JPS60121065A - はんだ付け装置におけるフラツクス発泡装置 - Google Patents

はんだ付け装置におけるフラツクス発泡装置

Info

Publication number
JPS60121065A
JPS60121065A JP22857783A JP22857783A JPS60121065A JP S60121065 A JPS60121065 A JP S60121065A JP 22857783 A JP22857783 A JP 22857783A JP 22857783 A JP22857783 A JP 22857783A JP S60121065 A JPS60121065 A JP S60121065A
Authority
JP
Japan
Prior art keywords
flux
pipe
tank
foam
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22857783A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0116236B2 (https=
Inventor
Kenji Kondo
近藤　権士
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Den Netsu Keiki Co Ltd
Original Assignee
Nihon Den Netsu Keiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Den Netsu Keiki Co Ltd filed Critical Nihon Den Netsu Keiki Co Ltd
Priority to JP22857783A priority Critical patent/JPS60121065A/ja
Publication of JPS60121065A publication Critical patent/JPS60121065A/ja
Publication of JPH0116236B2 publication Critical patent/JPH0116236B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/082—Flux dispensers; Apparatus for applying flux

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP22857783A 1983-12-05 1983-12-05 はんだ付け装置におけるフラツクス発泡装置 Granted JPS60121065A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22857783A JPS60121065A (ja) 1983-12-05 1983-12-05 はんだ付け装置におけるフラツクス発泡装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22857783A JPS60121065A (ja) 1983-12-05 1983-12-05 はんだ付け装置におけるフラツクス発泡装置

Publications (2)

Publication Number Publication Date
JPS60121065A true JPS60121065A (ja) 1985-06-28
JPH0116236B2 JPH0116236B2 (https=) 1989-03-23

Family

ID=16878542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22857783A Granted JPS60121065A (ja) 1983-12-05 1983-12-05 はんだ付け装置におけるフラツクス発泡装置

Country Status (1)

Country Link
JP (1) JPS60121065A (https=)

Also Published As

Publication number Publication date
JPH0116236B2 (https=) 1989-03-23

Similar Documents

Publication Publication Date Title
US5082518A (en) Sparger plate for ozone gas diffusion
JPS6051939B2 (ja) 噴流式はんだ槽
US2389175A (en) Method of making heat exchange apparatus
US6332927B1 (en) Substrate processing apparatus
JPS5596892A (en) Heat transfer plate for plate type evaporator
US4602730A (en) Device for soldering printed board
JPS60121065A (ja) はんだ付け装置におけるフラツクス発泡装置
SU937932A1 (ru) Аппарат дл термообработки сыпучих материалов
JPS6246233B2 (https=)
JPH02295673A (ja) フラックス塗布装置
JPS6243665Y2 (https=)
US3648576A (en) Temporarily reducing the diametrical opening of apertures by use of a removable annular member
JP2842095B2 (ja) フラックス塗布装置
JPS6121175Y2 (https=)
JP2004195539A (ja) ハンダ付け装置
JPH0447862U (https=)
JP2000323826A (ja) 噴流はんだ槽
JPS59189072A (ja) フラツクス塗布装置
JPH10313171A (ja) はんだ付け装置
JPS5922933Y2 (ja) はんだ付け装置
JPS63122765U (https=)
JPS63156910A (ja) 燃焼装置
JPS6118660A (ja) ストリツプの浮上装置
JPH0221942B2 (https=)
JPS5793521A (en) Jig for accomodating wafer