JPS60119546U - Thermal head device - Google Patents
Thermal head deviceInfo
- Publication number
- JPS60119546U JPS60119546U JP716284U JP716284U JPS60119546U JP S60119546 U JPS60119546 U JP S60119546U JP 716284 U JP716284 U JP 716284U JP 716284 U JP716284 U JP 716284U JP S60119546 U JPS60119546 U JP S60119546U
- Authority
- JP
- Japan
- Prior art keywords
- thermal head
- head device
- transfer body
- heat transfer
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Accessory Devices And Overall Control Thereof (AREA)
- Electronic Switches (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来のサーマルヘッド装置の一例を示す斜視図
、第2図は本考案サーマルヘッド装置の実施の一例を示
す斜視図、第3図及び第4図は本考案に係るサーマルヘ
ッド装置を用いたサーマルプリンターの印字部の一例を
示すもので、第3図はプラテンをサーマルヘッドから相
離した状態で示す斜視図、第4図は縦断面図である。
符号の説明、1・・・・・・基板、2・・曲サーマルヘ
ッド、4・・開広熱体、9a・・曲ヒートパイプ、9b
・・・・・・ヒートパイプ、10a・・曲ヒートパイプ
の吸熱部、10b・・曲ヒートバイブの吸熱部。FIG. 1 is a perspective view showing an example of a conventional thermal head device, FIG. 2 is a perspective view showing an example of implementation of the thermal head device of the present invention, and FIGS. 3 and 4 are views of the thermal head device according to the present invention. An example of the printing section of the thermal printer used is shown, with FIG. 3 being a perspective view showing the platen separated from the thermal head, and FIG. 4 being a longitudinal sectional view. Explanation of symbols: 1...Substrate, 2...Curved thermal head, 4...Open wide heating element, 9a...Curved heat pipe, 9b
...Heat pipe, 10a... heat absorption part of curved heat pipe, 10b... heat absorption part of curved heat vibe.
Claims (1)
成るサーマルヘッドを基板の先端部に固゛着し、該サー
マルヘッドに熱伝導の良好な材料から成る伝熱体を接触
せしめ、該伝熱体にヒートパイプの吸熱部を取着したこ
とを特徴とするサーマルヘッド装置。A thermal head consisting of a large number of individually controlled resistance heating elements arranged in an array is fixed to the tip of the substrate, a heat transfer body made of a material with good thermal conductivity is brought into contact with the thermal head, and A thermal head device characterized in that a heat absorbing part of a heat pipe is attached to a heat transfer body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP716284U JPS60119546U (en) | 1984-01-24 | 1984-01-24 | Thermal head device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP716284U JPS60119546U (en) | 1984-01-24 | 1984-01-24 | Thermal head device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60119546U true JPS60119546U (en) | 1985-08-13 |
Family
ID=30485264
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP716284U Pending JPS60119546U (en) | 1984-01-24 | 1984-01-24 | Thermal head device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60119546U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6283154A (en) * | 1985-10-08 | 1987-04-16 | Sato :Kk | Thermal recording type printer |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5780067A (en) * | 1980-11-07 | 1982-05-19 | Hitachi Ltd | Printing apparatus |
-
1984
- 1984-01-24 JP JP716284U patent/JPS60119546U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5780067A (en) * | 1980-11-07 | 1982-05-19 | Hitachi Ltd | Printing apparatus |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6283154A (en) * | 1985-10-08 | 1987-04-16 | Sato :Kk | Thermal recording type printer |
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