JPH07211212A - Relay - Google Patents

Abstract

PURPOSE:To provide a relay with excellent solderability and excellent high frequency properties. CONSTITUTION:A housing 10 is composed of a box-like case 11 having an opened lower face and a based 12 to be fixed in the opened lower face of the case 11. The base 12 is made of a printed board of a ceramic. Circuit pattern parts 13a, 13b as terminals are formed in the base 12. The terminals are composed of circuit patterns, so that terminals of a conventional relay are made unnecessary. Consequently, position difference occuring between a circuit pattern and a terminal in the printed substrate due to the deformation of the terminal can be avoided and troubles such as alteration, deterioration, etc., of high frequency properties due to the terminals are solved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a so-called surface mount type relay mounted on a component surface of a printed circuit board by soldering.

[0002]

2. Description of the Related Art In a conventional relay A mounted on a component surface of a printed circuit board by soldering, as shown in FIG. It was mounted by soldering to the component side of the printed circuit board using.

[0003]

However, with the above-described structure, when the terminal 21 is deformed, the wiring pattern for soldering the terminal 21 of the printed circuit board and the terminal 21 are out of position, and the soldering works well. There was a problem that I could not attach it. Further, because of the terminal 21, there is a problem that the stray capacitance becomes large and the high frequency characteristics are not stable or deteriorate.

The present invention has been made in view of the above points, and an object of the present invention is to provide a relay having excellent solderability and good high frequency characteristics.

[0005]

In order to achieve the above object, the present invention provides a housing comprising a box-shaped case having an open lower surface and a base attached to the open lower surface of the case. The base is formed of a printed circuit board, and the wiring pattern portion as a terminal is formed on the base.

From the viewpoint of excellent heat resistance and resistance to thermal deformation, it is desirable to use a ceramic board as the printed circuit board. In order to enable the case and the base to be sealed easily and in a short time, the invention according to claim 3 forms a metal portion at the joint between the case and the base and welds the base to the case. It is designed to be sealed.

When the wiring pattern portion of the base is continuous to the upper surface of the base as described in claim 4, an insulating layer is formed on the wiring pattern portion, and a metal is formed on the insulating layer. The part may be formed. When it is necessary to connect the wiring pattern portion of the base to the wiring pattern on the upper surface of the base, the wiring pattern portion and the wiring pattern on the upper surface are connected via a through hole. You may do it.

[0008]

According to the invention of claim 1, the terminals are formed by the wiring pattern as described above, and the terminals in the conventional relay are eliminated,
It is possible to solve the problems that the wiring pattern of the printed circuit board is displaced from the terminal due to the deformation of the terminal and the high frequency characteristics are changed or deteriorated by the terminal.

According to the second aspect of the present invention, a ceramic substrate is used as the printed circuit board to improve the heat resistance of the base and prevent the base from being thermally deformed. According to the invention of claim 3, by forming a metal portion in each of the joint portion between the case and the base and sealing the base in the case by welding,
The case and the base can be easily and quickly sealed.

[0010]

【Example】

(Embodiment 1) FIGS. 1 to 3 show an embodiment of the present invention.
As shown in FIG. 1A, the relay housing 10 according to the present embodiment has a box-shaped case 1 made of a synthetic resin and having an open bottom surface.
1 and a flat plate-shaped base 12 which is attached so as to cover the lower surface of the case 11. As shown in FIG. 2, the electromagnet block X is housed in the upper part of the case 11, and the armature block Y is housed in the space formed between the electromagnet block X and the base 12.

The electromagnet block X has a substantially U-shaped iron core 1 formed of a magnetic material that opens downward, and a synthetic resin coil bobbin 2 that is integrally formed by inserting the iron core 1.
And a coil 3 wound around a coil bobbin 2, and a permanent magnet 4 interposed between the iron core 1 and the armature block Y. In the case of this embodiment, the permanent magnet 4 is also formed integrally with the coil bobbin 2. However, the permanent magnet 4 is interposed between the iron core 1 and the armature block Y, and if the magnetomotive force can be exerted, the permanent magnet 4 is attached to the lower surface of the electromagnet block X excluding the permanent magnet 4 by adhesion or the like. Good. Further, in this case, the permanent magnet 4 may be formed in a substantially flat plate shape that is long in the longitudinal direction of the case 11 of FIG. 2, and the central portion and both ends may be magnetized with different polarities.

The electromagnet block X is secondarily formed by being molded in the case 11, and is integrally formed with the case 11. The electromagnet block X and the case 11 are not always required.
It is not necessary to integrally mold and. However, the integral molding has an advantage that the swelling of the case 11 due to the applied heat can be reduced when the reflow soldering is performed.
In the electromagnet block X of this embodiment, two coils 3 are wound around the coil bobbin 2 with opposite polarities, and each coil 3
A pair of coil terminals 13 connected to both ends of the case 1
1 is derived from both end faces of the coil terminal 13
Are laid down along the side surface of the case 11. Even if both ends of the iron core 1 are integrally formed, they are exposed inside the case 11.

In the armature block Y, a plate-shaped armature 5 made of a magnetic material and two contact springs 6 are arranged side by side with the contact springs 6 centered on the armature 5. The central portion is molded with synthetic resin to be integrally formed. Both ends of the contact spring 6 are bifurcated, and a movable contact 8 is fixed to the lower surface of the tip thereof. As shown in FIG. 2, on the lower surface of the insulating portion 7 made of synthetic resin in which the armature 5 and the contact spring 6 of the armature block Y are inserted, as shown in FIG. 7a is formed. Note that, as shown in FIG. 2, the rotation fulcrum 7a may be formed also on the upper surface side of the insulating portion 7. From both sides of the insulating portion 7, hinge spring pieces 6a integral with the respective contact springs 6 are provided in a protruding manner.

The base 12 is composed of a printed circuit board. The printed circuit board is preferably made of, for example, a ceramic such as glass epoxy resin in order to increase heat resistance and prevent thermal deformation. It goes without saying that ceramics other than glass epoxy resin may be used. A wiring pattern is formed on the base 12 at the center of both sides of the connecting portion 12a for connecting the hinge spring pieces 6a by soldering. Here, the armature block Y is attached to the base 12 in a seesaw-movable manner, with the hinge spring piece 6a soldered to the connecting portion 12a.

A fixed contact 9 with which the movable contact 8 contacts and separates is integrally formed at a position corresponding to the movable contact 8 fixed to each contact spring 6 of the base 12. A conductive portion 12b electrically connected to the fixed contact 9 is also formed in the portion where the fixed contact 9 is formed. In addition, the fixed contact 9 is not integrally formed with the base 12, but the conductive portion 1 is not formed.
It is also possible to use 2b as the fixed contact portion.

Semi-circular recesses 14 are formed on both sides of the base 12 corresponding to the connecting portions 12a and the conductive portions 12b, and a wiring pattern is formed continuously through the inner surface of the recesses 14 to the lower surface of the base 12. is there. The continuous wiring pattern portion 13a is shown in FIG. Furthermore, base 1
Recesses 15 are also formed at both ends of the wiring 2, and a wiring pattern portion 13b is formed from the inner surface of the recess 15 to the lower surface of the base 12. Here, the recess 14 in the base 12,
Wiring pattern portion 13 continuous from the inner surface to the lower surface of 15
Reference numerals a and 13b are portions to be soldered to the printed circuit board in the same manner as the electrode portions to be soldered in a chip component or the like, and correspond to terminals in a relay having a conventional terminal. More specifically, the wiring pattern 13a continuous with the connecting portion 12a serves as a common terminal, and the wiring pattern 13a continuous with the conductive portion 12b serves as a fixed contact terminal. Further, when the base 12 is attached to the lower surface of the case 12 and soldered to the printed circuit board, the recess 15 and the wiring pattern 13b are soldered to the coil terminal 13, and the recess 15 and the wiring pattern 13b are connected to the conventional relay. It becomes a substantial coil terminal.

In this embodiment, since there is no terminal in the conventional relay as described above, the conventional problem does not occur. In other words, the deformation of the terminal does not cause the wiring pattern of the printed circuit board to be displaced from the position of the terminal, the high-frequency characteristics of the terminal to change, or the terminal to deteriorate.
Moreover, since the so-called terminals are formed by using the wiring pattern of the base 12, there is an advantage that the pitch between the wiring pattern portions 13a and 13b corresponding to the terminal pitch can be arbitrarily set. Further, the wiring pattern portions 13a and 13b corresponding to the terminals can be formed in an optimum shape for high frequency matching, which is suitable as a high frequency relay.

If the base 12 is attached to the lower surface of the case 11 with the armature block Y attached to the base 12, the relay is assembled as shown in FIG. In addition,
In this assembled state, connect the coil terminal 13 to the wiring pattern 13b.
It may be connected by soldering or the like. In the assembled state, both ends of the armature 5 face the ends of the iron core 1 exposed inside the case 11.

In the relay of this embodiment, when one of the coils 3 is energized, the magnetomotive force generated by the electromagnet block X attracts one end of the armature 5 to one end of the iron core 1 to rotate the armature block Y. It rotates about the fulcrum 7a. By the rotation of the armature block Y, among the movable contacts 8 fixed to the respective contact springs 6, those fixed to the side opposite to the side where the armature 5 is attracted to the iron core 1 are fixed contacts. Contact 9. The rotating state of the armature block Y is maintained by the magnetic force of the permanent magnet 4 even when the power supply to the coil 3 is stopped. When the movable contact 8 and the fixed contact 9 on the opposite side are brought into contact with each other,
It suffices to energize the coil 3 opposite to the coil 3. In this case as well, the rotating state of the armature block Y is maintained by the magnetic force of the permanent magnet 4 even when the energization of the coil 3 is stopped. That is, the relay of this embodiment operates in a so-called bistable manner.
It should be noted that the same operation is performed even if the number of the coils 3 is one and the direction in which the current is applied to the coils 3 is switched. Also,
By making the spring load of the hinge spring piece 6a unbalanced in the longitudinal direction of the contact spring 6, the ends of the iron core 1 and the armature 5 on the same side always contact each other when the coil 3 is not energized. In addition, it is also possible to use a so-called monostable relay in which the armature block Y rotates.

(Embodiment 2) FIG. 4 shows another embodiment of the present invention. In the above-mentioned relay, it is necessary to hermetically seal the joint between the case 11 and the base 12. Conventionally, this sealing has been performed using an epoxy adhesive or the like. However, there is a problem that it takes time and labor to perform sealing with an adhesive. Therefore, in this embodiment,
The sealing is performed without using an adhesive.

In this embodiment, the metal portion 16 is formed over the entire circumference of the joint portion with the base 12 of the case 11. In addition,
The metal part 1 can be formed by plating or inserting a metal material. When the electromagnet block X is not integrally formed with the case 11, the case 1
It may be made of metal as 1, and in this case, the metal portion 16 is unnecessary.

Then, a ceramic coating is applied to a portion of the base 12 corresponding to the metal portion 16 to form an insulating layer 17, and a metal portion 18 is formed on the insulating layer 17. Here, the insulating layer 17 includes the connecting portion 12a,
It is formed in order to insulate the conductive portion 12b and the like from the metal portion 18. In this way, the base 12 is attached to the case 11
The metal portions 16 and 18 that are in contact with each other in the state of being adhered to the can be joined by welding to perform sealing. The metal part 1
If 6 and 18 can be soldered, the metal parts 16 and 18 may be solder-plated and joined by soldering. When the sealing is performed in this manner, the sealing can be performed easily and in a short time, as compared with the sealing using the adhesive, and the productivity is improved.

By the way, in the above-mentioned case, the insulating portion 17 coated with ceramics insulates the connection portion 12a, the conductive portion 12b from the metal portion 18, but the method shown in FIG. 5 may be used. In FIG. 5, the base 12 is formed of a laminated printed circuit board having a two-layer structure, the metal portion 18 is formed on the outer peripheral portion of the upper surface of the base 12, and the connection portion 12a and the conductive portion 12b are formed inside thereof. Then, a wiring pattern portion 13a formed from both end surfaces of the base 12 to the lower surface,
The connection portion 12a and the conductive portion 12b are connected to each other by the wiring pattern 19 formed inside the laminated printed circuit board, the wiring pattern 19 and the wiring pattern portion 13a, or the connection portion 12a and the conductive portion 12b. They are connected by through holes 20 for performing. By doing so, the insulating state between the metal portion 18 and the connection portion 12a and the conductive portion 12b can be ensured.

It is also possible to use an ordinary printed circuit board instead of the laminated printed circuit board and connect the wiring pattern 13a to the connecting portion 12a and the conductive portion 12b only by the through hole 20. Further, the method described above can be applied to the case where the wiring pattern portion 13b is connected to the wiring pattern on the upper surface side of the base 12.

[0025]

As described above, according to the first aspect of the present invention, a housing is constituted by a box-shaped case having an open lower surface and a base attached to the open lower surface of the case. Since the wiring pattern part as a terminal is formed on this base, the terminal in the conventional relay can be eliminated, the wiring pattern of the printed circuit board and the position shift due to the deformation of the terminal, and the high frequency due to the terminal It is possible to solve the problem that characteristics change or deterioration occurs.

According to the second aspect of the present invention, since the printed board is made of ceramic, the heat resistance of the base can be improved, and the base is less likely to be thermally deformed. According to the third aspect of the present invention, since the metal portion is formed at the joint between the case and the base and the base is sealed to the case by welding, the case and the base can be easily and quickly sealed.

[Brief description of drawings]

1A and 1B are an exploded perspective view of an embodiment of the present invention and a perspective view showing a back side of a base.

FIG. 2 is a cross-sectional view showing an assembled state of the above.

FIG. 3 is a side view of an armature block.

FIG. 4 is an explanatory view showing a sealing structure of a case and a base.

FIG. 5 is an explanatory view showing another sealing structure for the case and the base.

FIG. 6 is a side view of a conventional surface mount type relay.

[Explanation of symbols]

 10 Housing 11 Case 12 Base 13a, 13b Wiring Pattern Part 16, 18 Metal Part 17 Insulating Layer 20 Through Hole

Claims (5)

[Claims] 1. A housing is composed of a box-shaped case having an opened lower surface and a base attached to the opened lower surface of the case. The base is composed of a printed circuit board, and wiring as terminals is provided on the base. A relay characterized by being formed with a pattern portion. 2. The relay according to claim 1, wherein the printed circuit board is made of ceramic. 3. The relay according to claim 1, wherein a metal portion is formed in each of the joint portions between the case and the base, and the base is sealed in the case by welding. 4. When the wiring pattern portion of the base is continuous to the upper surface of the base, an insulating layer is formed on the wiring pattern portion, and a metal portion is formed on the insulating layer. A relay according to claim 3. 5. When the wiring pattern portion of the base needs to be connected to the wiring pattern on the upper surface of the base, the wiring pattern portion and the wiring pattern on the upper surface are connected via a through hole. A relay according to claim 3.