JPS60109127A - High frequency electromagnetic relay - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of the Invention] The present invention is resistant to high frequency electromagnetic relays that open and close high frequency signals.

[Prior art and its problems]

Conventionally, high-frequency electromagnetic relays have been widely mounted on a printed circuit board on which a predetermined pattern has been formed. A ground terminal was installed between the contact terminals. One of the conventional embodiments is shown in FIGS. 1 and 2. 1 is a high frequency electromagnetic relay, 2 is a case, 3 is a base, 4 is a contact terminal, 5 is a coil terminal, 6 is a ground terminal,
7 is a standoff, and 10 is a substrate. 11 is a contact terminal block. The base 3 and the non-north terminal 6 are integrally molded by resin molding. Except for the area around the contact terminal block 11 and the coil terminal 5, the inner and outer surfaces of the base 3 are
The base 3 on the right side of the high frequency shield part and the ground terminal 6 are connected in a saline manner by the negative conductor without any press-contact parts, so a good electrical connection is achieved. It had excellent high frequency characteristics. ((a) in Figure 5) However, in this example, the earth terminal 6, which is a resin molded product, is plated, but
When mounting and soldering on the board 10, semi-ITJ
+jJ There is a problem with the heat, and the internal resin of the ground terminal 6 is
i′! Due to the expansion, the CIJ-Ni film is destroyed, resulting in electrical connection failure in the ground pattern of the substrate 10, which may significantly deteriorate the high frequency characteristics.

((l) in Fig. 5)) Fig. 3.4 shows a prior art that improves the drawbacks of the above-mentioned conventional art. A good conductivity of 11 K
It is integrally molded with a ground plate 13 of 1-C, and a cut-out portion 8 is press-fitted and fixed to the base 3. High 1. ', 1
Mounting the wave electromagnetic relay on the board 10 Half 1-1.1 (i)! (c) in Figure 5)
However, when mounting on the board 10, 11.1. Due to the deformation of the resin part of the base 3 coated with Cu-Ni around the cut and raised part 8, the pressure contact between the ground plate cut and raised part 8 and the base 3 becomes incomplete, and the high frequency characteristics are significantly deteriorated. ((d) in Figure 5) Connect the metal (iron) there to the earth terminal 6.
There is a method using this method, but in this method, the conductivity is ru<
<If the product is damaged, the high frequency characteristics will deteriorate even before the soldering process is completed. ((e) in Figure 5) The above conventional example i
13 and prior art are “F 111 (!J
The disadvantage is that the high frequency characteristics deteriorate when the

[Purpose of the invention]

The present invention has been made in view of the drawbacks of the prior art described in 2.2 and the prior art 1j. The purpose of the present invention is to provide a high frequency electromagnetic relay that can maintain good grounding.

[Structure and effects of the invention]

In order to achieve the above object, the present invention applies a conductive film having plasticity to the ground plate disposed between the insulating terminal block and the base, so that the electricity between the terminal block and the ground plate is By maintaining a good connection θf, it is possible to improve the high frequency characteristics of the high frequency signal that passes through the terminal block.

[Explanation of Examples]

An embodiment of the present invention will be described with reference to the drawings.

Fig. 6 shows an exploded perspective view of a C1 frequency electromagnetic relay, which is an embodiment of the present invention, with poly-8 schematically shown, case 2, base 3 to 4.
(,t, is made, and the base 3 has Cu-Ni on the inside and outside Jξ.
The two contact terminal blocks 11 holding the contact terminals/I that pass through the shell are press-fitted into the base 3 from the bottom i? A] The grounding plate 13 (material: KFC) surrounding the cut J3 strainer 7 for A] is arranged so that it surrounds both sides of each J8 point condenser 4 in a loop shape, and connects the cut J3 strainer ε3 to the base 3 contact terminal. It is fixed by press-fitting it between the base 3 and the ground terminal 6.
Electrical connection is established by press-fitting the cut-out portion 8 of No. 3. The ground plate 13 including the cut J3 strainer portion 8 is coated with a conductive film having plasticity (for example, solder plating) on both the front and back sides.

The spool 15 where the iron core 25 is formed from the insert 1 includes:
The coil terminal 5 is press-fitted and fixed into the collar hole 26 of the spool 15. The cut-out portion 23 of the y τ 914 is fitted into the flange hole 24 of the spool 15 and fixed.

The spool 15 is fixed to the base 3 by heat caulking.

On card 18, there are two pieces of iron 1G on the right side and one piece of iron 1'17 sandwiched in the shape of a = ] character (, [+7Il 'zzd). Also, car 61
8, four LE through holes 27 are provided, and the contact P is connected thereto.
rl: Movable block 19 in which Ha20 is molded
is press-fitted and fixed. The card 18 has a spring A22. Spring B21 is fixed by caulking.

Due to the parallel movement magnetic circuit, it stably moves in a direction perpendicular to the contact piece 20 and parallel to the bottom surface of the base 3 while being suspended by the spring Δ22.821. As a result, the contact piece 2
0 also moves in parallel, forming a switch mechanism that opens the high frequency signal.

As shown in Figure-15, the high-frequency electric current (A connection) according to this embodiment is connected to a small device, and the solder connection of the actual device K? Before (to) J, Rimo, Mounting solder I' [No (1) shows better characteristics' (see below).

Here, before heating the ground terminal 6 as shown in Fig. 9'17, in other words, the ground terminal 6 is connected to the PCB 21' Ll.
l fJ cut the base 3 ground plate 13 in front of the riruru, 1
3 Check the connection status with the strainer part 8. Figure 917 shows J3 and C1.
Eight was plated on base 3 (/Umetsu l'li'+,
Reference numeral 13 indicates a Ni plating layer plated on the base 3, and a half-D plating layer, which is one of the conductive films applied to the ground terminal 6 to prevent plasticity. As shown, the base 3 is not deformed before heating (before half IJJ (J t:J), and the base 3. Cu plating layer △, N
1 plating layer B, soldering: 1 leg f4C.

J3 and contact terminal block 11 are good! It is maintained in an IY pressure contact state.

Next, as shown in FIG. 8, after heating the ground terminal 6, the ground terminal 6 is soldered to the pudding 1 to the substrate from 4 degrees, and the base 3 and the cut-out portion 8 of the ground plate 13 are joined together. condition f
1! ; indicates η. As shown in FIG. 8, the base 3. C
The Ni plating 1i('i 13) and the contact terminal book 11 are thermally deformed as shown in Fig.A.
11M0 is plastically deformed and the Ni plating layer 8 of the 5-base 3 is welded J', so that the contact DI,
l,: child block coblock 11. Base ground plate 1
No. 3 cut J7 Strain part 8 Which electrical connection (Rabe (4KC)
It's actually 41'. 1 J, as shown in Figure 5), the deterioration of high frequency characteristics due to soldering (J IJ) as before has disappeared, and the ( ) shows better high-frequency characteristics than the

In the present embodiment, excellent convex frequency characteristics are obtained by using heating with a single outlet, but in another embodiment, heating is performed in advance using ultrasonic waves.

[Brief explanation of the drawing]

FIG. 1 is a front view of a conventional high-frequency relay having a base and earth terminal integrally molded with resin, and FIG. 2 is a bottom view thereof. Third
The figure shows a metal ground plate (KFC) used as the ground terminal.
Fig. 4 is a front view of the high frequency relay, and Fig. 4 is a bottom view thereof. FIG. 5 shows the homopolar leakage ('Hfi) diagram ('Hfi diagram)' that occurs in each individual. FIG. 6 is an exploded perspective view of an embodiment of the present invention, and FIG. An enlarged view of the press-fitted part of the cut-out part of the previous ground plate into the base, Figure 8 is half 1 [1 (J
1: It is an enlarged view of the press-fitted part of the base of the cut d3 strain part of the ground plate after J. 3...Base, /'l...Contact terminal, 6...]7
−S terminal. 8...Cut fJ3 strainer part. Special i1'l Applicant: Tateishi Electric Co. Ltd.

Claims (2)

[Claims] (1) Insert the insulating terminal block into the base, and connect the base with 9i1.
; A high-frequency electromagnetic appliance in which a ground plate is interposed between the base and the terminal block, and the ground plate is protruded from the bottom surface of the base, wherein the ground plate disposed between the base and the terminal block is made of plastic. A high frequency electromagnetic relay characterized by being coated with a conductive film having (2) The high frequency electromagnetic relay according to claim 1, wherein the conductive film is a heat-meltable conductive film.