１■・ｌ（を合ｄ１で０．５〜１５重量％と不可避不
純物より成るろう（、イ。[Claims] 1) 'T' i 35-75i amount% and Cu2-20
% by weight of Ni, 3-30% by market weight of Ni, a total of 0.5-25% by weight of at least one of Ga and -Ge, and unavoidable impurities. 2) i'i 35~75ffi Fit% and Cu
2 to 20% by weight of Ni, 3 to 30% of Ni, and at least one of Sn and In in a total of 0.5 to 15% by weight, and unavoidable impurities. 3) i'i 35 to 75 wt%, Cu2 to 20 wt%, Ni3 to 3 (River [% and at least 1 of Ga, Ge
A wax consisting of a total of 0.5 to 25% by weight of seeds and at least 1.1 cm of Sn and In (total of 0.5 to 15% by weight of d1 and unavoidable impurities).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23389483A JPS60127092A (en) | 1983-12-12 | 1983-12-12 | Brazing material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23389483A JPS60127092A (en) | 1983-12-12 | 1983-12-12 | Brazing material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60127092A true JPS60127092A (en) | 1985-07-06 |
Family
ID=16962231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23389483A Pending JPS60127092A (en) | 1983-12-12 | 1983-12-12 | Brazing material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60127092A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0238433A2 (en) * | 1986-02-18 | 1987-09-23 | United Technologies Corporation | Titanium-copper-nickel braze filler metal |
| US7419086B2 (en) * | 2003-07-14 | 2008-09-02 | Honeywell International Inc. | Low cost brazes for titanium |
| US8834347B2 (en) | 2008-08-22 | 2014-09-16 | Dymedix Corporation | Anti-habituating sleep therapy for a closed loop neuromodulator |
| US11178497B2 (en) | 2017-06-23 | 2021-11-16 | USound GmbH | In-ear receiver |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5811389A (en) * | 1981-07-02 | 1983-01-22 | キヤリア・コ−ポレイシヨン | High-performance heat-transfer pipe and its manufacture |
-
1983
- 1983-12-12 JP JP23389483A patent/JPS60127092A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5811389A (en) * | 1981-07-02 | 1983-01-22 | キヤリア・コ−ポレイシヨン | High-performance heat-transfer pipe and its manufacture |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0238433A2 (en) * | 1986-02-18 | 1987-09-23 | United Technologies Corporation | Titanium-copper-nickel braze filler metal |
| US7419086B2 (en) * | 2003-07-14 | 2008-09-02 | Honeywell International Inc. | Low cost brazes for titanium |
| US8834347B2 (en) | 2008-08-22 | 2014-09-16 | Dymedix Corporation | Anti-habituating sleep therapy for a closed loop neuromodulator |
| US8834346B2 (en) | 2008-08-22 | 2014-09-16 | Dymedix Corporation | Stimulus sequencer for a closed loop neuromodulator |
| US11178497B2 (en) | 2017-06-23 | 2021-11-16 | USound GmbH | In-ear receiver |
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