JPS60113448A - 電力半導体素子の液冷のための冷却体 - Google Patents
電力半導体素子の液冷のための冷却体Info
- Publication number
- JPS60113448A JPS60113448A JP22696784A JP22696784A JPS60113448A JP S60113448 A JPS60113448 A JP S60113448A JP 22696784 A JP22696784 A JP 22696784A JP 22696784 A JP22696784 A JP 22696784A JP S60113448 A JPS60113448 A JP S60113448A
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- shape
- slit
- liquid
- cooling body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims description 139
- 239000004065 semiconductor Substances 0.000 title claims description 19
- 239000000110 cooling liquid Substances 0.000 claims description 20
- 239000007788 liquid Substances 0.000 claims description 9
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 6
- 101700004678 SLIT3 Proteins 0.000 description 5
- 102100027339 Slit homolog 3 protein Human genes 0.000 description 5
- 239000002826 coolant Substances 0.000 description 3
- 239000012809 cooling fluid Substances 0.000 description 3
- QNRATNLHPGXHMA-XZHTYLCXSA-N (r)-(6-ethoxyquinolin-4-yl)-[(2s,4s,5r)-5-ethyl-1-azabicyclo[2.2.2]octan-2-yl]methanol;hydrochloride Chemical compound Cl.C([C@H]([C@H](C1)CC)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OCC)C=C21 QNRATNLHPGXHMA-XZHTYLCXSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH5919/83-9 | 1983-11-02 | ||
| CH591983 | 1983-11-02 | ||
| CH6013/83-0 | 1983-11-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60113448A true JPS60113448A (ja) | 1985-06-19 |
| JPH0423831B2 JPH0423831B2 (enrdf_load_stackoverflow) | 1992-04-23 |
Family
ID=4301516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22696784A Granted JPS60113448A (ja) | 1983-11-02 | 1984-10-30 | 電力半導体素子の液冷のための冷却体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60113448A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4747450A (en) * | 1985-09-18 | 1988-05-31 | Kabushiki Kaisha Toshiba | Method for producing heat sink and heat sink thus produced |
| JP2002373963A (ja) * | 2001-06-15 | 2002-12-26 | Nippon Buroaa Kk | フィン付き放熱器及びその製造方法 |
-
1984
- 1984-10-30 JP JP22696784A patent/JPS60113448A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4747450A (en) * | 1985-09-18 | 1988-05-31 | Kabushiki Kaisha Toshiba | Method for producing heat sink and heat sink thus produced |
| JP2002373963A (ja) * | 2001-06-15 | 2002-12-26 | Nippon Buroaa Kk | フィン付き放熱器及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0423831B2 (enrdf_load_stackoverflow) | 1992-04-23 |
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