JPS6011838B2 - Boiling cooler - Google Patents
Boiling coolerInfo
- Publication number
- JPS6011838B2 JPS6011838B2 JP3087780A JP3087780A JPS6011838B2 JP S6011838 B2 JPS6011838 B2 JP S6011838B2 JP 3087780 A JP3087780 A JP 3087780A JP 3087780 A JP3087780 A JP 3087780A JP S6011838 B2 JPS6011838 B2 JP S6011838B2
- Authority
- JP
- Japan
- Prior art keywords
- container
- refrigerant
- condenser
- pipe
- boiling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
本発明は半導体整流素子等の電気部品を冷却する沸騰冷
却装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a boiling cooling device for cooling electrical components such as semiconductor rectifying elements.
従来の沸騰冷却装置(以下装置と言う)を第1図と第2
図について説明すると容器1内に半導体整流素子2(以
下素子と言う)を入れそれを浸す程度に冷媒3を入れる
。The conventional boiling cooling device (hereinafter referred to as the device) is shown in Figures 1 and 2.
To explain the figure, a semiconductor rectifying element 2 (hereinafter referred to as the element) is placed in a container 1, and a refrigerant 3 is poured in to the extent that it is submerged.
容器1の上方には凝縮器4があり容器1で素子2を冷却
し沸騰した冷煤3の蒸気はパイプ5を通り凝縮器4に入
る。凝縮器4内で冷却された冷媒3の蒸気は凝縮し液体
となりパイプ6を通って容器1に戻る。為煤にはいるい
るな種類があるが凝固点が常温より薦い冷煤を使用する
ときは別の物質を混ぜ凝固点を下げることがある。例と
してはフロンR−112とシリコンオイルを混ぜた物が
ある。このような冷蝶を使用すると沸騰部分では混合液
体であるので問題はないが沸騰し蒸気となり凝縮器へ行
くのは冷媒のみである。すなわち凝縮器4では凝固点の
高い冷嬢単体になってしまう。従って冷却され液化した
後さらに冷却されると袷媒3は容器1へ戻るまでに凝固
しパイプ6がつまる可能性がある。本発明の目的は前述
の冷煤3を凝固させずに容器1に戻すようにした沸騰冷
却装贋を提供することにある。There is a condenser 4 above the container 1, and the steam of cold soot 3 that cools the element 2 and boils in the container 1 passes through a pipe 5 and enters the condenser 4. The vapor of the refrigerant 3 cooled in the condenser 4 condenses into a liquid and returns to the container 1 through the pipe 6. There are different types of soot, but the freezing point is better than room temperature, so when using cold soot, other substances may be mixed in to lower the freezing point. An example is a mixture of Freon R-112 and silicone oil. When such a refrigerant is used, there is no problem since the boiling part is a mixed liquid, but only the refrigerant boils and becomes vapor and goes to the condenser. In other words, the condenser 4 becomes a single refrigerant with a high freezing point. Therefore, if the lining medium 3 is further cooled after being cooled and liquefied, there is a possibility that the lining medium 3 will solidify before returning to the container 1, thereby clogging the pipe 6. An object of the present invention is to provide a boiling cooling device that returns the cold soot 3 to the container 1 without solidifying it.
本発明の構成を第3図と第4図について説明すると本発
明の改良点は第1図、第2図のパイプ5に相当する部分
に複数本の細管7を組込んだことである。The structure of the present invention will be explained with reference to FIGS. 3 and 4. The improvement of the present invention is that a plurality of thin tubes 7 are incorporated into the portion corresponding to the pipe 5 in FIGS. 1 and 2.
そして液面の高さを紬管の下部まで高くした。本発明は
簡単な吸収式冷凍機で利用している蒸気の揚液作用を利
用したものである。Then, the liquid level was raised to the bottom of the pongee pipe. The present invention utilizes the pumping action of steam, which is used in simple absorption refrigerators.
上記のような構造にすると発生した泡が紬管7を通ると
き錫液作用によって容器内の液体冷媒を同伴するように
なる。この作用を起こす紬管7の内径は泡の量と縄管7
による上昇高さによって制限が決まる。本数は発生熱量
により決まる。このようにして凝縮器へは冷媒3の蒸気
と混合液体が流れ込むようになる。このときの蒸気は冷
煤3の単体であるが液体は容器内にあるものと同じ混合
液体である。凝縮器内では蒸気が冷却されると液化する
がその場で循環している混合液体に溶け込む。したがっ
て冷煤単体が過冷却され容器に戻るまでに凝固すること
はなくなる。もちろん循環している混合液体の冷蝶の濃
度は高くなるが混合による凝固点低下に少し余裕を持た
せてお研ぎよく、また流量が多いため凝固の問題はなく
なる。.尚、紬管7は複数本の紬管でなく1本又は複数
本の太いパイプの内部を第5図の断面のように細かく区
切ったものでもよい。With the above structure, when the generated bubbles pass through the pongee tube 7, they will entrain the liquid refrigerant in the container due to the action of tin liquid. The inner diameter of the rope tube 7 that causes this effect is determined by the amount of bubbles and the rope tube 7.
The limit is determined by the height of rise. The number is determined by the amount of heat generated. In this way, the vapor of the refrigerant 3 and the mixed liquid flow into the condenser. The vapor at this time is the single cold soot 3, but the liquid is the same mixed liquid as that in the container. In the condenser, as the vapor cools, it liquefies and dissolves into the circulating liquid mixture. Therefore, the cold soot itself is supercooled and does not solidify before returning to the container. Of course, the concentration of cold butter in the circulating mixed liquid will be higher, but since there is a little margin for lowering the freezing point due to mixing, the grinding process will be smoother, and since the flow rate is large, there will be no problem of solidification. .. Note that the pongee pipe 7 may not be a plurality of pongee pipes, but may be one or more thick pipes whose interior is divided into small sections as shown in the cross section of FIG.
以上説明のように、冷媒を選択するについて材質、圧力
、価格等の問題があって凝固点の高いものを選ばなけれ
ばならないときがあるがこのようなときシリコンオイル
のようなものを混入し凝固点を下げて使うことがある。As explained above, when choosing a refrigerant, there are times when it is necessary to choose one with a high freezing point due to issues such as material, pressure, price, etc. In such cases, something like silicone oil is mixed in to lower the freezing point. Sometimes it is lowered and used.
このようなとき問題になるのは蒸発し分離した時の凝固
対策であった。本発明によればこの問題が簡単に解決で
きる。In such cases, the problem was how to prevent coagulation when evaporated and separated. According to the present invention, this problem can be easily solved.
第1図、第2図は従釆の半導体素子冷却装置のキ概略図
、第3図、第4図は本発明による半導体整流素子冷却袋
贋の概略図、第5図は本発明の変形例を示す断面図であ
る。
1・・・・・・容器、2・・・・・・半導体整流素子、
3・・・・・・冷蝶、4…・・・凝縮器、5,6・・・
・・・パイプ、7……紬管、8・・・・・・液面、9・
・・・・・分割管。
第1図第2図
第3図
第4図
第5図Figures 1 and 2 are schematic diagrams of a secondary semiconductor device cooling device, Figures 3 and 4 are schematic diagrams of a semiconductor rectifier cooling bag counterfeit according to the present invention, and Figure 5 is a modification of the present invention. FIG. 1... Container, 2... Semiconductor rectifier,
3... cold butterfly, 4... condenser, 5,6...
...Pipe, 7...Pongee pipe, 8...Liquid level, 9.
...Split tube. Figure 1 Figure 2 Figure 3 Figure 4 Figure 5
Claims (1)
容器とその上方に位置し容器とはパイプによつて連結さ
れ、容器で発生した冷媒の蒸気を冷却し凝縮させる凝縮
器とからなる半導体整流素子冷却装置において容器より
凝縮器へ冷媒蒸気を導くパイプを複数本の細管で構成し
沸騰によつて生じた泡によつて揚液作用をさせ、液体冷
媒と冷媒の蒸気を機械的ポンプを使わないで凝縮器へ循
環させるようにしたことを特徴とする沸騰冷却装置。1 A semiconductor device consisting of a container that stores electrical components and cools them by boiling a liquid refrigerant, and a condenser that is located above the container and is connected to the container by a pipe to cool and condense the vapor of the refrigerant generated in the container. In the rectifying element cooling system, the pipe that leads the refrigerant vapor from the container to the condenser is composed of multiple thin tubes, and the bubbles generated by boiling are used to lift the liquid refrigerant and the refrigerant vapor using a mechanical pump. A boiling cooling device characterized in that it is circulated to a condenser without being used.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3087780A JPS6011838B2 (en) | 1980-03-13 | 1980-03-13 | Boiling cooler |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3087780A JPS6011838B2 (en) | 1980-03-13 | 1980-03-13 | Boiling cooler |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56129397A JPS56129397A (en) | 1981-10-09 |
JPS6011838B2 true JPS6011838B2 (en) | 1985-03-28 |
Family
ID=12315957
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3087780A Expired JPS6011838B2 (en) | 1980-03-13 | 1980-03-13 | Boiling cooler |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6011838B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01168335U (en) * | 1988-05-20 | 1989-11-28 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3964580B2 (en) | 1999-09-03 | 2007-08-22 | 富士通株式会社 | Cooling unit |
-
1980
- 1980-03-13 JP JP3087780A patent/JPS6011838B2/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01168335U (en) * | 1988-05-20 | 1989-11-28 |
Also Published As
Publication number | Publication date |
---|---|
JPS56129397A (en) | 1981-10-09 |
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