JPS60119720A - Electron beam exposure - Google Patents

Electron beam exposure

Info

Publication number
JPS60119720A
JPS60119720A JP58227710A JP22771083A JPS60119720A JP S60119720 A JPS60119720 A JP S60119720A JP 58227710 A JP58227710 A JP 58227710A JP 22771083 A JP22771083 A JP 22771083A JP S60119720 A JPS60119720 A JP S60119720A
Authority
JP
Japan
Prior art keywords
pattern
patterns
electron beam
pitch
sections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58227710A
Other languages
Japanese (ja)
Inventor
Shinichi Ono
伸一 小野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Priority to JP58227710A priority Critical patent/JPS60119720A/en
Publication of JPS60119720A publication Critical patent/JPS60119720A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electron Beam Exposure (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

PURPOSE:To obtain stably a picture having no streaky blotch when the pattern of the light receiving part of a charge transfer device for an image sensor provided repetitively with fundamental patterns of a large number is to be divided into fine sections of a large number at an electron beam exposure device by a method wherein the divided patterns are made to have a fixed repetition in the scanning direction of an electron beam, and moreover the pitch thereof is made to coincide with the pitch of the fundamental patterns. CONSTITUTION:The pattern of the light receiving part of a CCD is constituted of stripe type first patterns 11 stretching in the perpendicular direction to the scanning direction of an electron beam and cross-shaped second patterns 12 positioning between the formers, and the patterns thereof are repeated at a fixed pitch. While, an electron beam exposure device also divides the pattern into fine sections, the pattern is exposed to be drawn at every fine section thereof, and when the pattern of the light receiving part of the CCD is formed in such a way, butting error is not generated. At this construction, when the repetition pitch of the patterns 11, 12 is indicated by (a), and sizes of the fine sections 14, 15 in the scanning direction are indicated by (b), (c), sizes of the sections 14, 15 are decided as to satisfy the equation a=b+c.

Description

【発明の詳細な説明】 この発明rrs、CCD、BBD等のイメージセンサと
して用いられる重荷転送デ/くイスの受光部のパターン
を、市、子ビーム露光装置2用(・てレチクル素材、フ
ォトマスクブランク、或’v11tシIJコンウェハー
等に露光描画する方法に関才るものである。
DETAILED DESCRIPTION OF THE INVENTION The pattern of the light-receiving part of the heavy transfer device used as an image sensor such as RRS, CCD, BBD, etc. of this invention can be used for the laser beam exposure device 2 (reticle material, photomask etc.). He is concerned with methods of exposing and drawing on blanks, IJ condensed wafers, etc.

゛電子ビーム露光装置な用いて、イメージセンサ用電荷
転送デバイスの受光部のパターンをフォトマスクブラン
ク等に露光描1.I!]ifるにおいては、他の半導体
回路のパターンと同様、このパターンを微小区画(例え
ば256μfiX2048μmの地形状)に分割し、こ
の区画単位に電子ビームの走査を行なってパターン表描
画している。
1. Using an electron beam exposure device, the pattern of the light receiving part of the charge transfer device for an image sensor is exposed and drawn on a photomask blank or the like. I! ], similarly to other semiconductor circuit patterns, this pattern is divided into minute sections (for example, 256 .mu.fi x 2048 .mu.m topography), and the pattern table is drawn by scanning each section with an electron beam.

このような露光描画方法によれば、微小区画の境界にお
いて一般にバッティングエラーと称されるパターン異常
が発生することが知られている。
According to such an exposure drawing method, it is known that a pattern abnormality generally referred to as a batting error occurs at the boundaries of minute sections.

このバッティングエラーについて第1図に基づき説明丁
4tば、電子ビームの副走査方向と平行なストライプ状
のパターン1を描画1−るものとすると、前述したよう
にこのパターンI、ま電子ビーム露光装置の機能に依存
してば子ビーム走査方向に256μmのピッチをもって
分割された微小区画3.6.3・・・別に描画されるも
のであり、このために隣合う2つの区画の境界線4,4
.4・・・においてパターン異常2.2.2・・が発生
する。第1図に示されたパターン異常2,2.2・・・
は境界線においてパターンが突出する形で現われたもの
であるが、これ以外に境界線において陥没するパターン
異常、或いは境界線において上下方向に湾曲するパター
ン異常等が知られている。なお、当然ながら境界線にパ
ターンが存在しないイはパターン異常は生じない。この
ようなパターン異常、即ちバッティングエラー’r’!
、パターンの一種の変形であるが、CI) U 、メモ
リ等の一般の半導体集積回路において’t′i断線、短
絡と異なりこのような変形が生じても性能上は何等問題
がないために無視されているのが現状である。
This batting error will be explained based on FIG. The micro sections 3.6.3 are divided at a pitch of 256 μm in the beam scanning direction depending on the function of the bar beam. 4
.. 4..., pattern abnormality 2.2.2... occurs. Pattern abnormality 2, 2.2... shown in Figure 1
The pattern appears in a protruding form at the boundary line, but other pattern abnormalities are also known, such as a depression in the boundary line or a pattern abnormality in which the boundary line curves in the vertical direction. Note that, of course, no pattern abnormality occurs in case A where no pattern exists on the boundary line. Such a pattern abnormality, that is, batting error 'r'!
, is a type of deformation of the pattern, but unlike 't'i disconnection or short circuit in general semiconductor integrated circuits such as memory, even if such deformation occurs, there is no problem in terms of performance, so it can be ignored. The current situation is that

ところが、イメージセンサとして用いられるCCD、B
BD等の電荷転送デバイスの受光部のパターンは基本パ
ターンの繰り返しパターンであり、このパターンを前記
したように微小区画に分けて露光描画するとパターンの
種類によっては例工(tf、 2 mn、5聴程度の周
期でバッティングエラーが発生して目視検査でスジムラ
が認められることがある。
However, the CCD used as an image sensor, B
The pattern of the light-receiving part of a charge transfer device such as a BD is a repeating basic pattern, and if this pattern is divided into minute sections and exposed and drawn as described above, depending on the type of pattern, it will be Batting errors may occur at regular intervals, and uneven streaks may be observed during visual inspection.

かかるスジムラが発生した電荷転送デバイスを用いて撮
影すると、ディスプレイ上にも同様にスジムラが発生す
るために、品質上の大きな問題となっている。
When a charge transfer device with such uneven streaks is used to take an image, the uneven streaks also occur on the display, which poses a major quality problem.

この発明は、上記問題点を解決すべくなされたものであ
り、電子ビーム露光装置な用いて直性転送デバイスの受
光部のパターン(基本パターンの繰り返しパターン)を
露光描画するにおいて、当該パターンがいかなる基本パ
ターンの繰り返し形状であっても目視検査でスジムラが
認められず。
This invention has been made to solve the above-mentioned problems, and when a pattern (a repeating pattern of a basic pattern) of a light-receiving part of a direct transfer device is exposed and drawn using an electron beam exposure device, the pattern is Even with the repeating basic pattern, no uneven streaks were observed during visual inspection.

かつこの電荷転送デバイスを用いて撮影して得られた両
像ナディスプレイ上に映し出した場合にも視覚的にスジ
ムラが発生することのない電子ビームの露光方法を提供
することを目的とするものである。
The object of the present invention is to provide an electron beam exposure method that does not visually cause uneven streaks even when both images obtained by photographing using this charge transfer device are projected on a display. be.

かかる目的を達成すべくなされたこの発明は。This invention was made to achieve this purpose.

バッティングエラーによるスジムラが発生しても人間の
目で見分けられない程度の短いピッチで発生させれば視
覚的にはスジムラが存在しているとIは感じなくなるこ
とに着目し、その手段として電子ビームの走査方向に一
定の繰り返しをもつように繰り返しパターンを微小区画
に分割し、かっこの微小区画の繰り返しピッチが繰り返
しパターン!7) 、Q 本パターンの繰り返しピッチ
に一致するように設定してパターンのTrn光描画を行
なうことを特徴とする電子ビームの露光方法である。
We focused on the fact that even if uneven streaks occur due to batting errors, if they occur at a pitch so short that they cannot be discerned by the human eye, the user will no longer feel that uneven streaks exist visually, and as a means to do so, we used an electron beam. The repeating pattern is divided into minute sections so that it has a constant repetition in the scanning direction, and the repeating pitch of the minute sections in parentheses is the repeating pattern! 7) , Q This is an electron beam exposure method characterized by performing Trn light writing of a pattern by setting it to match the repetition pitch of the main pattern.

以下に、この発明を図面の実施例に基づき詳細に説明す
る。
Hereinafter, the present invention will be explained in detail based on embodiments of the drawings.

第2図は電荷転送デバイスの一種であるCCDの受光部
のパターンの説明図である。
FIG. 2 is an explanatory diagram of a pattern of a light receiving section of a CCD, which is a type of charge transfer device.

このパターンハ市、子ビーム走査方向と直交する方向に
延I′f′するストライプ状の第1のパターン11とこ
の第1のパターン間に存在′1−る十字形状の第2のパ
ターン12とから構成され、電子ビーム定食方向にこの
基本パターンである第1のパターン12と第2のパター
ン13とが一定のピッチで繰り返されている。他方、前
述した如く電子ビーム露光装置はパターンを微小区画に
分割して、その微小区画別にパターンを露光描画づ−る
ものであるので、隣り合う微小区画の境界線上にパター
ンが存在すればその位置においてパターン異常が生じ、
バッティングエラーが発生する。
This pattern includes a striped first pattern 11 extending in a direction perpendicular to the child beam scanning direction, and a cross-shaped second pattern 12 existing between the first patterns. A first pattern 12 and a second pattern 13, which are basic patterns, are repeated at a constant pitch in the direction of the electron beam set meal. On the other hand, as mentioned above, the electron beam exposure apparatus divides the pattern into minute sections and exposes and draws the pattern for each minute section, so if a pattern exists on the boundary line between adjacent minute sections, the position of the pattern can be changed. A pattern abnormality occurs in
A batting error occurs.

こ−の発明で1.ま、露光描画すべきパターンを電子ビ
ームの走査方向に一定の繰り返しをもつように微小区画
に分割し、かつこの微小区画の繰り返しピッチが前記基
本パターン11.12の繰り返しピッチに一致するよう
に設定して、バッティングエラーによるパターンの異常
が常に基本パターンの一定位置に現われるようにする。
With this invention, 1. Also, the pattern to be exposed and drawn is divided into minute sections so as to have a constant repetition in the scanning direction of the electron beam, and the repetition pitch of these minute sections is set to match the repetition pitch of the basic pattern 11 and 12. Thus, pattern abnormalities caused by batting errors always appear at a fixed position in the basic pattern.

第2図に示されている実施例においては、基本パターン
11.12の繰り返しピッチをaとし、微小区画14.
15の各々の電子ビーム走査方向の寸法’&b、cとす
ると、a = b + cの関係となるように微小区画
14.15の大きさを決定する。
In the embodiment shown in FIG. 2, the repetition pitch of the basic patterns 11.12 is a, and the microdivisions 14.12 are repeated at a pitch.
Assuming that the dimensions in the electron beam scanning direction of each of the micro sections 14 and 15 are '&b and c, the sizes of the micro sections 14 and 15 are determined so as to satisfy the relationship a = b + c.

これにより、隣り合う微小区画の境界線17が常に基本
パターン12の一定位置に存在することになり、従って
常にこの位置匠バッティングエラ=13が現われ、他に
はバッティングエラーは現われない。
As a result, the boundary line 17 between adjacent micro-divisions always exists at a certain position in the basic pattern 12, and therefore, a batting error = 13 always appears at this position, and no other batting errors appear.

なお、境界線16におけるバッティングエラーr「まこ
の第1のパターン11の上下W:ij部にのみ現われ、
第2図の如くのパターンの中間部には発生しない。また
、微小区−114,15の電子ビーム柵走査方向の位相
及び寸法す、cな適当に決めることによって、その境界
線上にパターンが存在しないようにも設定することがで
き、当然この場合に1はバッティングエラーは発生する
ことはない。
It should be noted that the batting error r at the boundary line 16 "appears only in the upper and lower W:ij parts of Mako's first pattern 11,
It does not occur in the middle of the pattern as shown in FIG. Furthermore, by appropriately determining the phase and dimensions of the electron beam fences in the scanning direction of the minute sections 114 and 15, it is possible to set the pattern so that no pattern exists on the boundary line. No batting errors will occur.

まtこ、この実施例では基本パターンの繰り返しピッチ
aが例えば240μmの如く比較的長いため、例えばb
=128μm、c=112μmの如繰り返しピッチaが
十分に小さい場合は1つの微小区画の成子ビーム走査方
向の寸法と基本パターンのピッチとが一致するように微
小区画な設定しても良い。
In this example, since the repetition pitch a of the basic pattern is relatively long, for example 240 μm, for example b
If the repetition pitch a is sufficiently small, such as c = 128 μm and c = 112 μm, the micro-divisions may be set so that the dimension of one micro-division in the adult beam scanning direction matches the pitch of the basic pattern.

このように微小区画を設定1−ることにより、バッティ
ングエラー)fま全く発生せず、又は発生しても基本パ
ターンの一定位置に固定されるため、バッチ、イ、フグ
エラー間の間隔を基本パターンのピッチと同じか或い1
cマそれ以下の非常に微小なものとすることができ、目
視でバッティングエラーによる悪影響を判別することが
不可能となり、従ってこのようにして露光描画されたパ
ターンを有する電荷転送デバイスな用いて撮影した画像
についても、バッティングエラーによるスジムラ等の不
備1cま認められなくなる。
By setting minute divisions in this way, batting errors) will not occur at all, or even if they occur, they will be fixed at a fixed position in the basic pattern. Is it the same as the pitch of
It is possible to make it very small, smaller than C, making it impossible to visually determine the adverse effects of batting errors, and therefore, a charge transfer device with a pattern drawn by exposure in this way cannot be used for photographing. Even defects 1c, such as uneven streaks due to batting errors, are no longer recognized in the resulting images.

この発明は以上に述べたように、電子ビーム露光装置に
特有のバッティングエラーを常に繰り返しパターンの一
定位置に発生せし′めるよ5にしたものであるので、バ
ッティングエラーが発生しても非常に短かい周期で発生
するために人間の目に1・まムラが存在すると1.ま感
じず、従ってCCD。
As described above, this invention is designed to ensure that the batting error, which is unique to electron beam exposure equipment, always occurs at a fixed position in a repeating pattern. 1. If there is an unevenness in the human eye because it occurs in a short period, 1. I don't feel it, so CCD.

13BD等の電荷転送デバイスの受光部のパターン(繰
り返しパターン)を本発明方法により露光描画すれば、
パターン自体にスジムラ等の異常が発生することが−な
く、かつその電荷転送デバイスを用いて撮影した画1象
にスジムラ等の異帛力ん発生する不備を解消することが
できるものであり、極めて品質の良好゛なパターンを安
定して製造することができるものである。
If the pattern (repetitive pattern) of the light receiving part of a charge transfer device such as 13BD is exposed and drawn by the method of the present invention,
It is extremely effective because it does not cause abnormalities such as uneven streaks in the pattern itself, and can eliminate defects such as uneven streaks that occur in a single image taken using the charge transfer device. It is possible to stably produce patterns of good quality.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は電子ビーム露光装置によるパターン描画で発生
するバッティングエラーの説明図であり。 第2図はこの発明方法によるパターン描画の一実施例の
説明図である。 11.12・・・基本パターン1.1ろ・・・バッティ
ングエラー、14.15・・・微小区画、16,17・
・境界線 特許出願人 凸版印刷株式会社 代表者鈴木和夫1、 /1・
FIG. 1 is an explanatory diagram of batting errors that occur during pattern drawing using an electron beam exposure device. FIG. 2 is an explanatory diagram of an embodiment of pattern drawing by the method of this invention. 11.12...Basic pattern 1.1ro...Batting error, 14.15...Minute division, 16,17...
・Boundary line patent applicant Toppan Printing Co., Ltd. Representative Kazuo Suzuki 1, /1・

Claims (1)

【特許請求の範囲】[Claims] 1)電子ビーム露光装置な′用いて、基本ノくターンが
多数縁り返されて構成されてなるイメージセンサ用電荷
転送デバイスの受光部のノ(ターンを多数の微小区画に
分割して露光描画する方法におり・て、 riiJ記各
微小区画なd子ビームの走査方向に一定の繰り返しをも
つように分割し、かつこの微小区画の碌り返しピンチが
前記基本)くターンの操り、曵しピッチに一致するよう
に設定してノくターンのj落光1,1静(jii乞行な
うことを特徴とする’(IT、子ビーム1.tは元方法
1) An electron beam exposure device is used to divide the light-receiving part of a charge transfer device for an image sensor, which is composed of a large number of basic turns turned over, into a large number of minute sections, and then expose and draw them. According to the method described above, each minute section is divided so that it has a certain repetition in the scanning direction of the d-beam, and the repeated pinching of this minute section is the basic method described above. The pitch is set to match the pitch of the turn of the j falling light 1, 1 stillness (jii beggars)' (IT, the child beam 1.t is the original method.
JP58227710A 1983-12-01 1983-12-01 Electron beam exposure Pending JPS60119720A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58227710A JPS60119720A (en) 1983-12-01 1983-12-01 Electron beam exposure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58227710A JPS60119720A (en) 1983-12-01 1983-12-01 Electron beam exposure

Publications (1)

Publication Number Publication Date
JPS60119720A true JPS60119720A (en) 1985-06-27

Family

ID=16865134

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58227710A Pending JPS60119720A (en) 1983-12-01 1983-12-01 Electron beam exposure

Country Status (1)

Country Link
JP (1) JPS60119720A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62156816A (en) * 1985-12-28 1987-07-11 Toshiba Corp Patterning method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57644A (en) * 1980-06-02 1982-01-05 Canon Inc Direct reversal type photographic material and formation of its image

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57644A (en) * 1980-06-02 1982-01-05 Canon Inc Direct reversal type photographic material and formation of its image

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62156816A (en) * 1985-12-28 1987-07-11 Toshiba Corp Patterning method

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