JPS60106345U - Heat sink for semiconductor devices - Google Patents

Heat sink for semiconductor devices

Info

Publication number
JPS60106345U
JPS60106345U JP19727283U JP19727283U JPS60106345U JP S60106345 U JPS60106345 U JP S60106345U JP 19727283 U JP19727283 U JP 19727283U JP 19727283 U JP19727283 U JP 19727283U JP S60106345 U JPS60106345 U JP S60106345U
Authority
JP
Japan
Prior art keywords
heat sink
semiconductor devices
grooves
abstract
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19727283U
Other languages
Japanese (ja)
Inventor
三郎 岡本
Original Assignee
株式会社　リヨ−サン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社　リヨ−サン filed Critical 株式会社　リヨ−サン
Priority to JP19727283U priority Critical patent/JPS60106345U/en
Publication of JPS60106345U publication Critical patent/JPS60106345U/en
Pending legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１，２図は従来品の取付例を示す正面図、第３図以下
は本考案品を示し、第３図はそのヒートシンクの平面図
、第４図はその金属片の正面図、第５図は該金属片の側
面図、第６図はこれらヒートシンクと金属片の組付けを
示す斜面図、第７図は前記ヒートシンクをプリント基板
への固定状態を示す正面図で、１はヒートシンク、２は
溝、３は金属片。Figures 1 and 2 are front views showing an installation example of the conventional product, Figures 3 and below show the product of the present invention, Figure 3 is a plan view of the heat sink, Figure 4 is a front view of the metal piece, and Figure 5 is a front view of the heat sink. 6 is a side view of the metal piece, FIG. 6 is a perspective view showing the assembly of the heat sink and the metal piece, and FIG. 7 is a front view showing the state in which the heat sink is fixed to a printed circuit board. is a groove, and 3 is a metal piece.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] アルミ押出材で形成のヒートシンク本体に複数の溝を設
け、該溝にバネ製の金属片を挿着するようにして成る半
導体素子用ヒートシンク。A heat sink for semiconductor devices, which is constructed by providing a plurality of grooves in a heat sink body made of extruded aluminum material, and having metal pieces made of springs inserted into the grooves.
JP19727283U 1983-12-23 1983-12-23 Heat sink for semiconductor devices Pending JPS60106345U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19727283U JPS60106345U (en) 1983-12-23 1983-12-23 Heat sink for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19727283U JPS60106345U (en) 1983-12-23 1983-12-23 Heat sink for semiconductor devices

Publications (1)

Publication Number Publication Date
JPS60106345U true JPS60106345U (en) 1985-07-19

Family

ID=30755465

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19727283U Pending JPS60106345U (en) 1983-12-23 1983-12-23 Heat sink for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS60106345U (en)

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