JPS60118241U - 半導体素子の圧接構造 - Google Patents

半導体素子の圧接構造

Info

Publication number
JPS60118241U
JPS60118241U JP648984U JP648984U JPS60118241U JP S60118241 U JPS60118241 U JP S60118241U JP 648984 U JP648984 U JP 648984U JP 648984 U JP648984 U JP 648984U JP S60118241 U JPS60118241 U JP S60118241U
Authority
JP
Japan
Prior art keywords
press
case
disc spring
fixing washer
fitting fixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP648984U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0113422Y2 (enExample
Inventor
隆夫 渡邊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meidensha Corp
Original Assignee
Meidensha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meidensha Corp filed Critical Meidensha Corp
Priority to JP648984U priority Critical patent/JPS60118241U/ja
Publication of JPS60118241U publication Critical patent/JPS60118241U/ja
Application granted granted Critical
Publication of JPH0113422Y2 publication Critical patent/JPH0113422Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP648984U 1984-01-20 1984-01-20 半導体素子の圧接構造 Granted JPS60118241U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP648984U JPS60118241U (ja) 1984-01-20 1984-01-20 半導体素子の圧接構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP648984U JPS60118241U (ja) 1984-01-20 1984-01-20 半導体素子の圧接構造

Publications (2)

Publication Number Publication Date
JPS60118241U true JPS60118241U (ja) 1985-08-09
JPH0113422Y2 JPH0113422Y2 (enExample) 1989-04-19

Family

ID=30483974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP648984U Granted JPS60118241U (ja) 1984-01-20 1984-01-20 半導体素子の圧接構造

Country Status (1)

Country Link
JP (1) JPS60118241U (enExample)

Also Published As

Publication number Publication date
JPH0113422Y2 (enExample) 1989-04-19

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