JPS6012175A - Coating liquid supplying method - Google Patents
Coating liquid supplying methodInfo
- Publication number
- JPS6012175A JPS6012175A JP11859783A JP11859783A JPS6012175A JP S6012175 A JPS6012175 A JP S6012175A JP 11859783 A JP11859783 A JP 11859783A JP 11859783 A JP11859783 A JP 11859783A JP S6012175 A JPS6012175 A JP S6012175A
- Authority
- JP
- Japan
- Prior art keywords
- coating liquid
- coating
- closed container
- container
- treated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】
本発明はガスの圧力を利用して、被処理体上に塗布液を
滴下供°給する方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for supplying a coating liquid dropwise onto an object to be treated using gas pressure.
一般にシリコンクエバー、ガラスなどの被処理体表面に
、ホトレジスト膜、不純物拡散剤膜、光学用被膜或いは
保護被膜を形成するには、塗布液を入れた密閉容器内に
チッ素ガスを導入して容器内を高圧とし、この圧力で容
器内の塗布液を供給管を介して圧送し、被処理体上に滴
下する方法が採られてい□る。Generally, to form a photoresist film, an impurity diffusing agent film, an optical film, or a protective film on the surface of a workpiece such as silicon quaver or glass, nitrogen gas is introduced into a sealed container containing a coating solution. A method is adopted in which the pressure inside the container is set at high pressure, and the coating liquid in the container is pumped through a supply pipe using this pressure and dripped onto the object to be treated.
そして、上記塗布液がトルエン・キシレンなどの比較的
極性の弱い溶媒を用いて調整されている場合には問題は
生じないが、ポジ型ホトレジスト系膜、不純物拡散剤膜
、保護膜或いは光学用被膜を形成する・場合には、一般
にアルコール系、ケトン系、・・ロゲン化炭化水素系、
エステル系、エーテル系、含チツ素系、含イオン系或い
は含リン系などの極性の強い溶媒を用いており、この場
合には以下の如き不具合がある。If the above coating solution is prepared using a relatively weakly polar solvent such as toluene or xylene, no problem will occur, but if the coating solution is a positive photoresist film, an impurity diffusion agent film, a protective film, or an optical coating. In general, alcohol-based, ketone-based, logenated hydrocarbon-based,
Strongly polar solvents such as ester-based, ether-based, nitrogen-containing, ion-containing, or phosphorus-containing solvents are used, and in this case, the following problems occur.
即ち、密閉容器内をチッ素ガスによって高圧にすると、
一定温度で一定量の液体に溶解する気体の質量はその気
体の圧力に比例するというヘンリーの法則から、高圧に
すればそれだけ塗布液に溶解するチッ素ガスの量が多く
なジ、特にチッ素ガスのオストワルド吸収係数(溶解度
)は高く、そのため多量に溶解することとなる。そして
、塗布液は供給管を介して常圧状態で被処理体の表面に
滴下されるため、滴下時には塗布液中に過飽和の状態で
溶解していたチッ素ガスが微細な気泡となって発生し、
この気泡を有したまま塗布されることで、気泡が被膜中
に固定される。In other words, when the inside of the sealed container is made high pressure with nitrogen gas,
Henry's law states that the mass of a gas dissolved in a certain amount of liquid at a certain temperature is proportional to the pressure of that gas, so the higher the pressure, the more nitrogen gas will dissolve in the coating liquid. The Ostwald absorption coefficient (solubility) of the gas is high, and therefore a large amount will be dissolved. Since the coating liquid is dripped onto the surface of the workpiece through the supply pipe under normal pressure, the nitrogen gas dissolved in the coating liquid in a supersaturated state forms fine bubbles when it is dripped. death,
The air bubbles are fixed in the film by being applied with the air bubbles still present.
その結果、ピンホール或いは塗布ムラが生じ、これが製
品歩留りの低下につながっている。As a result, pinholes or uneven coating occur, which leads to a decrease in product yield.
これを解決すべく、塗布液の供給管の途中にトラップを
設け、圧送途中にて気泡を除去することが考えられるが
、装置自体複雑となり、しかも気泡の除去を完全に行な
えないという不利がある。In order to solve this problem, it is possible to install a trap in the middle of the coating liquid supply pipe and remove air bubbles during pressure feeding, but this has the disadvantage that the device itself is complicated and it is not possible to completely remove air bubbles. .
本発明は上述した問題に鑑みなしたものであり、その目
的とする処は塗布装置に何ら特別な部材等を付設するこ
となく、塗布液中への溶存ガスの量を可及的に少なくし
、もって塗布時に気泡の発生を防止し、ピンホール或い
は塗布ムラのない製品が得られる塗布液の供給方法を提
供するにある。The present invention was developed in view of the above-mentioned problems, and its purpose is to reduce the amount of dissolved gas in the coating liquid as much as possible without adding any special parts to the coating device. It is an object of the present invention to provide a method for supplying a coating liquid that prevents the generation of air bubbles during coating and allows a product without pinholes or uneven coating to be obtained.
斯る目的を達成すべく本発明は、密閉容器内に極性の強
い溶媒を用いた塗布液を入れ、この密閉容器内に高圧ガ
ス導入管を介して溶解度の小さいヘリウムガス又はネオ
ンガスを供給し、このガス圧によって塗布液を供給管を
弁じて圧送するようにしたことを要旨とする。In order to achieve such an object, the present invention includes placing a coating solution using a highly polar solvent in a closed container, supplying helium gas or neon gas with low solubility into the closed container via a high-pressure gas introduction pipe, The gist of the present invention is that the coating liquid is pumped through the supply pipe using this gas pressure.
以下に本発明の実施例を添付図面に基づいて説明する。Embodiments of the present invention will be described below based on the accompanying drawings.
図中1は密閉容器、2はスピンナーであり、密閉容器1
内には極性の強い溶媒により調整された塗布液3が充填
され、スピンナー2の有底筒状体4には下方から回転軸
5が挿通され、この回転軸5の先端部にはスピンナーヘ
ッド6を取付け、このスピンナーヘッド6上にシリコン
ウェハーなどの被処理体1が載置される。In the figure, 1 is a sealed container, 2 is a spinner, and the sealed container 1
The inside is filled with a coating liquid 3 adjusted with a highly polar solvent, and a rotating shaft 5 is inserted from below into the bottomed cylindrical body 4 of the spinner 2, and a spinner head 6 is attached to the tip of the rotating shaft 5. The object to be processed 1 such as a silicon wafer is placed on the spinner head 6 .
一方、密閉容器1内には高圧ガス導入管8及び塗布液の
供給管9が挿通され、高圧ガス導入管8の下端部は塗布
液3の液面よジも上方に位置せしめられ、供給管9の下
端部は液面よりも下方で密閉容器1の底面近傍に位置せ
しめられている。また供給管9の他端部には塗布液滴下
用のノズル1゜が取付けられ、このノズル10がスピン
ナーヘッド6上方に臨んでいる。更に、供給管9の中間
部には高圧空気等によって駆動する弁11及び塗布を停
止した後に塗布液がボタ落ちするのを防止するサックバ
ック機構12が設けられている。On the other hand, a high-pressure gas introduction pipe 8 and a coating liquid supply pipe 9 are inserted into the closed container 1, and the lower end of the high-pressure gas introduction pipe 8 is positioned above the liquid level of the coating liquid 3, and the supply pipe The lower end of the container 9 is located below the liquid level and near the bottom of the closed container 1. A nozzle 1° for dropping the coating liquid is attached to the other end of the supply pipe 9, and this nozzle 10 faces above the spinner head 6. Furthermore, a valve 11 driven by high-pressure air or the like and a suck-back mechanism 12 for preventing the coating liquid from dripping after coating is stopped are provided in the middle of the supply pipe 9.
以上において、密閉容器1内に塗布液3t−充填して静
置することで脱泡し、これと同時にスピンナーヘッド6
上に被処理体7を載置し真空吸着する。斯る状態から高
圧ガス導入管8を介して密閉容器1内にヘリウムガス又
はネオンガスを導入し、密閉容器1内を高圧にする。次
いで、弁11を作動させて供給管9全体、っまり密閉容
器1からノズル10に至る供給管9内に塗布液3を充填
した後、一旦弁11を閉じる。この抜弁11を開き、ノ
ズル10から被処理体1表面に塗布液3′ft滴下する
とともに、スピンナー2の回転軸5を回転せしめる。す
ると滴下された塗布液3は遠心力によって被処理体1表
面に均一な厚さに塗布される。In the above process, the sealed container 1 is filled with 3t of coating liquid and left to stand to defoam, and at the same time, the spinner head 6
The object to be processed 7 is placed on top and vacuum-adsorbed. From this state, helium gas or neon gas is introduced into the closed container 1 through the high-pressure gas introduction pipe 8 to make the inside of the closed container 1 high pressure. Next, the valve 11 is operated to fill the entire supply pipe 9 from the closed container 1 to the nozzle 10 with the coating liquid 3, and then the valve 11 is temporarily closed. The extraction valve 11 is opened, and 3'ft of the coating liquid is dripped from the nozzle 10 onto the surface of the object 1 to be treated, and the rotating shaft 5 of the spinner 2 is rotated. Then, the dropped coating liquid 3 is applied to the surface of the object to be processed 1 to a uniform thickness by centrifugal force.
ここで、密閉容器1内に導入される加圧用ガスは、溶解
度の小さなヘリウムガス或はネオンガスであるため、密
閉容器1内の圧を高めても極めて僅かしか塗布液3に溶
解せず、したがって滴下時に常圧状態に戻されても塗布
液3中の気泡の発生を抑制でき、塗布液3は被処理体7
辰面に均一に塗布される。Here, since the pressurizing gas introduced into the closed container 1 is helium gas or neon gas with low solubility, even if the pressure inside the closed container 1 is increased, only a very small amount dissolves in the coating liquid 3. Even if the pressure is returned to the normal pressure state during dropping, the generation of bubbles in the coating liquid 3 can be suppressed, and the coating liquid 3 can be applied to the object 7 to be treated.
It is applied evenly to the dragon face.
以上に説明した如く本発明によれば、極性の強い溶媒を
用いて塗布液を調整し、この塗布液を加圧することで圧
送し、常圧下において被処理体表面に滴下するようにし
ても、被処理体表面の塗布液には気泡の発生はなく、し
たがって後にピンホールや塗布ムラなどの不利が生じる
ことがない。As explained above, according to the present invention, even if a coating liquid is prepared using a highly polar solvent, the coating liquid is fed under pressure, and is dripped onto the surface of the object to be treated under normal pressure, No air bubbles are generated in the coating liquid on the surface of the object to be treated, so that disadvantages such as pinholes and uneven coating do not occur later.
したがって製品の歩留りを大巾に同上でき、更に以上を
特別な装置例えばトラップ等を設けることなく達成でき
る等多くの効果を発揮する。Therefore, the product yield can be greatly increased, and the above can be achieved without providing any special equipment such as a trap.
【図面の簡単な説明】
図面は本発明方法を実施するための塗布装置の概略側面
図である。
尚、図面中1は密閉容器、2はスピンナー、3は塗布液
、7は被処理体、8は尚圧ガス導入管、9は塗布液の供
給管、10はノズルである。BRIEF DESCRIPTION OF THE DRAWINGS The drawing is a schematic side view of a coating device for carrying out the method of the invention. In the drawings, 1 is a closed container, 2 is a spinner, 3 is a coating liquid, 7 is an object to be processed, 8 is a pressure gas introduction pipe, 9 is a coating liquid supply pipe, and 10 is a nozzle.
Claims (1)
とともに、該密閉容器内に高圧ガス導入管及び塗布液供
給管を臨ませ、該高圧ガス導入管の下端部を塗布液の液
面よりも上方に、該塗布液供給管の下端部を塗布液の液
面よりも下方に位置せしめ、次いで高圧ガス導入管を介
して密閉容器内にヘリウムガス又はネオンガスを導入し
て密閉容器内を高圧とし、密閉容器内の圧により塗布液
を供給管を介して被処理体表面に滴下するようにしたこ
とを特徴とする塗布液の供給方法。A coating liquid using a highly polar solvent is filled into a closed container, and a high-pressure gas introduction pipe and a coating liquid supply pipe are placed inside the sealed container, and the lower end of the high-pressure gas introduction pipe is connected to the surface of the coating liquid. The lower end of the coating liquid supply pipe is positioned below the liquid level of the coating liquid, and then helium gas or neon gas is introduced into the sealed container through the high-pressure gas introduction pipe to fill the inside of the sealed container. A method for supplying a coating liquid, characterized in that the pressure is high and the coating liquid is dripped onto the surface of an object to be treated through a supply pipe using the pressure inside a closed container.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11859783A JPS6012175A (en) | 1983-06-30 | 1983-06-30 | Coating liquid supplying method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11859783A JPS6012175A (en) | 1983-06-30 | 1983-06-30 | Coating liquid supplying method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6012175A true JPS6012175A (en) | 1985-01-22 |
JPH0152065B2 JPH0152065B2 (en) | 1989-11-07 |
Family
ID=14740511
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11859783A Granted JPS6012175A (en) | 1983-06-30 | 1983-06-30 | Coating liquid supplying method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6012175A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5599394A (en) * | 1993-10-07 | 1997-02-04 | Dainippon Screen Mfg., Co., Ltd. | Apparatus for delivering a silica film forming solution |
KR100807667B1 (en) * | 2002-07-25 | 2008-03-03 | 주식회사 포스코 | Insulation coating liquid supplying device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4958775A (en) * | 1972-10-04 | 1974-06-07 | ||
JPS55108741A (en) * | 1979-02-15 | 1980-08-21 | Pioneer Electronic Corp | Resist coating device |
JPS56106451U (en) * | 1980-01-16 | 1981-08-19 |
-
1983
- 1983-06-30 JP JP11859783A patent/JPS6012175A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4958775A (en) * | 1972-10-04 | 1974-06-07 | ||
JPS55108741A (en) * | 1979-02-15 | 1980-08-21 | Pioneer Electronic Corp | Resist coating device |
JPS56106451U (en) * | 1980-01-16 | 1981-08-19 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5599394A (en) * | 1993-10-07 | 1997-02-04 | Dainippon Screen Mfg., Co., Ltd. | Apparatus for delivering a silica film forming solution |
KR100807667B1 (en) * | 2002-07-25 | 2008-03-03 | 주식회사 포스코 | Insulation coating liquid supplying device |
Also Published As
Publication number | Publication date |
---|---|
JPH0152065B2 (en) | 1989-11-07 |
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