JPS6011682A - Distributor for engine ignition - Google Patents

Abstract

PURPOSE:To improve ignition-timing accuracy and durability by installing an engine revolution speed sensor and a semiconductor boost pressure sensor into a distributor and analogue-controlling ignition timing, conduction angle of an ignition coil, etc. on the basis of the outputs of the above-described sensors. CONSTITUTION:A semiconductor pressure sensor 4 is installed onto the outside surface of the housing 1 of a distributor by a bolt 3, and the electric voltage signal in proportion to the boost pressure of an internal combustion engine which is introduced through a conduit connected to a nipple 410 is output. A light shielding plate 8 is installed onto a rotary shaft 5 in the housing 1, and a rotor 11 is installed through a spacer 10. In the housing 1, a semiconductor ignition apparatus 15 integrally equipped with a revolution-speed sensor 16 equipped with a luminous element 202 and a light receiving element 204 which are opposed, having the light shielding plate 8 interposed, and the frame 201 is fixed onto the housing 1 by a bolt 14. Then, a thick film hybrid integrated circuit 206 is fixed onto a heat sink 205 fixed onto the frame 201.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a nine-engine ignition power distribution device, particularly a power distribution IWK for internal combustion engine ignition.

In order to operate an internal combustion engine efficiently, 9 engine speeds and +! It is necessary to appropriately control the ignition timing of the engine according to the intake pressure C, which indicates the load condition of engine A (referred to as boost pressure). In order to perform this control, a mechanical ignition advance device, a housing, a centrifugal advance device, and a vacuum advance device using a diaphragm are used. In addition, with the remarkable progress of semiconductor devices in recent years, the operating conditions of an engine, such as rotational speed, crank angle, boost pressure, water temperature, etc.
It has been put into practical use to detect knocking etc. using a dedicated sensor and to control the ignition timing appropriately using a microcomputer.

However, the former mechanical ignition advance device is a technology that has been matured since fortune-telling, and has been used as the mainstream ignition advance device because it consists of a single electrode and is a cheap drawing. As fate would have it, there are problems with its accuracy and durability. Also,
When using the latter microcomputer, accuracy,
Although durability has been improved, it has not become widely available due to the need for additional sensors and the additional cost of a kilogram of microcomputer system. .

Furthermore, the device itself is so large that it is impossible to fit it directly into a 99 engine.

This invention was made in order to eliminate the above-mentioned drawbacks of conventional devices, and includes a semiconductor pressure sensor that detects the boost pressure of several points mounted on the side of the engine housing, and a single engine. A power distributor is equipped with a rotational speed sensor and a semiconductor ignition device that performs analog control of the ignition timing, the energization angle of the ignition coil, etc. based on the 'Kameiki' signal outputted from the semiconductor pressure sensor and the rotational speed sensor. The purpose is to provide an engine ignition power distributor that improves 9 ignition timing accuracy and blij Kusumi by incorporating it into the engine, and is easy to handle.

Hereinafter, an embodiment of this invention will be explained according to the drawings.
Figure +a+ is a cross-sectional view of the power distributor, and Figure 1 (fb+) is a plan view with the power distribution cap completely removed, which will be described later. In Figure 1, 2) is a housing with a cutout (la) formed on the side, (2) is a connector layered in the notch 5 (ia) of the housing, and (4) is a bolt (3). by housing i
A semiconductor pressure sensor is housed on the outer surface of the Ill and electrically connected to the connector (2) and outputs a voltage directly proportional to the boost pressure of the internal combustion engine (not shown). (5) is inserted into housing (1) and housing i
A rotating shaft rotatably supported relative to l+, and rotated by being driven by an internal combustion engine (lA not shown).

(6) is a spacer disposed in communication with the rotating shaft (5).

(7) The bolt i81 is a light-shielding plate supported by the spacer (6) and fixed to the rotating shaft (5), and constitutes a part of a rotational speed sensor to be described later.

(9) is a washer, (101 is a spacer tail which is stacked on the light plate (8) together with the washer (9) and fixed to the rotating shaft (5) by a bolt (7).

(1) is a rotor that has a bottom hole (lla), and is fitted with a spacer + In) by the bottom hole (lla).

(1 is the power distribution cap, (131 is the housing il+
It is a shield plate held between a power distribution cap and a power distribution cap.

(14J is a semiconductor ignition device fixed inside the bolt, (country is bolt 0 xuan housing) 1).

Analog control of engine ignition timing, ignition coil energization angle, etc.

FIG. 2 is a diagram of the semiconductor pressure sensor (4). In FIG. 2, (401) is a semiconductor pressure sensing element;
(40m is a printed board with a semiconductor pressure detection element (
The semiconductor pressure sensing element (401) is fixed by soldering the lead wire (not shown) of the semiconductor pressure sensing element (401).

(40B) is a thick 1-character hybrid integrated circuit amplifier, which is soldered to the printed board (402).
A semiconductor pressure sensing element (
401) to amplify the output of the semiconductor pressure sensing element (401).

(404) is a molded case in which both the semiconductor pressure sensing element (401) and the thick film hybrid integrated circuit amplifier (408) are housed. (,405)d case C404)
The semiconductor 1 is connected to the printed board (402) to supply power to the force sensing element (401) and the thick film hybrid integrated circuit layer 1 (40B) and to the amplifier (40B). 403) is used as the output terminal.

It is also used for connection with the semiconductor ignition device 05).

(4063 is a cover, and the case (40) is a filter, which is a component 4) for guiding the boost pressure introduced through the nipple (410) to the semiconductor pressure detection element (401). It is a part.

FIG. 8 is a detailed view of the four source plates (8). For example, in the case of a 4-cylinder internal combustion engine, the light shielding plates (8) are connected to each other at VC9.
It is a disc in which slits (801) having openings of θ0 are formed at intervals of 0°. Also, the central opening (802)
is a semicircular opening that is used for mounting on the rotating shaft (5) and also has a flat part (SOS) for positioning.

Figures 2 and 4 are 4i side views of the semiconductor ignition device t15), the light emitting element and the light receiving element that constitute the rotational speed sensor (the light source plate 8). In this figure.

(201) il'i: A frame with one through hole (lla).

(202) is a holder that holds the light emitting element (20g) /i′i light emitting element (202), and has one threaded hole (2
08a) is thrown and stored in the frame (201). (204) is the lead of the light emitting element (202), which is passed through the nine bent holes (208a) and (lla).
Ray A (201) is equal to C. (204) is a fluorescent cord, which is fixed to the frame (201) so as to face the light emitting element (202) via the light shielding plate (8).

(205) is a heat sink, (206) is a thick film hybrid integrated circuit constituting a semi-dedicated ignition device fl(+5),
It is adhesively fixed to the heat sink (205). (207)
is a cover adhesively fixed to the frame (201).

FIG. 5 is a block diagram showing an example of the circuit configuration of the engine ignition power distributor according to the present invention. In this figure, an infrared light emitting diode and a photodiode are used as the light receiving element (14). (1゛h is a constant pressure power supply, (1) is a current limiting resistor connected between the anode of the light emitting element (2θ2) and a constant pressure source (17I), (19) is a receiver ff1J terminal Cz 0
4) A load resistor connected between the anode and ground,
+20) is a molded circuit that converts the voltage waveform generated across the load resistor (19) by the light current of the light receiving element (204) into a full rectangular wave, and tJ1+ is a function generating circuit, which is a semiconductor pressure sensor. 14) Converts the arsenic signal output from +A into a voltage and outputs it. e22i is a lead angle calculation circuit, which includes a waveform distortion shaping circuit 121 and a function generation circuit i, 2+1.
The ignition timing of one engine is calculated based on the output signal from the engine. +231 is the ignition coil having the terminal (28a), and the advance angle calculation amount #I! r [22 is a switching transistor,
fi+ is an amplifier circuit that operates the switching transistor (c). 12η is a resistor for detecting the current in the ignition coil, (c) is a plow, a current detection circuit, and resistor T27
1M2
1. The ON/OFF state of the switching transistor is controlled to control the current flow value of the direct-fired coil (c) to a predetermined value. 12g1 is a battery with different terminals (ha).

- shown in Fig. 1 is a constant pressure power supply (1η input terminal, 0υ is a grommet that constitutes terminal S, and C (3 is a lead wire that connects the input terminal - and grommet 0υ. Also, a grommet) 43υ (not shown) and the terminal (29a) of the battery 4 are connected, thereby connecting the constant pressure acid sources 11η and 7 (the terminal 4). 25a) and one lead connecting six grommets.Furthermore.

The terminal C (not shown) of the grommet 01) and the terminal (28a) of the ignition coil (C) are connected.

The ignition coil (4) is connected to the switching transistor +251. (■) is the input terminal of the function generator (■υ), 05 is the input terminal (1), and the semiconductor pressure sensor (4) is connected through the input terminal (-). and semiconductor ignition system+it (151
1 is in concubinage.

Next, one cropping will be explained using crucibles and Figures 1 to 5. The rotating shaft (5) is driven by an internal combustion engine (not shown).
) rotates, the light-shielding plate (8) fixed to the rotation 'k 4i111 +51 rotates, and the slit (soi) becomes 11
Next, the light passes between the light emitting element (202) and the light receiving element (204).

At this time, the 9 light emitting elements (202) VC always emit light due to the constant flow of light, so the 9 light emitting elements (801)
) passes through the darkness of the light emitting element (202) and the light receiving element C2a4), a fluorescent probe C2o4) VC photocurrent is generated. As a result, current flows through the load resistor 09), and Surin l-(
An angle signal voltage having a period determined by the angle θ0 of 801) and the rotational speed of the rotating shaft (6) is obtained. The waveform crab-shaped circuit 1@12o) shapes this angle signal voltage into a rectangular wave and outputs it to the advance angle calculation circuit 2.

At this time, the nine light-emitting elements (202) and the light-receiving element (204) are constructed integrally with the semiconductor ignition device θ0 in order to simplify the construction and to minimize the influence of ignition noise. I cut it. The shield plate (I3!) prevents malfunction of the circuit due to ignition noise.

light emitting element 1202) + light receiving element (2)
04) also has the effect of preventing contamination and a reduction in optical output.

On the other hand, the boost pressure of the internal combustion engine is introduced to the niragle (410) of the half-body pressure sensor (4) through a pipe (not shown) and is applied to the half-body pressure detection element (401). 0 ring (407), (408)
, and spacer + 4093 u The connection between the nipple (410) and the semiconductor pressure detection element (4013) has the function of isolating it from all outside air, and the filter (411) protects against moisture, gasoline, dirt, and other harmful substances contained in the intake air of the engine. ff:
It has a filter to filter and protect the semiconductor pressure detection element (401). Ushinome body pressure detection element (outputs a voltage proportional to the boost pressure of
(21) is input. The lead angle calculation circuit 2z is the rising edge of the output rectangular wave of the waveform shaping circuit □□□.

The falling edge uses 9 as the reference position for calculation, and
The time width of the rectangular wave is used as rotation information.

The output of the function generator 1) is used as boost pressure information to calculate α and generate a timing pulse.

Closing rate control cycle (C is based on the timing pulse output from the advance angle calculation circuit (221), and the energization time of the ignition coil I23 according to the number of circuit cycles and the battery voltage.
That is, it generates a pulse that determines the closed circuit rate. The amplifier 261 receives this pulse and controls the primary current of the ignition coil +2al through a switching transistor QF.
A (il-drive) and the resistor +271 and the current detection circuit (2) form an Iλ1 loop that limits the negative current value of the ignition coil (c) to a predetermined value. ) The ignition coil is controlled intermittently by turning it on and off.

When this -order cardiac flow is intercepted, a high section pressure is generated in the secondary coil. This high voltage is connected to the center electrode VC of one power cap (I2) by a high voltage cord (not shown) and distributed to each cylinder via a power distribution rotor (I+).

In this way, the semiconductor pressure sensor 14 responds to boost pressure.
1. A semiconductor ignition device that controls the rotation speed controller and the ignition timing and circuit closing rate according to the engine rotation speed! (1
Since all 51 are integrated with the power distribution device, it is as small as or even more compact than the conventional engine-type ignition advance device.
Moreover, collection handling becomes easy. In addition, only the rotating shaft (5) is the only rotating part, and everything else can be processed using electrical signals, improving durability by 1.9 degrees.

Note that in one or more embodiments, a photoelectric element is used as the rotational speed sensor, but a Hall IC may be used.

If the device is capable of position detection, such as a magnetoresistive element, the same effects as in the above-mentioned embodiments can be obtained.

As described above, in this invention, a semiconductor pressure sensor is housed on the side of the power distribution unit housing, and a rotational speed sensor and a semiconductor ignition device are built in, so the only movable part is the rotating shaft, making it easy to handle and durable. Therefore, it is possible to obtain an engine ignition power distributor with excellent performance and high accuracy.

[BRIEF DESCRIPTION OF THE DRAWINGS] Fig. O1 (at is a cross-sectional diagram showing an engine ignition power distribution device according to an embodiment of the present invention, Fig. O1 is a cross-sectional diagram,
) Figure 2 is a cross-sectional structure diagram of the semiconductor pressure sensor, Figure O8 is a plan view showing the light shielding plate, and Figure O6 is the cross-sectional structure showing the rotational speed sensor and semiconductor ignition device. Figure t,! Figure ll'' is a circuit configuration diagram according to the present invention.In section 1, fi+ ++-husking, +41--semiconductor pressure sensor, +5)--one rotation axis, +15)-m-
Semiconductor ignition device. flL-1 rotational speed sensor. In addition, in FIG. 9, the same reference numerals indicate the same or corresponding parts. Agent Masuo Ohatsu Figure 2 Figure 3 Figure 4 Figure 5 Procedure Amendment (voluntary) 1. Indication of the incident f=! IQ (!1986-11.96
01 No. 2 Name of the invention Engine ignition power distribution device 3, Person making the amendment Representative piece 111 Part 4, Agent 5, Detailed description of the invention in the specification to be amended 1 Detailed description of the invention and drawings 6,' @Correct content (υDetails@Page 5, line 20, r (401) j is corrected to r (402) J. (23 Page 7, line 17, r (204) J) (208) J. (3) In the 8th line of page 9, correct "1~transistor" to "r l-transistor." (4) 18'; A On the 11th line, [engine type ignition advance system Z
j should be corrected to read "mechanical ignition advance device." (5) Corrections will be made as noted in red on the attached sheet engraving in Figure 4 of the drawings. Figure 11

Claims (1)

[Scope of Claims] fi+ A rotating shaft inserted into a housing and rotated by an engine, a rotational speed sensor provided in the housing and outputting an electrical signal according to the rotational speed of the rotating shaft, a semiconductor pressure sensor that is housed on the side of the housing and outputs an electrical signal in accordance with the intake pressure of the engine; An engine ignition power distributor comprising a semiconductor ignition device that performs calculations and controls the ignition timing of the engine according to the calculation results. (2) The semiconductor pressure sensor is comprised of a semiconductor pressure detection element, a thick film hybrid integrated circuit amplifier, and one mold booth that houses these detection elements and the amplifier. Distributor for engine ignition. (3) The rotational speed sensor includes a salivary plate fixed to the nine rotational shafts and having a plurality of slits provided at predetermined angular intervals;
The engine ignition power distributor according to claim 1, characterized in that it comprises a light-emitting element and a light-receiving element arranged so as to sandwich the light-shielding plate. (4) Semiconductor ignition device 7 emits light The engine ignition power distributor according to claim 8, wherein the element and the light receiving element are housed in the same case.