JPS60119546A - Active energy ray hardenable solder masking agent composition - Google Patents

Abstract

PURPOSE:To obtain the optimum composition for protecting nonsoldered part in fabrication of a printed circuit board, etc., by mixing a polymerizable compd. hardenable by irradiation of active energy rays, with a modifying agent for improviding the hardening performance of said compd., its heat resistance, and its peelability, etc., in a specified proportion. CONSTITUTION:A solder masking agent compsn. superior in driability in fabrication of electronic parts, etc., and their peelability after services, not injurious to health, and not affected by the air on the hardenability is obtained by mixing 40-95pts.wt. of a liquid material hardenable with active energy rays, such as UV rays or electron beams, contg. (meth)acrylic acid or its ester, epoxy-modified di(meth)acrylate, diallyl phthalate, acrylonitrile, styrene, or ion-polymerizable epoxy compd., or the like; with 5-60pts.wt. of a polymer-modifying agent for giving heat insulating property and heat resistance, and improving peelability, such as glass beads or shirasu (volcanic ashes) balloons, including a plasticizer, etc.; and a polymn. initiator, such as benzophenone, a sensitizer, or the like necessary additives.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides an active energy beam-curable solder masking agent composition, more specifically, a viscous energy beam-curable solder masking agent composition that prevents solder adhesion in the soldering process and can be peeled off when masking is not required. It relates to a curable solder masking agent composition.

Conventionally, organic solvent type and aqueous solution type solder masking agents have been used for the purpose of protecting non-soldered parts in soldering processes such as printing wiring numbers and assembling electronic components. In some cases, massing agents curable by active energy radiation are also being used.

However, conventional masking agents have serious deficiencies in any of the required properties, such as drying or curing properties, heat resistance, sanitary properties, and removability.

That is, organic solvent type solder masking agents require a long time to dry and are hygienic, and even if heat energy is applied to accelerate drying, hygienic problems remain. In addition, the conveyor speed attached to the Unibu soldering process is 200-
3000 m/min, and the conveyor speed for the genus "Dipsolderingei" is said to be about 150 to 200 C11 l/min, but in this case, natural drying requires a drying conveyor line of 15 to 30 m, which is economically preferable. do not have.

Aqueous solution type solder masking agents solve sanitary problems compared to organic solvent type solder masking agents, but have the disadvantage that drying properties are worse because the latent heat of vaporization of water is large. Therefore, the disadvantage is that drying takes a long time and requires a long conveyor line.

In contrast to the organic solvent type and aqueous solution type solder masking agents described in -1-, active energy radiation curing type solder masking agents are also being used, but these masking agents have poor heat resistance and peeling. These materials had little or no characteristics and were able to satisfy the required characteristics.

The present invention has been made in view of the above-mentioned prior art, and it is an object of the present invention to provide an active energy ray-curable solder masking agent composition having required properties such as curability, heat resistance, LFJ susceptibility, and peelability.

In order to achieve the above object, the present invention is characterized in that it contains 40.-95 parts by weight of a 7J binding compound which reacts with active energy rays and 5 to 60 parts by weight of a polymer modifier. This is a line-curable solder masking agent composition.

The polymerizable compound (hereinafter referred to as the main component) that causes a reaction with the active energy rays used in this invention is a so-called radical, a monomer, an anionic compound, etc., which is treated with one or a combination of monomers, oligomers, and polymers. It is a polymerizable compound, and 4
It is possible to achieve excellent results by using it in the range of 0 to 95 parts by weight. Monomers, oligomers and polymers include (meth)acrylic Nisder compounds, styrene, vinyltoluene, α-methylstyrene, β-methylstyrene, t-butylstyrene, vinylbenzene, N-
Compounds containing unsaturated bonds, such as vinyl chloride, acrylonitrile, vinyl acetate, and allyl compounds, and compounds containing epoxy bonds may be mentioned.

The (meth)acrylic ester compound is (meth)
Acrylic acid, (methane acrylate meburu, (meth)acrylic acid]-thyl, butyl (meth)acrylate, hegysyl (meth)acrylate-1-12-ethylhenyl (meth)acrylate, isooctyl (meth)acrylate, lauryl (meth)acrylate, stearyl (meth)
acrylate, 2-droxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate,
3-chloro-2-hydroxypropyl (meth)acrylate-1-, glycerol mono(meth)acrylate-1-, polyethylene glycol (meth)acrylate, and N,
N=-dimethylaminoethyl (meth)acrylate, N
-N--diethylaminoethyl (meth)acrylate]・
, glycidyl (meth)acrylate, carpitol 7 trahydrofurfuryl (meth)acrylate], dicyclopentagenyl (meth)acrylate, dihydrodicyclopentagenyl (meth)acrylate 1~, isobornyl (meth)acrylate , 1,6-hedi-1-sanediol (meth)acrylate-1-, neopendelglu di(meth)acrylate, ]nidylene glycol di(meth)acrylate-h, polyethylene glycol di(meth)acrylate
Acrylate, polypropylene glycol di(meth)acrylate, butylene glycol di(meth)acrylate
1-, Pentaerythritol di(meth)acrylate-1~
, 1, 4-1 Tanji A-ruji (meth)acrylate [・,
Historically, epoxy-modified di(meth)acrylate, urethane-modified di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol (
meth)acrylate, dipentaerythritol hexane (meth)acryle-1-, tetramethylolmethanetetra(meth)acrylate, N,N,N',N"-de1herakis(β-hydroxyethyl)ethylenediamine (
Examples include compounds such as Nisder meth)acrylate and derivatives thereof.

Examples of allyl compounds having an unsaturated bond and capable of radical polymerization by active energy rays include diallyl phthalate, diallyl isophthalate, diallylazibe-1-, and the like.

Compounds that have unsaturated bonds and can be radically polymerized by active energy rays include N-gonylbi[lydone, styrene, acrylonitrile, vinyl acetate, vinyltoluene J
3 and derivatives thereof.

Examples of compounds having an epoxy group that can undergo cationic polymerization or anionic polymerization include ethylene A4 nide, propylene oxide, butyl glycidyl ether, epichlorohydrin, methyl epichlorohydrin, allyl glycidyl needle, phenyl glycidyl ether, and shrimp chlorohydrin. Condensation polymer of Suf-1-nol A, glycidyl persadic acid J-del, ethylene glycol diglycidylconyl, polyethylene glycol #2
00 diglycidyl edel, polyethylene glycol #
400 diglucidyl edel, 1,6-hexylnandi A
Examples include compounds containing an epoxy terminal and an Ex1 hemer structure, and the like.

The polymer modifier used in the present invention is particularly designed to improve heat resistance and heat resistance, and to improve releasability.
For example, glass peas, glass balloons,
Examples include whitebait balloons and microballoons. Furthermore, in order to increase the effect of peelability as a polymer modifier, plasticizers such as DOP, DBP, wax, etc. or combinations thereof (15~60 parts) can be used with good results. be able to.

Examples of Kajin A polymerization initiators include derivatives such as diazonium salts, iodonium salts, Fesph A nium salts, sulft nium salts, and ammonium salts.

The main UV polymerization initiators are pencil 1-one, p-tart-butylchlorophenone, and 2.2 di-1.
1-hexyacetophenone, 4,4'-bisdimethylaminobenzophenone, benzoin, benzoinmethyl]
Needle, benzoin propyl ether, benzyl dimethyl ketal, 71-ramethylthyrinram monosulfate 7
There are known compounds such as /ide, diA-1nizan-1-one, and 2-chlorodiA-xanthone.

The main sensitizers include aminos, urea, IΔ compounds, 21-lyl compounds, phosphorus compounds, and other known compounds such as chlorine compounds and chlorine compounds.

A fluid liquid product can be obtained by blending the above-mentioned main components, polymer modifier, and polymerization initiator according to common coating manufacturing techniques.

The liquid material can be used, for example, during soldering on a printed wiring board by a conventional masking method such as brushing, ironing, dipping, or spraying. Of course, the constituent components can be selected and adjusted according to each masking method and operating conditions.

Sources of active energy rays include ultraviolet rays such as high-pressure mercury lamps, low-pressure mercury lamps, ultra-high-pressure mercury lamps, metal halide lamps, and xenon lamps, generators, electron beam accelerators, and Kobal 1 to 6.
Examples include α-ray sources such as 0, X-ray generators, etc., but when short-time curing is required, it is preferable to use ultraviolet rays or electron beams. The time required for curing depends on the type and strength of the active 1 energy wire (although it varies, one row can be used to
In a 4kW high-pressure mercury lamp with 8Qw of human power per length 1C111, the diffused type takes 1 to 30 seconds, and the condensed type takes 0 seconds.
．． It can be cured by irradiation for 2 to 10 seconds, and generally a cured coating film with a thickness of 0.1 to 3 nm can be formed.

Next, we will explain the present invention by giving Examples and Comparative Examples! 4 (Explained in terms of A. Table 1.2.3 shows the formulations of 3 Examples and 3 Comparative Examples, and Table 4 shows the results.
Death 1 piece is 1 Q Qmmx 25mmx2mm
A single-sided copper-clad laminate was used to cover the copper foil surface.

Table 2 Table 3 Table 4 Solder heat resistance was immersed in a molten solder bath at 260° C. for 10 seconds, and after peeling off, it was judged whether there was 41 solder or no solder on the surface of the body foil. In addition, for the adhesion test, take 100 crosscuts of 1mmrl, peel them off with adhesive deso, count the remaining stitches, and calculate the remaining percentage.
It was expressed as It is shown that the remaining crosscuts O% is the best. Peelability was determined by manually starting from one place on the boundary of the covering material using a spatula and peeling off the entire surface by hand. , If there are any irregularities, they are indicated by an X.

As is clear from the test results of the above examples, all of the examples of the present invention have good solder heat resistance, non-adhesion, and peelability. Moreover, almost no inhibition effect by air was observed on the curing reaction of the composition of the present invention. It goes without saying that there is no factor that harms hygiene such as an organic solvent type.

Therefore, a heat-resistant, removable active energy beam-sandable solder masking comprising 40 to 95 parts by weight of a polymerizing f1 compound that causes a reaction with active energy beams, and 5 to 60 parts by weight of a polymer modifier. The masking agent composition can provide a masking agent composition that has required properties such as curability, heat resistance, sanitary properties, and removability.

Claims (1)

[Claims] Polymerizable compound 40.~ which causes a reaction with active energy rays
An active energy beam-curable solder masking agent composition comprising 95 parts by weight of a polymer modifier and 5 to 60 parts by weight of a polymer modifier.