JPS6010745A - Measurement of characteristic of semiconductor element - Google Patents

Abstract

PURPOSE:To contrive to curtail measuring time, and to contrive to enhance working efficiency of a tester at the measurements of the characteristics of semiconductor elements by a method wherein the measurements are performed from the central elements of two wafers in an eddy type according to the parallel measurement method, and when the measurements come to the measuring elements at the boundary parts between the central parts and the peripheral parts of the wafers, the measurement method is changed over an alternative measurement method, and when come to the peripheral parts of the wafers, the measurements are changed again o ver the parallel measurement method. CONSTITUTION:Measurements are started according to the parallel measurement method from the central elements 6a, 6b of two wafers 5a, 5b, and the measurements are continued to adjoining elements in an eddy type from the central elements 6a, 6b hereafter. Because at the parallel measurements thereof, probability that fellow non-defective units are existing is high as to be nearly 100% at the central parts of the wafers, the measurements are continued at a speed nearly two times of an alternative measurement method. When the measurements come near by the peripheries at the central parts m1, n1 of the wafers, possibility that either of one side of the two elements 6a, 6b possibility of that either of one side of the two elements 6a, 6b to be measured at the same time becomes to be a defective unit is increased gradually. Therefore when defective units generate continuously for several times at least in one side of the two elements 6a, 6b to be measured at the same time, for example, it is detected to change the measurement method over the alternative measurement method. Accordingly, the measurements can be continued in a short time even when the combination of a non-defective element and a defective element is continued.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Industrial Application Field The present invention relates to a method for individually and sequentially measuring the characteristics of a large number of semiconductor elements formed in a four-dimensional array.

(b) Prior art communications: The individual characteristic measurements of the semi-quaternary semiconductor chips in a semiconductor wafer are sequentially carried out by wiring a tester on the surface of seven semiconductor chips and bringing them into contact with the probe needle of a prober. In addition, the seven characteristic measurements of the semiconductor Takako are carried out sequentially for each IJ characteristic, and if the measurement result of an item in the middle is determined to be defective, the measurement of the item will be repeated. The product was determined to be defective without being tested, and the test was moved to the measuring operation using the four-day test element, in order to shorten the measurement time as much as possible and increase the tester's operating rate. For example, in an 'IaBX element with a large number of 7 characteristic JA's, we first conduct a loose 7-anction test (which is a rough preliminary test) using high-speed pulses.
(hereinafter abbreviated as FIJXp-cho) t-do, this, IFT
# If the results are good, measure one characteristic of the regular punishment, and L1t
If the T result is bad, even if you perform the regular characteristic measurement on the temporary υ, a defective result will be obtained with a smoke rate of about 1/θθ, so skip the regular characteristic measurement and measure the next X181 element. That's what I'm doing.

Also, as the number of characteristic items of a semiconductor element increases, the tester used to measure them becomes more expensive. Conventionally, in order to increase the measurement value, a multiple measurement method or a parallel measurement method, which will be described later, is carried out using the i- shown in FIGS. 7 and 2.

In Figures 7 and 2, (1) shows seven testers,
(, ga) (2b) was written down to tester +1). 2
A propper on a stand has a globe needle (3
a) (3b) is provided protrudingly. (4a) (4b) are IJJdJ stages that are intermittently assisted in the upper F7J and two horizontal orthogonal X-Y directions, (5a) (6b) are positioned and mounted on the gap excitation stage (4a) (4b) It was done. Two pieces of 1,400 pieces of Aha (hereinafter referred to as Quaha), each with v'1
In a grid-like arrangement in the X-r direction, four d-shaped cow elements (hereinafter referred to as confectionery), (6a)..., (6s.O-) are formed. A movable stage (4a) ( 4V prober (2a)
Quaha (5a) (5b) to the probe needle (3a) of
)'s sweets (6EL)*a-(61)) oss comes into contact with /1Katsutsu Il@i! 1! LJ makes a move.

, the above alternative measurement method is continuous measurement 1-11 on tester 11).
? -6112J'ill stage (4a
) (40 gold alternating □ to drive two Quaeno (5a)
) (5b) ``6 粱子 (6a)..., (6su...et
As shown in the time chart in Figure -g3, this is a method in which the characteristics of each of the seven elements are kept constant. In other words, - ten thousand quaeno - (5
At the same time as one pair of /1 hard sweets (6a) of a) is completed, the measurement of 7 sweets (6b) of the other Quaha (5b) is completed.
First, within the measurement time of this confectionery (6N), move the movable stage (4a) and set it to the confectionery (6S2i-measurement IJJ function) that will be added next to Quaha (5&). , and perform all measurements consecutively.

In addition, the parallel measurement method described above uses a tester (f1) that can simultaneously measure the characteristics of two confectioneries with the same contents, and performs each town-mae stage (4a) (
(5a)
o) is a method of measuring 67 confections (6aX6b)t-'1 at the same time.

These selective measurement methods and parallel measurement methods are carried out in a meandering manner from the two quadrants (5a) (5I) to other parts, as shown in the fJj diagram. In the multiple-choice measurement method where the side prefers to solve the problem, the tester measures Toshi τ between successive intervals, but 1
- Unless the time required to measure the timeliness of various sweets is shortened, processing capacity cannot be expected to be accommodated. - Since 21 pieces of confectionery are measured at the same time in parallel 04A, the time required for moving the quay until the next confectionery τ is measured (φ cutting time in the JC-Y direction of the stage + stage - When ascending the stage - When descending from the 10th stage F)
If you shorten it, you can process IF! , the force is considered to be a little less than one-fold improvement in the measurement method. You can improve your degree by 4.

Immediately :) At the time of 1st attack, Quaeno is around 1♂Hine7 tX
Problems such as the crystal 14 of 1s is inferior to d1≦ are rarely found in the peripheral area of the quadrature, and there are many defective devices in the devices that are A, and the finished devices are in the middle of the quadratic region. One commandment to do: lIJ There is a trouble, and the Kel element product 4 is confused with the 7 pieces of Cueno 1, and there is a problem with the present problem. Measuring the characteristics of confectionery 4
Both machines are measured at the same time. It would be a problem if both of the two sweets were good or defective, but if one of the two pieces was good and the other was defective, it would be a problem. The measurement of the device is completed in a short time t, but the measurement of the finished device is still in progress.Therefore, if the proper of the defective device is 1 sub-it when measuring the characteristics of a good device, then it is lI! at (1-1)! ! 111! This play time (
t-'t)'s 1-can only demonstrate JQ% of its processing capacity. This kind of inconvenience occurs frequently when measuring confectionery in the central area where the rate of non-defective products is high and the border area of the distribution of defective products between the central area where the rate of defective products is high and the peripheral area where the rate of defective products is high.
4.

In addition, as a device to reduce the above-mentioned t-force, it is necessary to add a special metal to the periphery of the quadrature on the propper or tester, and treat the element with 4 sides of the quadrangle as a defective product before performing the measurement. First, there are many measurement positions from the periphery to the center, and it is conceivable to restart the test from a position where there is a possibility that a non-defective element may appear (6). As shown in Figure 4j, the bank is always in a meandering shape, so the pattern of entering from the center of Quaha to the periphery is 6. This is not desirable, as it is useless and takes a lot of time to measure the gold body, resulting in a long time for measuring the metal body.

Means for Solving the Problems The present invention solves the problems of the above-mentioned parallel measurement method. It is characterized by starting the measurement using the method, and when the temporary measurement element comes to the boundary between the center and the periphery of the quafer, the measurement method is switched to the alternative measurement method IC, and when it enters the periphery of the quafer, the measurement is performed again using the parallel measurement method. 0 In this way, since the first half of the measurement consists of quay and almost only non-defective products in the central part, the probability that one of the confections measured simultaneously is a good product and the other is a defective product is approximately θ, and the parallel Most of the advantages of the measurement method are utilized in relation to loQ.・Furthermore, by performing the multiple choice measurement method on the boundary between the center and the periphery of the quake where the probability of a combination of good and defective confectionery is high, the drawbacks of the multi-parallel measurement method are eliminated and the method becomes much more efficient. To switch to this single measurement method, use the propper and tester around the quaha-1.
! If you add the IlI function and perform it like a software one-square processing, it will be executed without difficulty, and because the direction of measurement is spiral, you only need to perform it once at an appropriate point.
There is no problem such as a long measurement time due to this 'I'll disconnection.

(E) As shown in Example Fig. 6 to Fig. 1, m
nl, and the peripheral area where the probability of defective elements is high is km
2 s ri2 Explanation Thf: ``First, as shown in Figure 6, we started measuring with the parallel measurement method from the center element (6a) (6b) of two VC quafers (5ω (5b)), and then Spiral V from the central elements (6a) (6b)
C Continue measurement ft to adjacent elements. In this parallel measurement, since the i-heta between non-defective elements is nearly 100 times higher at the center of the quafer, the measurement is continued at a speed nearly twice that of the alternative measurement method. During this measurement, two elements (6a) are measured at the same time near the periphery of the center Ii1'm and n sections.
(6b) The probability that either one of them becomes a defective product gradually increases, and as shown in FIG.
At the boundary of 2sn2, the possibility that defective elements will be mixed in increases significantly(9). For example, if at least one of the two sweets (6a) (ab) that is being measured simultaneously is defective several times in a row, this will be detected and the measurement method will be changed as shown in Figure 2 (B).
Switch the alternative measurement method rc as shown in vc.

Then, even if a combination of good and bad elements continues, the measurement can be continued in a short time.

If you continue this measurement, you will get both (5a).
The fixed positions of several pairs in (5b) are only in the peripheral area "2%" 2, and here there is a probability of approximately /θθ that the confectionery is defective. Therefore, it is inefficient to measure the peripheral areas m2 and n2 using a single measurement method, so when the peripheral areas m2 and n2FC are entered, the parallel measurement method rc g'J is used again to increase the measurement speed, as shown in Figure 2. We aim to make this possible.

In addition, although the spiral direction of measurement at each Quafer (5a) (5b) I/C is shown as clockwise in the drawing, both are counterclockwise, or one is clockwise and the other is counterclockwise. Kotomo or Node Ruru. Also, it is also possible to proceed the spiral VC measurement from the outer periphery of the quaha to the center, lol, 1! ll
! VC is possible, but (10) it is very difficult in terms of software processing, and it is technically effective to start from the quay center as in the present invention. As explained above, according to the present invention, even if the yield of Quafer elements is poor, the measurement time can be shortened due to the CiI capability, which improves the operating rate of expensive testers and improves cost performance. is improved. n vc r
, The longer the measurement time is, the more characteristic measurement items are required and the longer the measurement time, such as B-process elements, the more effective the implementation effect will be.

[Brief explanation of drawings]

7 and 2 are schematic front and plan views showing an example of a general semiconductor device characteristic measuring device, and FIG. 3 and 9 are measurement operations for explaining the two sides of the semiconductor device characteristic measuring method. Time chart, Figure 5 is an example of the measurement order on a semiconductor wafer using the conventional method! FIGS. 1 and 2 are diagrams showing an example of a measurement sequence and a measurement operation time chart on a semiconductor wafer for detailed explanation of the present invention. (1) Tester, (2a) (2b) Proper, (5a) (5b) Semiconductor wafer, (6a)
..., (6b) ..., ... semiconductor element.

Claims (1)

[Claims] (1) Measurement of the characteristics of the IiI semiconductor wafer formed on a large semiconductor wafer using 7 testers and 2 gropers. Characteristics of 67 semiconductor chips were simultaneously measured in parallel to the sides in a winding manner, and two conductors were measured around 41# in the center and peripheral parts of the conductor.
Semiconductor wires of 1,000 conductors are selected in a spiral pattern by the measurement method /ll! A method for measuring the characteristics of cow conductor confectionery, which is characterized by measuring the characteristics alternately.