JPS60101123A - 含芳香族複素環ポリアゾメチン - Google Patents
含芳香族複素環ポリアゾメチンInfo
- Publication number
- JPS60101123A JPS60101123A JP20744983A JP20744983A JPS60101123A JP S60101123 A JPS60101123 A JP S60101123A JP 20744983 A JP20744983 A JP 20744983A JP 20744983 A JP20744983 A JP 20744983A JP S60101123 A JPS60101123 A JP S60101123A
- Authority
- JP
- Japan
- Prior art keywords
- aromatic
- formula
- polyazomethine
- containing heterocyclic
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 125000003118 aryl group Chemical group 0.000 title claims abstract description 11
- 229920000343 polyazomethine Polymers 0.000 title claims abstract description 10
- 125000000623 heterocyclic group Chemical group 0.000 title abstract 3
- 150000001336 alkenes Chemical group 0.000 claims abstract description 3
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 3
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 claims description 4
- 150000001345 alkine derivatives Chemical group 0.000 claims description 2
- 125000003545 alkoxy group Chemical group 0.000 claims description 2
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 2
- 125000005843 halogen group Chemical group 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 150000004984 aromatic diamines Chemical class 0.000 abstract description 5
- ZNZYKNKBJPZETN-WELNAUFTSA-N Dialdehyde 11678 Chemical compound N1C2=CC=CC=C2C2=C1[C@H](C[C@H](/C(=C/O)C(=O)OC)[C@@H](C=C)C=O)NCC2 ZNZYKNKBJPZETN-WELNAUFTSA-N 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 abstract description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- 150000002367 halogens Chemical group 0.000 abstract 1
- 239000002798 polar solvent Substances 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000006068 polycondensation reaction Methods 0.000 description 5
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 125000005605 benzo group Chemical group 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 125000006615 aromatic heterocyclic group Chemical group 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- KUCOHFSKRZZVRO-UHFFFAOYSA-N terephthalaldehyde Chemical compound O=CC1=CC=C(C=O)C=C1 KUCOHFSKRZZVRO-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- GWIWIPGOKVSQKR-UHFFFAOYSA-N 2-chloroterephthalaldehyde Chemical compound ClC1=CC(C=O)=CC=C1C=O GWIWIPGOKVSQKR-UHFFFAOYSA-N 0.000 description 1
- WEEOFHJAGVFCFD-UHFFFAOYSA-N 2-n-chlorobenzene-1,2-diamine Chemical compound NC1=CC=CC=C1NCl WEEOFHJAGVFCFD-UHFFFAOYSA-N 0.000 description 1
- RPKCLSMBVQLWIN-UHFFFAOYSA-N 2-n-methylbenzene-1,2-diamine Chemical compound CNC1=CC=CC=C1N RPKCLSMBVQLWIN-UHFFFAOYSA-N 0.000 description 1
- ALYNCZNDIQEVRV-UHFFFAOYSA-N 4-aminobenzoic acid Chemical compound NC1=CC=C(C(O)=O)C=C1 ALYNCZNDIQEVRV-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- DBAKFASWICGISY-DASCVMRKSA-N Dexchlorpheniramine maleate Chemical compound OC(=O)\C=C/C(O)=O.C1([C@H](CCN(C)C)C=2N=CC=CC=2)=CC=C(Cl)C=C1 DBAKFASWICGISY-DASCVMRKSA-N 0.000 description 1
- 229960004050 aminobenzoic acid Drugs 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 description 1
- 229910017053 inorganic salt Inorganic materials 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000137 polyphosphoric acid Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005063 solubilization Methods 0.000 description 1
- 230000007928 solubilization Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20744983A JPS60101123A (ja) | 1983-11-07 | 1983-11-07 | 含芳香族複素環ポリアゾメチン |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20744983A JPS60101123A (ja) | 1983-11-07 | 1983-11-07 | 含芳香族複素環ポリアゾメチン |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60101123A true JPS60101123A (ja) | 1985-06-05 |
| JPH0336051B2 JPH0336051B2 (enExample) | 1991-05-30 |
Family
ID=16539953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20744983A Granted JPS60101123A (ja) | 1983-11-07 | 1983-11-07 | 含芳香族複素環ポリアゾメチン |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60101123A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150089017A (ko) | 2012-11-28 | 2015-08-04 | 히타치가세이가부시끼가이샤 | 실록산 화합물, 변성 이미드 수지, 열경화성 수지 조성물, 프리프레그, 수지 부착 필름, 적층판, 다층 프린트 배선판 및 반도체 패키지 |
| US10323126B2 (en) | 2012-11-28 | 2019-06-18 | Hitachi Chemical Company, Ltd. | Siloxane compound, modified imide resin, thermosetting resin composition, prepreg, film with resin, laminated plate, multilayer printed wiring board, and semiconductor package |
| JP2020105498A (ja) * | 2018-12-26 | 2020-07-09 | 群栄化学工業株式会社 | ポリイミン、ポリイミンイミド、ワニス、フィルム及びその製造方法、並びに積層体及びその製造方法 |
-
1983
- 1983-11-07 JP JP20744983A patent/JPS60101123A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150089017A (ko) | 2012-11-28 | 2015-08-04 | 히타치가세이가부시끼가이샤 | 실록산 화합물, 변성 이미드 수지, 열경화성 수지 조성물, 프리프레그, 수지 부착 필름, 적층판, 다층 프린트 배선판 및 반도체 패키지 |
| US10323126B2 (en) | 2012-11-28 | 2019-06-18 | Hitachi Chemical Company, Ltd. | Siloxane compound, modified imide resin, thermosetting resin composition, prepreg, film with resin, laminated plate, multilayer printed wiring board, and semiconductor package |
| JP2020105498A (ja) * | 2018-12-26 | 2020-07-09 | 群栄化学工業株式会社 | ポリイミン、ポリイミンイミド、ワニス、フィルム及びその製造方法、並びに積層体及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0336051B2 (enExample) | 1991-05-30 |
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