JPS60108389A - セラミツクスの表面金属化法 - Google Patents
セラミツクスの表面金属化法Info
- Publication number
- JPS60108389A JPS60108389A JP21376983A JP21376983A JPS60108389A JP S60108389 A JPS60108389 A JP S60108389A JP 21376983 A JP21376983 A JP 21376983A JP 21376983 A JP21376983 A JP 21376983A JP S60108389 A JPS60108389 A JP S60108389A
- Authority
- JP
- Japan
- Prior art keywords
- mixture
- ceramics
- ceramic
- surface metallization
- sulfide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims description 35
- 238000001465 metallisation Methods 0.000 title claims description 8
- 238000000034 method Methods 0.000 claims description 32
- 239000000203 mixture Substances 0.000 claims description 22
- 229910052976 metal sulfide Inorganic materials 0.000 claims description 9
- 239000002734 clay mineral Substances 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 5
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 239000005995 Aluminium silicate Substances 0.000 claims description 3
- 235000012211 aluminium silicate Nutrition 0.000 claims description 3
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 2
- 125000000101 thioether group Chemical group 0.000 claims 1
- 239000002184 metal Substances 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 15
- OMZSGWSJDCOLKM-UHFFFAOYSA-N copper(II) sulfide Chemical compound [S-2].[Cu+2] OMZSGWSJDCOLKM-UHFFFAOYSA-N 0.000 description 11
- 239000010949 copper Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000035515 penetration Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002203 pretreatment Methods 0.000 description 2
- -1 CuJ Chemical class 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 235000003823 Petasites japonicus Nutrition 0.000 description 1
- 240000003296 Petasites japonicus Species 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 1
- AQKDYYAZGHBAPR-UHFFFAOYSA-M copper;copper(1+);sulfanide Chemical compound [SH-].[Cu].[Cu+] AQKDYYAZGHBAPR-UHFFFAOYSA-M 0.000 description 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012770 industrial material Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000010979 ruby Substances 0.000 description 1
- 229910001750 ruby Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21376983A JPS60108389A (ja) | 1983-11-14 | 1983-11-14 | セラミツクスの表面金属化法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21376983A JPS60108389A (ja) | 1983-11-14 | 1983-11-14 | セラミツクスの表面金属化法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60108389A true JPS60108389A (ja) | 1985-06-13 |
| JPS6350319B2 JPS6350319B2 (enExample) | 1988-10-07 |
Family
ID=16644723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21376983A Granted JPS60108389A (ja) | 1983-11-14 | 1983-11-14 | セラミツクスの表面金属化法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60108389A (enExample) |
-
1983
- 1983-11-14 JP JP21376983A patent/JPS60108389A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6350319B2 (enExample) | 1988-10-07 |
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