JPS6011422Y2 - evaporative cooling equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an evaporative cooling device, and more particularly to an evaporative cooling device with an improved cooling structure for evaporated refrigerant.

For example, a method of cooling electrical equipment such as a transformer using the latent heat of vaporization required when a refrigerant such as fluorocarbons evaporates from liquid to gas is called evaporative cooling.

In this evaporative cooling method, once the refrigerant vapor is released to the outside, it is difficult to recover the refrigerant and it is necessary to constantly supply refrigerant liquid to the equipment. The refrigerant vapor generated by boiling is cooled and liquefied, returned to the heat generating part, boiled again, and evaporated. This cycle is carried out in a closed container housing the main body of the device.

In high-voltage electrical equipment such as transformers, non-condensing SF is used to maintain insulation performance during no-load and light-load conditions.
6 gases etc. are used mixed with refrigerant.

In addition, non-condensable gases are mixed in the refrigerant itself.

By the way, these non-condensable gases cause a large permanent burden on heat transport for evaporative cooling.

FIG. 1 shows a sectional view of the vicinity of a cooler 2 installed in the upper space of a conventional closed container 1. As shown in FIG.

In the figure, heated refrigerant vapor and non-condensable gas rise from the bottom.

When the refrigerant vapor passes through the surface of the fins 3 of the cooler 2, it is cooled, condensed, and liquefied.

The non-condensable gas rises to the upper space of the cooler 2 while remaining gaseous.

Therefore, a considerable amount of non-condensable gas will remain in the space 4, and will circulate again to the surface of the fin 3 due to the convection phenomenon.

This prevents the rising refrigerant vapor from coming into contact with the surface of the fins 3 and being cooled.

As a result, the condensation efficiency of the refrigerant is extremely reduced, the internal pressure of the closed container is increased, the boiling point of the refrigerant is increased, and efficient evaporative cooling cannot be performed.

An object of the present invention is to provide an evaporative cooling device that separates non-condensable gas and refrigerant vapor around an evaporative refrigerant cooler, promotes condensation of the refrigerant vapor, and has efficient evaporative cooling performance.

An embodiment of the present invention will be described below with reference to the drawings.

An evaporative refrigerant cooler 2 is installed in the upper space of a closed container 1 that houses an electrical equipment main body (not shown) inside.

The cooler 2 has a pipe 2a that hermetically penetrates the wall 1a of the container 1.
A fin 3 is attached to the surface of the fin 3.

Water or air is passed through the pipe 2a as a cooling medium.

A non-condensable gas retention space 5 is provided between the upper part of the cooler 2 and the upper inner wall of the container 1.

A partition wall 6 made of a wire mesh or a plate having a large number of small holes is provided between the cooler 2 and the non-condensable gas retention space 5.

Further, the outer wall of the container 1 above the cooler 2 is covered with a heat insulating material 7.

Next, the operation of the present invention will be explained.

When the non-condensable gas that is heated and rises due to the heat of the electrical equipment body (not shown) and stays in the space 5 descends from the space 5 to the fins 3, flow resistance occurs when it passes through the holes in the partition wall 6. A large vortex as shown in FIG. 1 is not generated, but a small vortex is generated near the space 5 and the partition wall 6, and the amount of non-condensable gas flowing into the surface of the fin 3 is reduced.

Therefore, the non-condensable gas rising from the fins 3 gradually becomes retained in the space 5.

Therefore, the concentration of non-condensable gas in the refrigerant vapor is reduced, the condensation of the refrigerant vapor on the surface of the fins 3 is promoted, and the cooling efficiency is improved.

In addition, as the partition wall 6, instead of a plate having small holes, wire mesh or thin plates arranged in a fin shape may be used.

In this manner, by providing the partition wall 6 and separating the non-condensable gas present in the refrigerant vapor in the space above the cooler 2 and allowing it to accumulate therein, the efficiency of condensing the refrigerant vapor on the fin surface can be promoted.

As explained above, the present invention separates non-condensable gas and refrigerant vapor around an evaporative refrigerant cooler, promotes condensation of refrigerant vapor, and provides evaporative cooling equipment that has efficient evaporative cooling performance. can be provided.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing a structure near a conventional cooler, and FIG. 2 is a sectional view showing a structure near a cooler according to an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Airtight container, 2... Evaporative refrigerant cooler, 4... Upper space, 5... Space for non-condensable gas retention, 6... ...Division wall.

Claims (1)

[Claims for Utility Model Registration] ■ In an evaporative cooling device in which a main body of the device is housed in a sealed container filled with a refrigerant liquid and a non-condensable gas, an upper inner wall of the sealed container is provided in an upper space of the sealed container. A partition wall with a non-condensable gas retention space provided therebetween, an evaporative refrigerant cooler installed therein, and a partition wall having a large number of small holes between the upper part of the evaporative refrigerant cooler and the non-condensable gas retention space. An evaporative cooling device characterized by being provided with. 2. The evaporative cooling device according to claim 1 of the utility model registration claim, wherein the partition wall is a wire mesh.