JPS60106968A - Heating mechanism for appratus for forming film in vacuum - Google Patents

Abstract

PURPOSE:To heat uniformly a sample on a substrate holder by placing plural temp. sensors among the lines of plural heaters arranged in the holder so as to control separately the heaters. CONSTITUTION:Plural heaters 30a-30i are arranged in a substrate holder 22 set in a vacuum vessel 21 in the diametral direction of the holder 22 at intervals. Plural temp. sensors 31a, 31b are placed among the lines of the heaters 30a-30i, and the leads 33a, 33b, 35a, 35b of the heaters 30a-30i and the sensors 31a, 31b are taken out of the vessel 21 through the rotating shaft 25 of the holder 22. The heaters 30a-30i are separately controlled, and the sample on the holder 22 is uniformly heated.

Description

[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a heating mechanism for a vacuum film forming apparatus such as a vacuum evaporation apparatus, a sputtering apparatus, a plasma CVD apparatus, etc., and particularly relates to a heating mechanism for uniformly heating a sample substrate on a substrate holder. The present invention relates to a heating mechanism for a vacuum film forming apparatus suitable for heating.

[Background of the invention]

The first factor is a row of heating mechanisms for a conventional vacuum film forming apparatus.

In what is shown in this figure, a substrate holder 2 and a heater 5 are installed in a vacuum chamber 1. The substrate holder 2 is rotatably provided in a vacuum 41 via a rotating shaft 3 and a mounting flange 4 in the direction shown by the arrow. The heater 5 is
It is fixed below the substrate holder 2.

In this heating mechanism, the substrate holder 2 is rotated and heated by the heater 5, thereby heating the sample substrate (not shown) on the substrate holder 2.

However, in this conventional heating mechanism, even if the substrate holder 2 is heated while being rotated, since the substrate holder 2 and the heater 5 are separated from each other, a difference occurs between the temperature of the heater 5 itself and the temperature of the substrate holder 2. , which has the disadvantage of poor temperature accuracy.

Next, FIG. 1 shows another example of a heating mechanism for a conventional vacuum film forming apparatus.

The one shown in this figure has a rotating shaft 1 in the same part of the vacuum chamber 110.
3 and a mounting holder 14, a substrate hoist 12 is rotatably provided, and this substrate holder 12 has a built-in heater (not shown). The leads of the heater are led out of the substrate holder 12 using sliding brushes 15a and 15b.

In this heating fiction, since the substrate holder 12 and the heater are integrated, the temperature accuracy is higher than that of the heating mechanism shown in FIG.

However, simply incorporating a heater in the substrate holder 12 has the disadvantage that a highly accurate temperature distribution cannot be obtained because the heat dissipation conditions differ between the inside 11II (center) and the outside of the substrate holder 12. Furthermore, although the heating conditions of the sample substrate vary depending on the film forming process, the heating mechanism shown in FIG. 2 also has the disadvantage that a highly accurate temperature distribution corresponding to the film forming process cannot be obtained. Furthermore, the heater 9-de is connected to the vacuum chamber 111/:
Since the sliding brushes 15a and 15b provided in the air are guided to the outside of the substrate holder 12, the coefficient of friction of the sliding brushes 15a and 15b in a vacuum is significantly larger than that in the atmosphere. becomes fainter.

Since the abrasion powder floats in the vacuum chamber 11Pj, it affects the film quality and has the disadvantage that a good quality film cannot be obtained.

[Purpose of the invention]

It is an object of the present invention to provide a vacuum film forming apparatus that eliminates the drawbacks of the prior art, that can heat a substrate holder to a highly accurate temperature distribution in accordance with the film forming process, and that can prevent the generation of abrasion powder of conductive members, etc. To provide a heating mechanism for

[Summary of Departure J]

In the present invention, a substrate holder is installed in a Makabe tank, the substrate holder is heated by a heater, and a film is formed on the sample substrate while heating the sample substrate via the substrate holder. A heater is installed inside the substrate holder in the diametrical direction of the substrate holder. A plurality of temperature detectors are arranged at l intervals, and a plurality of temperature detectors are arranged between the rows of heaters, and the leads of the heaters and temperature detectors are guided to the outside of the vacuum chamber through the "P" portion of the rotation axis of the substrate holder. In addition, the heater lead is connected to a control device that individually controls the temperature of the heaters near the temperature sensor based on the temperature directly input from each temperature sensor. All of the above objectives were achieved.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to FIGS. 3 and 4.

The vacuum 41F21 can be reduced in pressure by an evacuation system (not shown). A substrate holder 22 is installed in the vacuum chamber 21, and a plate 28 for supporting the motor and sliding brush is attached to the bottom plate of the vacuum chamber 21.
It is attached.

As shown in FIG. 4, the front h-pi board holder 22 is constructed by integrally joining a board holder space 23 and an upper plate 24. Further, a hollow rotating shaft 25 is provided in the substrate honoshida 220 and the substrate holder space 25, and this rotating shaft 25
is supported on the bottom plate of the vacuum chamber 21 via a mounting brush 26. A hollow cylindrical current introducing terminal 27 is connected to the rotating shaft 25, and this current introducing terminal 27 is connected to a motor 29 attached to the placket 28.

Said substrate holder 220 substrate holder base 23 top plate 24
1, ring-shaped heaters 30a to 3 are arranged concentrically with the substrate honoda 22 and spaced apart in the radial direction, and a temperature detector 51 is arranged between the heaters 30b and 50c.
a is arranged, and a temperature detector 31b is arranged between the heater 30g and lhQ.

The heaters 50a to 50d 130e to 30i)
9- leads 52a, 52b and leads 33a of temperature detectors 51a, 31b;

35b is connected to the current introduction terminal 27 through the hollow rotating shaft 25. Furthermore, the nine-wires 54a, 54b for the heater connected to the #9-wires 52a, 52b at the current-introducing terminal 27 are inserted into the current-introducing terminal 27; The leads 55a, 36b are connected to the slots and springs 36b fixed to the outer peripheral surface, and the leads 55a,
Temperature detection, dexterity lead 55a connected to 55b
, 55b are inserted into the inside of the current introduction terminal 27 and connected to slip rings 57a and 57b fixedly fixed to the outer peripheral surface of the current introduction terminal 27. Sliding brushes 58a and 58b for the heater attached to the plate 28 are fitted into the heater slots and pulls 56a and 56b, and the heater slots and pulls 37a and 57b are fitted together. is the same bracket 28
a sliding brush 59a for the temperature sensor housed in;
59b is fitted.

The sliding brushes 5Ba, 58b for the heaters are used for temperature control #41a, 41biC! of the control device 40. The sliding brushes 59a and 59b for the temperature detectors are connected to the temperature detection instruction units 42a and 42b of the control device 40 via the J-domains 45a and 45b.
connected via b.

The control device 40 includes temperature detectors 31a and 51b.
The temperature value at the temperature sensor installation position in the substrate holder 22 is inputted from the temperature detection instruction section 42a, 42b, and based on this temperature value, the lead 45a is sent to the valley temperature control device 41a, 41b in accordance with the film forming process.

45b, commands are sent separately to one temperature controller 4.
Heater 50a~ near temperature detection 6312 through 1a
It is configured so that the temperature of the heaters 30e to 50i near the temperature detector 51b can be controlled through the other temperature side # device 41b.

The heating mechanism of the above embodiment is used and operates as follows.

That is, the motor 29 is driven to rotate the base holder 22 via the current introduction terminal 27 and the rotating shaft 25.

On the other hand, the temperature controller 41a is controlled through the controller 40.

41b, leads 45a, 43b - sliding brushes 38a, 38b, M pickpocket, spring 36a
, 66b-+9-de 34a, 34b-+lead 5
Heaters 30a to ld through 2a and 52b,
30e ~ 30i IC power supply, heater 50a ~ ld
, 50eS-50iK is ignited to heat the substrate holder 22 and the sample substrate (not shown) placed on the substrate holder 22.

During this time, the temperature of the temperature sensor installed in the substrate holder 22 is detected by the temperature detection 451a and 31b.

The temperature values are 9-do 35a, 33b-*9-do 5a.

35b-slip 9 ring 57a, 57b-4 sliding brush 39a, 39b-+9-de 44a,
44b to the temperature detection instruction sections 42a and 42b. Then, the control device 40 is instructed to detect the temperature*
The temperature values are entered from 42a and 42b, and based on these temperature values, each temperature side @141a is set according to the film forming process.
, sends a command to 41b, one temperature side wh device 41a
Said ship 1 from iC! Temperature detection through the path d51a
The temperature of the heaters 50a to 30d near the temperature detection 951b is controlled by the other temperature side t4Ja41b, and the temperature of the heaters 50e to soi near the temperature detection 951b is controlled by the other temperature side t4Ja41b.

However, the substrate holder 22 can be heated to a highly accurate temperature distribution in accordance with the film forming process.

And leads 52a, 52b and 3 for the heater
4a, 34b and leads 55a, 5 for temperature sensor
5b and 35a, 55b are passed through the rotating shaft 25 and the inside of the sleep current introduction shoulder 27, and are fixed to the outer circumferential surface of the current introduction terminal 27 provided outside the vacuum chamber 21. , 57a, 57
b, and these slip rings 66a, 56b
, 57a.

37b, a sliding brush 38a outside the vacuum chamber 21;

Since 58b, 59a, and 59b are fitted,
It is possible to completely eliminate the problem of abrasion particles of the conductive member floating in the vacuum chamber.

Note that in the present invention, the specific structure of each part is not limited to the embodiment shown in the drawings, but may be any structure that can perform the intended function.b [Effects of the Invention] According to the present invention described above , a plurality of heaters are arranged inside the substrate holder at intervals in the diameter direction of the substrate holder, a plurality of temperature detectors are arranged between the rows of heaters, and based on the temperature value input from each temperature detector, Since the heaters near the temperature detector are individually set to the temperature side via the control device, it is possible to heat to a highly accurate temperature distribution in accordance with the film forming process of the substrate holder. .

Further, according to the present invention, the heater and the temperature detector 9-
Since the conductor is led out of the vacuum chamber through the inside of the rotating shaft of the substrate holder and connected to the control device, it is possible to completely eliminate the problem of abrasion powder of the conductive member floating in the vacuum chamber.

Furthermore, according to the present invention, it is possible to heat the substrate holder with high precision to a temperature distribution, and the floating of abrasion powder of the conductive member within the Also consider the effects that can be formed.

[Brief explanation of the drawing]

The first factor is a vertical cross-sectional view showing an example of a heating mechanism of a conventional vacuum film forming apparatus, FIG. 2 is a vertical cross-sectional view showing an example of a conventional heating mechanism of this type, and FIGS. One embodiment is shown in which FIG. 3 is a partially cutaway front view, and FIG. 4 is an enlarged longitudinal sectional front view of a substrate holder and its attached members. 21...Vacuum chamber, 22...Substrate honoda, 25...
・Rotation axis of substrate hono νda, 27...Current introduction terminal, 2
9... Motor of substrate holder, 50a to 30i... Heater, 31a. 31b=...Temperature detector, 52a, 32b, 34a
, 34b--9-de for heater, 53a, 33b
, 35a, 35b - lead for temperature sensor, 5
6a, 56b...Slip ring for heater, 57a
, 57b...Slip ring for temperature sensor, 58
a, 58b...Sliding plan for heater, 393 w
59i)...Sliding brush for temperature detection, 40...Control device, 41a, 41b...Temperature controller, 42a, 4
2b - Temperature detection instruction section. Figure 1 Figure 2 Figure 3

Claims (1)

[Claims] Place the substrate holder in the vacuum chamber and heat the substrate holder using the heater trap.1. In a vacuum film forming apparatus that forms a film on a sample substrate while heating the sample substrate via a substrate holder, a plurality of heaters are arranged at intervals in the diameter direction of the substrate holder inside the substrate holder, and a plurality of heaters are arranged at intervals in the diameter direction of the substrate holder. A plurality of temperature detectors are arranged between the rows, and nine of the heaters and temperature detectors are arranged between the rows.
- leads to the outside of the vacuum chamber through the same part of the rotating shaft of the substrate holder, and connects the heater leads to the heaters near each temperature sensor individually based on the temperature value input from each temperature sensor. A heating mechanism for a vacuum film forming apparatus, characterized in that it is connected to a control device that controls temperature.