JPS6011838B2 - Boiling cooler - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a boiling cooling device for cooling electrical components such as semiconductor rectifying elements.

The conventional boiling cooling device (hereinafter referred to as the device) is shown in Figures 1 and 2.
To explain the figure, a semiconductor rectifying element 2 (hereinafter referred to as the element) is placed in a container 1, and a refrigerant 3 is poured in to the extent that it is submerged.

There is a condenser 4 above the container 1, and the steam of cold soot 3 that cools the element 2 and boils in the container 1 passes through a pipe 5 and enters the condenser 4. The vapor of the refrigerant 3 cooled in the condenser 4 condenses into a liquid and returns to the container 1 through the pipe 6. There are different types of soot, but the freezing point is better than room temperature, so when using cold soot, other substances may be mixed in to lower the freezing point. An example is a mixture of Freon R-112 and silicone oil. When such a refrigerant is used, there is no problem since the boiling part is a mixed liquid, but only the refrigerant boils and becomes vapor and goes to the condenser. In other words, the condenser 4 becomes a single refrigerant with a high freezing point. Therefore, if the lining medium 3 is further cooled after being cooled and liquefied, there is a possibility that the lining medium 3 will solidify before returning to the container 1, thereby clogging the pipe 6. An object of the present invention is to provide a boiling cooling device that returns the cold soot 3 to the container 1 without solidifying it.

The structure of the present invention will be explained with reference to FIGS. 3 and 4. The improvement of the present invention is that a plurality of thin tubes 7 are incorporated into the portion corresponding to the pipe 5 in FIGS. 1 and 2.

Then, the liquid level was raised to the bottom of the pongee pipe. The present invention utilizes the pumping action of steam, which is used in simple absorption refrigerators.

With the above structure, when the generated bubbles pass through the pongee tube 7, they will entrain the liquid refrigerant in the container due to the action of tin liquid. The inner diameter of the rope tube 7 that causes this effect is determined by the amount of bubbles and the rope tube 7.
The limit is determined by the height of rise. The number is determined by the amount of heat generated. In this way, the vapor of the refrigerant 3 and the mixed liquid flow into the condenser. The vapor at this time is the single cold soot 3, but the liquid is the same mixed liquid as that in the container. In the condenser, as the vapor cools, it liquefies and dissolves into the circulating liquid mixture. Therefore, the cold soot itself is supercooled and does not solidify before returning to the container. Of course, the concentration of cold butter in the circulating mixed liquid will be higher, but since there is a little margin for lowering the freezing point due to mixing, the grinding process will be smoother, and since the flow rate is large, there will be no problem of solidification. ．． Note that the pongee pipe 7 may not be a plurality of pongee pipes, but may be one or more thick pipes whose interior is divided into small sections as shown in the cross section of FIG.

As explained above, when choosing a refrigerant, there are times when it is necessary to choose one with a high freezing point due to issues such as material, pressure, price, etc. In such cases, something like silicone oil is mixed in to lower the freezing point. Sometimes it is lowered and used.

In such cases, the problem was how to prevent coagulation when evaporated and separated. According to the present invention, this problem can be easily solved.

[Brief explanation of the drawing]

Figures 1 and 2 are schematic diagrams of a secondary semiconductor device cooling device, Figures 3 and 4 are schematic diagrams of a semiconductor rectifier cooling bag counterfeit according to the present invention, and Figure 5 is a modification of the present invention. FIG. 1... Container, 2... Semiconductor rectifier,
3... cold butterfly, 4... condenser, 5,6...
...Pipe, 7...Pongee pipe, 8...Liquid level, 9.
...Split tube. Figure 1 Figure 2 Figure 3 Figure 4 Figure 5

Claims (1)

[Claims] 1 A semiconductor device consisting of a container that stores electrical components and cools them by boiling a liquid refrigerant, and a condenser that is located above the container and is connected to the container by a pipe to cool and condense the vapor of the refrigerant generated in the container. In the rectifying element cooling system, the pipe that leads the refrigerant vapor from the container to the condenser is composed of multiple thin tubes, and the bubbles generated by boiling are used to lift the liquid refrigerant and the refrigerant vapor using a mechanical pump. A boiling cooling device characterized in that it is circulated to a condenser without being used.