JPS60116154A - Integrated circuit package structure - Google Patents
Integrated circuit package structureInfo
- Publication number
- JPS60116154A JPS60116154A JP22397383A JP22397383A JPS60116154A JP S60116154 A JPS60116154 A JP S60116154A JP 22397383 A JP22397383 A JP 22397383A JP 22397383 A JP22397383 A JP 22397383A JP S60116154 A JPS60116154 A JP S60116154A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- connector
- temperature sensor
- heat sink
- sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は電子機器類に於ける集積回路バンクージ構造に
関する。DETAILED DESCRIPTION OF THE INVENTION <Field of Industrial Application> The present invention relates to an integrated circuit bankage structure in electronic equipment.
（従−＊−轄缶乃ｒｃ曲υ百占へ
近年、電子計算機を始めとする電子機器は小型化し、か
つ動作迷度の高速化に伴い、複数個の集積回路パッケー
ジ等の電子部品を高密度に実装している。そのため機器
内での電子部品の単位面積当りの発熱蓋が増加している
。仁の熱の除去及び機器内の温度の検出は従来第１図に
示す様なものが知られている。即ち、電子機器の筐体ｌ
の上下に冷却用のファン２を取シ付け、プリント回路基
板４上の集積回路パッケージ３よシ発生する熱全筐体ｌ
の外に排出し温度センサー５によシ筺体ｌ内の温度を検
出監視し、その温度が集積回路パンケージ３に損傷を与
えるか、もしくは破壊する茜さに達した場合、警告を発
したり、電子機器の動作を停止する等の処置を行ってい
た。そして最近、集積回路の高集積化、実装の尚密度化
は更に進んでおシ、電子機器内の発熱量は著しく増加し
ている。そのた集積回路に近い位置で集積回路パンケー
ジごとに温度を検出、監視し、熱による集積回路の損傷
、破壊を防ぐ制御の必要が生じている。In recent years, electronic devices such as computers have become smaller and their operation speeds have increased, making electronic components such as multiple integrated circuit packages more expensive. As a result, the number of heat-generating covers per unit area of electronic components within the device has increased.The conventional method for removing heat and detecting the temperature inside the device is as shown in Figure 1. It is known that the housing of electronic equipment
A cooling fan 2 is installed on the top and bottom of the casing, and the heat generated by the integrated circuit package 3 on the printed circuit board 4 is removed.
The temperature sensor 5 detects and monitors the temperature inside the housing 1, and if the temperature reaches a level that would damage or destroy the integrated circuit pancase 3, a warning will be issued or the electronic Measures were taken such as stopping the operation of the equipment. Recently, as integrated circuits have become more highly integrated and their packaging has become more dense, the amount of heat generated within electronic devices has increased significantly. In addition, there is a need for control to detect and monitor the temperature of each integrated circuit pancase at a location close to the integrated circuit to prevent damage or destruction of the integrated circuit due to heat.
しかし乍ら、第１図に於ける従来の温度検出にあっては
、筺体ｌ内の全体の温度の検出を行うこととしていたた
め、集積回路パッケージ３ごとに温度の検出、監視を行
うことは出来ず、熱による集積回路パンケージごとの損
傷、破壊を防ぐ制御が為し得ないという問題点かあった
。However, in the conventional temperature detection shown in FIG. 1, the entire temperature inside the casing 1 is detected, so it is not possible to detect and monitor the temperature of each integrated circuit package 3. However, there was a problem in that it was impossible to control the integrated circuit pancakes from being damaged or destroyed by heat.
〈発明の目的〉
本発明の目的は、上記問題点を解決しへ個々に温度検出
、監視が出来、熱による損傷、破壊を防止することの出
来る集積回路バックージ構造を提供することにある。<Object of the Invention> An object of the present invention is to solve the above-mentioned problems by providing an integrated circuit backage structure that can individually detect and monitor temperature and prevent damage and destruction due to heat.
〈発明の構成〉
本発明の集積回路バンクージ構造は、温度センサー該温
度センサーの信号端子が接続され削記温度センサーの信
号を伝えるフレキシブルプリント板及び該フレキシブル
プリント板を温度検出回路につながるリード線に接続す
る中継コネクタｔ−備えるサブアセンブリと、集積回路
ノくツケージに取シ付けられ、上記サブアセンブリを埋
め込むための姉を持ち且つ前記中継コネクタを固定する
ヒートシンクとからなる構成とすることにより上記従来
の問題点を解決している。<Structure of the Invention> The integrated circuit bank structure of the present invention includes a flexible printed board to which a signal terminal of the temperature sensor is connected and transmits a signal from the temperature sensor, and a lead wire connecting the flexible printed board to a temperature detection circuit. The above-mentioned conventional method can be improved by constructing a structure consisting of a subassembly provided with a relay connector T to be connected, and a heat sink that is attached to an integrated circuit socket cage, has a sleeve for embedding the subassembly, and fixes the relay connector. problem is solved.
〈実施例〉
以下本発明の一実施例を第２図ないし第５図に基づいて
説明する。第２図に於いて３が集積回路パッケージ、６
がセラミック基板で、該セラミック基板は、信号、電源
、グランド用等のビン８、ヒートシンク７及び第５図に
示す集積回路チップキャリア１４を持っている。尚１５
は集積回路チップキャリアのリード線でめる。上記ヒー
トシンク７には該ヒートシンク７の熱特性にほとんど影
響勿与えない程度の狭い通し溝１２があシ賊通し溝１２
には温度センサー５．７レキシグルプリント板９及び中
継コネクター１０からなるサブアセンブリ１７が埋め込
まれる。温度センサー５はフレキシグルプリント板９と
接続しコレ等＆［センサー５及びフレキシブルプリント
板９はヒートシンクは絶縁されで埋め込まれている。７
レキシグルプリント板９は温度センサー５の信号を伝え
るためのパターンを持っておシ中継コネクタ■０に接続
される。中継コネクタ１０は第３図に示すように中継コ
ネクタ１ｏが持っている固定ビン１３を介しヒートシン
ク７に固定される。また中継コネクタ１ｏがらは図示せ
ぬ監視用の温度検出回路に接続するためのリード線が出
ている。尚ここで使用σれるｔｉＦｎｋＬセフｆ−５と
しては、丈−ミスタ、熱電対ま７こＱよ半専体温度セン
サー（例えはアナログ・デバイセズ社製ＡＤ５９０等）
いずれでめっでも良い。従って集積回路パンケージｊ６
に温度検出機能を持たせることが出来、高密度に実装さ
れた集積回路パッケージ１６ごとに温度の検出監視が可
能となり、熱による損傷、破壊を防ぐだめの警告の発生
や電子機器の動作停止等の制御が集積回路パンケージ単
位で行うことが可能となる。尚、本実施例でｔよ集積回
路チンプｔ−ｉ個搭載したシングルチップパッケージの
例を示したが、複数個の集積回路チップを搭載したマル
チチップパッケージに対しても同様の構造で温度を検出
できることは言うまでもない。<Example> An example of the present invention will be described below with reference to FIGS. 2 to 5. In Figure 2, 3 is an integrated circuit package, and 6 is an integrated circuit package.
is a ceramic substrate, and the ceramic substrate has bins 8 for signals, power, ground, etc., a heat sink 7, and an integrated circuit chip carrier 14 shown in FIG. Sho 15
are connected to the leads of the integrated circuit chip carrier. The heat sink 7 has a narrow through groove 12 that has almost no effect on the thermal characteristics of the heat sink 7.
A subassembly 17 consisting of a temperature sensor 5.7, a LexiGlu printed board 9, and a relay connector 10 is embedded in the. The temperature sensor 5 is connected to a flexible printed board 9, and the sensor 5 and the flexible printed board 9 are embedded with an insulated heat sink. 7
The LexiGlu printed board 9 has a pattern for transmitting the signal of the temperature sensor 5 and is connected to the relay connector 0. As shown in FIG. 3, the relay connector 10 is fixed to the heat sink 7 via a fixing pin 13 held by the relay connector 1o. Further, a lead wire for connecting to a monitoring temperature detection circuit (not shown) is protruded from the relay connector 1o. The tiFnkL f-5 used here includes a length mister, a thermocouple M7Q, and a semi-dedicated temperature sensor (for example, AD590 manufactured by Analog Devices).
Either is fine. Therefore integrated circuit pancage j6
This makes it possible to detect and monitor the temperature of each integrated circuit package 16 that is mounted in high density, generating warnings to prevent damage and destruction due to heat, and stopping the operation of electronic equipment. control can be performed on an integrated circuit panpackage basis. Although this embodiment shows an example of a single-chip package in which t-i integrated circuit chips are mounted, the temperature can also be detected using a similar structure for a multi-chip package in which a plurality of integrated circuit chips are mounted. It goes without saying that it can be done.
〈発明の効果〉
本発明の集積回路パッケージ構造は上述の如き構成とし
たため、集積回路パンケージに設けた温度センサーによ
って集積回路パッケージごとに温度を検出、監視Ｊ−る
ことができ、従来のように仮数の集積回路パッケージを
収容する電子機器の筐体内の温度を検出する場合に比し
確実に集積回路の損傷、破壊防止制御を為すことかでき
、その結果近年の集積回路の高集積化、実装の高密度化
に確実に対処できることとなるという効果がある。<Effects of the Invention> Since the integrated circuit package structure of the present invention is configured as described above, it is possible to detect and monitor the temperature of each integrated circuit package using the temperature sensor provided in the integrated circuit pancase, and it is possible to detect and monitor the temperature of each integrated circuit package using the temperature sensor provided in the integrated circuit pancase. Compared to the case of detecting the temperature inside the housing of an electronic device that houses a mantissa integrated circuit package, it is possible to control the damage and destruction of the integrated circuit more reliably, and as a result, the recent increase in the degree of integration and packaging of integrated circuits is possible. This has the effect of being able to reliably cope with the increasing density of
第１図は従来の電子機器に於ける集積回路パッケージの
温度検出４４８造を示す概略図、第２図は本発ゆ」の一
実施例に係る集積回路パンケージ構造の斜視図、
第３図は第２図矢示Ａ方向から見た平面図、第４図は本
実施例のサブアセングリの力、十視図、そして第５図は
第２図のｂ −ｂ’勝断凹図である。
３・・・菓イＪ！回路パッケージ
５・・・温度センサー ７・°・ヒートシンク９・・・
フレキシグルグリン）＆
１０・・・中継コイ、フタ １１・・・リードＷ１２・
・・通し飾」′７・・・サグアセンブリ出願人 日本電
気株式会社
第１図
第′３図
第４図
７
第 ５ 口１FIG. 1 is a schematic diagram showing a temperature detection structure of an integrated circuit package in a conventional electronic device, FIG. 2 is a perspective view of an integrated circuit pancake structure according to an embodiment of the present invention, and FIG. FIG. 2 is a plan view seen from the direction of arrow A, FIG. 4 is a ten-dimensional view showing the force of the subassembly of this embodiment, and FIG. 5 is a b-b' concave cutaway view of FIG. 3...Kai J! Circuit package 5...Temperature sensor 7.° Heat sink 9...
Flexigurgurin) & 10... Relay carp, lid 11... Lead W12.
...Throughout Decoration'''7...Sag Assembly Applicant NEC Corporation Figure 1 '3 Figure 4 Figure 7 No. 5 Port 1
Claims (1)
記温度センサーの信号を伝えるフレキシブルプリント板
及び該フレキシブルプリント板を温度検出回路につなが
るリード線に接続する中継コネクタを備えるサブアセン
ブリと、−集積回路パッケージに取シ付けられ、上口己
サブアセンブリを埋め込むだめの溝を持ち且つ自ＩＪ記
中継コネクタを固定するヒートシンクとからなる集積回
路パンケージ構造。a subassembly comprising a temperature sensor, a flexible printed board to which a signal terminal of the temperature sensor is connected and transmits a signal of the temperature sensor, and a relay connector that connects the flexible printed board to a lead wire connected to a temperature detection circuit; - an integrated circuit; An integrated circuit package structure that is attached to a package and includes a heat sink that has a groove for embedding an upper subassembly and that fixes an IJ relay connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22397383A JPS60116154A (en) | 1983-11-28 | 1983-11-28 | Integrated circuit package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22397383A JPS60116154A (en) | 1983-11-28 | 1983-11-28 | Integrated circuit package structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60116154A true JPS60116154A (en) | 1985-06-22 |
| JPH0145982B2 JPH0145982B2 (en) | 1989-10-05 |
Family
ID=16806576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22397383A Granted JPS60116154A (en) | 1983-11-28 | 1983-11-28 | Integrated circuit package structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60116154A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0267652U (en) * | 1988-11-08 | 1990-05-22 | ||
| US7416332B2 (en) * | 2006-03-29 | 2008-08-26 | Harris Corporation | Flexible circuit temperature sensor assembly for flanged mounted electronic devices |
| WO2016087218A1 (en) * | 2014-12-05 | 2016-06-09 | Siemens Aktiengesellschaft | Heat sink for cooling an electric device |
| US10488062B2 (en) | 2016-07-22 | 2019-11-26 | Ademco Inc. | Geofence plus schedule for a building controller |
| US10534331B2 (en) | 2013-12-11 | 2020-01-14 | Ademco Inc. | Building automation system with geo-fencing |
| US10895883B2 (en) | 2016-08-26 | 2021-01-19 | Ademco Inc. | HVAC controller with a temperature sensor mounted on a flex circuit |
-
1983
- 1983-11-28 JP JP22397383A patent/JPS60116154A/en active Granted
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0267652U (en) * | 1988-11-08 | 1990-05-22 | ||
| US7416332B2 (en) * | 2006-03-29 | 2008-08-26 | Harris Corporation | Flexible circuit temperature sensor assembly for flanged mounted electronic devices |
| US10534331B2 (en) | 2013-12-11 | 2020-01-14 | Ademco Inc. | Building automation system with geo-fencing |
| US10591877B2 (en) | 2013-12-11 | 2020-03-17 | Ademco Inc. | Building automation remote control device with an in-application tour |
| US10649418B2 (en) | 2013-12-11 | 2020-05-12 | Ademco Inc. | Building automation controller with configurable audio/visual cues |
| US10712718B2 (en) | 2013-12-11 | 2020-07-14 | Ademco Inc. | Building automation remote control device with in-application messaging |
| US10768589B2 (en) | 2013-12-11 | 2020-09-08 | Ademco Inc. | Building automation system with geo-fencing |
| WO2016087218A1 (en) * | 2014-12-05 | 2016-06-09 | Siemens Aktiengesellschaft | Heat sink for cooling an electric device |
| US10488062B2 (en) | 2016-07-22 | 2019-11-26 | Ademco Inc. | Geofence plus schedule for a building controller |
| US10895883B2 (en) | 2016-08-26 | 2021-01-19 | Ademco Inc. | HVAC controller with a temperature sensor mounted on a flex circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0145982B2 (en) | 1989-10-05 |
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