JPS5998330A - Information recording carrier - Google Patents
Information recording carrierInfo
- Publication number
- JPS5998330A JPS5998330A JP57206917A JP20691782A JPS5998330A JP S5998330 A JPS5998330 A JP S5998330A JP 57206917 A JP57206917 A JP 57206917A JP 20691782 A JP20691782 A JP 20691782A JP S5998330 A JPS5998330 A JP S5998330A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- radiation
- lacquer
- layer
- information recording
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004922 lacquer Substances 0.000 claims abstract description 47
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 230000005855 radiation Effects 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 9
- 229920005989 resin Polymers 0.000 claims abstract description 9
- 239000000178 monomer Substances 0.000 claims abstract description 6
- 125000000524 functional group Chemical group 0.000 claims abstract description 5
- 229920001577 copolymer Polymers 0.000 claims abstract 3
- 239000010410 layer Substances 0.000 claims description 18
- 229920000642 polymer Polymers 0.000 claims description 5
- 238000010538 cationic polymerization reaction Methods 0.000 claims description 4
- 239000002356 single layer Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims 1
- 229920003023 plastic Polymers 0.000 abstract description 17
- 239000004033 plastic Substances 0.000 abstract description 17
- 125000003118 aryl group Chemical group 0.000 abstract description 2
- 125000006850 spacer group Chemical group 0.000 abstract description 2
- 125000002091 cationic group Chemical group 0.000 abstract 2
- 238000003847 radiation curing Methods 0.000 abstract 2
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 238000010894 electron beam technology Methods 0.000 abstract 1
- 239000003999 initiator Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- 238000005266 casting Methods 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 239000000969 carrier Substances 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- 150000005690 diesters Chemical class 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 150000005691 triesters Chemical class 0.000 description 2
- BBBUAWSVILPJLL-UHFFFAOYSA-N 2-(2-ethylhexoxymethyl)oxirane Chemical compound CCCCC(CC)COCC1CO1 BBBUAWSVILPJLL-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 238000001467 acupuncture Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- SYFOAKAXGNMQAX-UHFFFAOYSA-N bis(prop-2-enyl) carbonate;2-(2-hydroxyethoxy)ethanol Chemical compound OCCOCCO.C=CCOC(=O)OCC=C SYFOAKAXGNMQAX-UHFFFAOYSA-N 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- 150000001989 diazonium salts Chemical class 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B23/00—Record carriers not specific to the method of recording or reproducing; Accessories, e.g. containers, specially adapted for co-operation with the recording or reproducing apparatus ; Intermediate mediums; Apparatus or processes specially adapted for their manufacture
- G11B23/0057—Intermediate mediums, i.e. mediums provided with an information structure not specific to the method of reproducing or duplication such as matrixes for mechanical pressing of an information structure ; record carriers having a relief information structure provided with or included in layers not specific for a single reproducing method; apparatus or processes specially adapted for their manufacture
Landscapes
- Optical Record Carriers And Manufacture Thereof (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Polymerisation Methods In General (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本叱明はプラスチック基板の上に、係号ピットを、■す
る放射線硬化性ラッカ一層を設けたビデオディスクやデ
ジタル1“−ディオディスク用の情報記録担体に関する
。[Detailed Description of the Invention] [Technical Field of the Invention] This article describes information for video discs and digital 1''-dio discs in which a single layer of radiation-curable lacquer is provided on a plastic substrate to form signal pits. Relating to record carriers.
一般にビデオディスクやデジタルオーディオディスク用
の情報記@担体は、表面に多数の信号ビットが形成され
たディスクで、従来創出成型法やコンプレッション成形
法等により製造されている。In general, information carriers for video discs and digital audio discs are discs on which a large number of signal bits are formed, and are manufactured by conventional molding methods, compression molding methods, and the like.
しかるに、これらの方法は製造装置が大型である上、し
かも転写精度が低いなどの欠点があった。However, these methods have drawbacks such as large manufacturing equipment and low transfer accuracy.
これらの点を改善するため信号ピットを放射線硬化性ラ
ッカ一層に形成する転写方法が特開昭51−14060
1号公ル、特開昭53−11・5105号公報、’!!
flUi4昭54−1:30902号公報、特開昭54
−138406号公報、特開昭55−4793号公報等
に1ノ14示されている。In order to improve these points, a transfer method for forming signal pits in a single layer of radiation-curable lacquer was proposed in Japanese Patent Application Laid-Open No. 51-14060.
Publication No. 1, Japanese Patent Application Publication No. 53-11/5105, '! !
flUi4 Sho 54-1:30902, Japanese Patent Publication No. Sho 54
No. 1-14 is disclosed in Japanese Patent Application Laid-open No. 138406, Japanese Patent Application Laid-Open No. 55-4793, and the like.
この方法は原盤−またはスタンパ−(電]:り法により
)IA盤から転写されてできた金属成形型)などの転写
用母型の異面に液状の放射線硬化性ラッーカ一層を薄く
設け、このラッカ一層の上に無色透明なプラスデック基
板ケ載せて、ラッカ一層を挾持した状態で放射線を照射
してラッカ一層を11Φ化させ、次に信号ビットが転写
されている硬化シソカ一層と、これと一体に接合したグ
ラスチック基板を転写用母型から剥離して情報記録担体
を製造するものである。This method involves applying a thin layer of liquid radiation-curable lacquer on the different surface of a transfer master mold, such as a master disc or a stamper (metal molding mold made by transferring from an IA disc by the electric method). A colorless and transparent Plus Deck board is placed on top of the lacquer layer, the lacquer layer is irradiated with radiation while the lacquer layer is held between the layers, and the lacquer layer is made into 11Φ. The information recording carrier is manufactured by peeling the integrally bonded glass substrate from the transfer matrix.
しかしながら、従来の情報記録担体は放射線硬化性ラッ
カーとして一般に不飽和結合をもつモノマーやオリゴマ
ーが、特に低分子モノ、ジ、トリ又はテトラアクリル酸
エステルが好適なモノマーとして用いられているが、プ
ラスチック基板(特にアクリル板)との密着性が悪い。However, in conventional information storage carriers, monomers and oligomers having unsaturated bonds are generally used as radiation-curable lacquers, particularly low molecular weight mono-, di-, tri- or tetra-acrylic acid esters are suitable monomers, but plastic substrates (Especially poor adhesion to acrylic plates).
このため、情報記録担体を長時間使用していると、特に
高湿や高温の環境中で使用していると、放射線硬化ラッ
カ一層が次第に基板との界面から剥離してくる問題があ
る。Therefore, if the information recording carrier is used for a long time, especially in a high humidity or high temperature environment, there is a problem in that the radiation-cured lacquer layer gradually peels off from the interface with the substrate.
本発明は、高温、高温環境中において長期間使用しても
信号ピッド形成された放射線硬化ラッカ一層と基板との
密着性が維持され、長寿命化を図ることができる情報記
録担体を提供することを目的とする。An object of the present invention is to provide an information recording carrier that maintains adhesion between the radiation-cured lacquer layer on which signal pits are formed and the substrate even when used for a long period of time in a high-temperature environment, thereby achieving a long service life. With the goal.
本発明は、プラスチック基板の樹脂中に、情報転写用の
放射線硬化性ラッカーと放射線により化学的に結合する
ポリマーを共員合成分としてないしは分散状態として含
有させることにより、放射線硬化性ラッカーの硬化時に
、プラスチック基板と放射線硬化膜とを化学的に結合さ
せ、両者の密着性を改善させた情報記録担体を提供する
ものである。In the present invention, a radiation-curable lacquer for information transfer and a polymer that is chemically bonded by radiation are contained in the resin of the plastic substrate as a conjugate component or in a dispersed state, so that when the radiation-curable lacquer is cured, The present invention provides an information recording carrier in which a plastic substrate and a radiation-cured film are chemically bonded to improve the adhesion between the two.
放射線源としてはα子線、γ紳、xs、紫外線等エネル
オー線が用いられる。As the radiation source, alpha rays, gamma rays, xs rays, and ultraviolet rays are used.
ゾジスナック是板用掻j脂の主成分としては、基板の透
明↑生や耐熱性4Qから言って、ポリメチルメタクリレ
ートやポリカーボネート、ジエチレングリコールビスア
リルカーボネートの重合体等が適し7ている。放射線ン
原として鍼子線を用いて型から・1iith13を転写
さぜる↓゛−)合には、この基板用樹脂の副成分とし−
C1ポリ塩化ビニル、ポリアクリル酸エステル、ポリア
クリルニトリル、ナイロン、ポリエチレンテレフタレー
ト等が適しており、この含有方法としてCよ、ブロック
コポリマーの形f 化学的にンτイ1させるか、ないし
は、単に溶融混合させて、物理的に含有させるか、のど
ちらかの方法がとられる。こcDようなプラスチックノ
、(板に適する放射線硬化性ラッ47−としては、アク
リル酸のモノエステル、ジエステル、トリエステル等が
適している。From the viewpoint of the transparency of the substrate and the heat resistance 4Q, polymers such as polymethyl methacrylate, polycarbonate, diethylene glycol bisallyl carbonate, etc. are suitable as the main component of the resin for Zodisnack boards. When transferring 1iith13 from the mold using an acupuncture wire as a radiation source, it is necessary to use - as a subcomponent of the resin for the substrate.
C1 Polyvinyl chloride, polyacrylic acid ester, polyacrylonitrile, nylon, polyethylene terephthalate, etc. are suitable, and the method of containing them is C, the form of a block copolymer, F, chemically dissolved, or simply melted. One of two methods is used: mixing and physically containing the components. Suitable radiation-curable lacquers for plastic plates such as this cD include acrylic acid monoesters, diesters, triesters, and the like.
すなわち、上記のニゲジスチック基板に上記の放射線硬
化性ラッカーを用いて、型からプラスチック基板に情報
を転写するため蓮子線でラッカ一層を硬化させると、同
時に、プラスチック基板の樹脂中に含まれる副成分とラ
ッカ一層がラジカル反応で化学的に結合するため、情報
の転写されたラッカー硬化膜はプラスチック基板と密着
する。That is, when the above-mentioned radiation-curable lacquer is used on the above-mentioned nigidistic substrate and one layer of the lacquer is cured with a Renko wire in order to transfer information from the mold to the plastic substrate, at the same time, the subcomponents contained in the resin of the plastic substrate and Since the lacquer layer is chemically bonded by a radical reaction, the cured lacquer film with the information transferred adheres closely to the plastic substrate.
次に、放射線源として紫外線を用いた場合について説明
する。Next, a case will be described in which ultraviolet rays are used as a radiation source.
プラスチック基板用樹脂の主成分としては、基板の透明
性や耐熱性等の点からポリメチルメタクリレート、ジエ
チレングリコール、ビスアクリルカーボネートの重合体
等ビニル重合体が好ましい。As the main component of the resin for plastic substrates, vinyl polymers such as polymethyl methacrylate, diethylene glycol, and bisacrylic carbonate polymers are preferred from the viewpoint of substrate transparency and heat resistance.
副成分としては、紫外線でカチオン重合を起こす官能基
をもつビニル重合体が、ブロックコポリマーの形で化学
的に含有されているものが好ましい。As the subcomponent, it is preferable to chemically contain a vinyl polymer in the form of a block copolymer having a functional group that undergoes cationic polymerization under ultraviolet rays.
さらに、このカチオン重合を起こす官能基をもつビニル
重合体が、均一な分散状態で物理的に含有されていても
よい。このようなビニル重合体としで、グリシジルメタ
アクリレート、グリシジルアクリレート、テトラヒドロ
ンルフリルアクリレート等が挙げられる。Furthermore, a vinyl polymer having a functional group that causes cationic polymerization may be physically contained in a uniformly dispersed state. Examples of such vinyl polymers include glycidyl methacrylate, glycidyl acrylate, and tetrahydrone rufuryl acrylate.
このようなプラスチック基板に対応する放射線硬化1つ
Lラッカーの成分には、カチオン重合可能なモノマーや
プレポリマーが用いられうる。Cationically polymerizable monomers and prepolymers can be used as components of radiation-curable 1L lacquers for such plastic substrates.
この7Lう〃モノ7−のし11としては、例えばjMj
状その他、エポキシ環をもつモノマーやプレポリマー例
えば2−エチルヘキシルグリシジルエーテルCBH17
0CH2・CH−CH2,エチレングリコールジグlノ
\ 1
CH3
等が挙げられる。As this 7L thing 7-noshi 11, for example, jMj
monomers and prepolymers with epoxy rings, such as 2-ethylhexyl glycidyl ether CBH17
Examples thereof include 0CH2.CH-CH2, ethylene glycol dichloro\1CH3, and the like.
紫外線で上記ラッカ一層をカチオン重合させるためには
、添加剤として光開始剤を小量添加する必要がある。光
開始剤としては、例えばルイス酸のジアゾニウム塩
芳M族ヨードニウム塩
芳香族スルホニウム塩
等を用いろことができる。In order to cationically polymerize the lacquer layer with UV radiation, it is necessary to add a small amount of a photoinitiator as an additive. As the photoinitiator, for example, a diazonium salt, aromatic M iodonium salt, aromatic sulfonium salt, etc. of a Lewis acid can be used.
型から情報を転写するため、上記プラスチック基板と、
上記ラッカーを用いて紫外線照射でラッカ一層を硬化さ
せた場合には、ラッカ一層の硬化と同時に、プラスチッ
ク基板とラッカ一層との界面がカチオン重合で化学的に
結合されるため、両者の密着性が向上する。In order to transfer information from the mold, the above plastic substrate and
When one layer of the lacquer is cured by UV irradiation using the above lacquer, at the same time the lacquer layer is cured, the interface between the plastic substrate and the lacquer layer is chemically bonded by cationic polymerization, which improves the adhesion between the two. improves.
実施例1゜
ノ゛ラスチック基板として、メチルメタアクリレート8
0重量%とグリシジルメタアクリレート20 AidH
%の組成比からなるディスク形状の注型板を造った。Example 1 Methyl methacrylate 8 as a plastic substrate
0% by weight and glycidyl methacrylate 20 AidH
A disk-shaped casting plate was made with a composition ratio of %.
放射線硬化性ラッカーとしては、エチレングリこのラッ
カー液を情報転写用の型であるスタンバ−上に塗布し、
その上から上記の変性アクリル注型板を重ねて放射線源
に高圧水銀灯を用い、紫外線を全面に均一に照射した。As a radiation-curable lacquer, ethylene glycol is used to apply this lacquer liquid onto a stanbar, which is a mold for information transfer.
The above-mentioned modified acrylic casting plate was placed on top of it, and a high-pressure mercury lamp was used as a radiation source, and the entire surface was uniformly irradiated with ultraviolet rays.
ラッカー液が硬化した後、スタンバ−を剥がして、変性
アクリル注型板の上にラッカーの硬化膜が密着した状態
の情報記ぐずζJlノ休を体成した。この場合のラッカ
ー硬化膜と変l/Lアクリル注型基板との密着性は良く
、さらに、凹凸のIH報(ビット(、−f号)の転写精
度も優ねてい/ζ。After the lacquer liquid had hardened, the stambar was peeled off to form a mold with a cured lacquer film adhered to the modified acrylic casting board. In this case, the adhesion between the cured lacquer film and the modified L/L acrylic casting substrate is good, and the transfer accuracy of the uneven IH information (bit (, -f) is also excellent/ζ.
実施例2
プラスチック基板として、メチルメタクリレート80重
量%とグリシジルアクリレート10重置部の組成比から
なるティスフ形状の注型板を造った。Example 2 As a plastic substrate, a tissue-shaped casting plate having a composition ratio of 80% by weight of methyl methacrylate and 10 overlapping parts of glycidyl acrylate was manufactured.
数羽1f9硬化性ラッカーとしてなよ、アクリル酸のモ
ノエステルとジエステルとトリエステルとを適渦な組成
比に混合調製した。Several 1F9 curable lacquers were prepared by mixing acrylic acid monoester, diester, and triester at an appropriate composition ratio.
数羽腺源に′【匡子線、プラスチック基板に上記注型板
、放射線硬化性ラッカーとして上記ラッカーを用いて、
実施例1と同様にして情報記録担体を造った。この1^
報記録担体は、プラスチック基板とラッカーのイ!φ化
膜とが両者の界面でラジカル結合で化学的に結合されて
訃り、両者の密着性は優れていlt−0
〔発明の効果」
以上説明したように、本発明は、ff+報記録担体のプ
ラスナック基板と放射線硬化性ラッカーの硬化膜とが両
者の界面で化学的に結合されており、従来から問題とな
っていた両者の密着性の悪さが改善され、長期的にラッ
カーの硬化膜が剥がれることのない長寿命な情報記録担
体を提供できる。Using a box wire, the above casting plate on a plastic substrate, and the above lacquer as a radiation-curable lacquer,
An information recording carrier was produced in the same manner as in Example 1. This 1^
The information record carrier is made of plastic substrate and lacquer. The φ-formed film is chemically bonded with radical bonds at the interface between the two, and the adhesion between the two is excellent. The plastic-snack substrate and the cured film of radiation-curable lacquer are chemically bonded at the interface between the two, which improves the conventional problem of poor adhesion between the two, and the cured film of the lacquer lasts for a long time. It is possible to provide a long-life information recording carrier that does not peel off.
ぞして、本発明の情報記録担体のラソ刀−硬化層上に金
属の反射膜を設けると反射率の変化で光学的にF+Qみ
とりが可能な情報記録担体となる。また、本発明を用い
て信号ビットの転写だけでなく、光学的に書き込みもで
きる情報HC録担体に一般に設けられているスパイジル
状の案内溝の転写も行〃うことができる。Therefore, when a metal reflective film is provided on the laser-cured layer of the information recording carrier of the present invention, the information recording carrier becomes capable of optically F+Q scanning due to changes in reflectance. Furthermore, the present invention can be used not only to transfer signal bits but also to transfer spicil-shaped guide grooves generally provided in optically writable information HC recording carriers.
=’;、 i 7は本発明の一実施例を説明するだめの
図である。
(1)・・・転写用型、(2)・・・放射線硬化性ラッ
カ一層、(3)・・・基板、(4)・・・スペーサー、
(5)・・・放射線。=';, i 7 is a diagram for explaining one embodiment of the present invention. (1)...Transfer mold, (2)...One layer of radiation-curable lacquer, (3)...Substrate, (4)...Spacer,
(5)...Radiation.
Claims (1)
層を設け、さらにその上からグラスチック基板でOft
記ラッカ一層を挾みこんだ状態で放射線を照M、t し
てラッカーl−を硬化させ、硬化されたラッカ一層”を
転写用型から剥離して形成される情報記@担体において
、基板用樹脂が前記ラッカーと放射線により化学的に結
合する成分を含有するものであることを特徴とする情報
記録担体。 (2)基板用樹脂が、放射線によりラッカーと化学的に
結合するポリマーを、物理的に含有していることを特徴
とする特許請求の範囲第1項記載の情報記録担体。 (3)基板用樹脂が、放射線によりラッカーと化学的に
結合するモノマーを共重合成分として化学的に含有して
いることを特徴とする特許請求の範囲第1項記載の情報
記録担体。 (4)放射線源として紫外線を用い、含有させる副成分
であるポリマーが紫外線によりカチオン重合可能な官能
基をもち、前記ラッカーもカチオン重合タイプである特
許請求の範囲第2項又は第3項記載の情報記録担体。[Claims] (11) A single layer of lacquer that is cured by radiation is provided on the transfer mold, and then a glass substrate is placed on top of the lacquer.
In the information record@carrier formed by irradiating radiation M, t with one layer of the lacquer sandwiched therein to cure the lacquer L-, and peeling off the cured one layer of the lacquer from the transfer mold, the resin for the substrate is formed. contains a component that chemically bonds with the lacquer by radiation. (2) The substrate resin physically binds the polymer that chemically bonds to the lacquer by radiation. The information recording carrier according to claim 1, wherein the substrate resin chemically contains a monomer as a copolymer component that chemically bonds with the lacquer by radiation. The information recording carrier according to claim 1, characterized in that: (4) ultraviolet rays are used as a radiation source, and the polymer as a subcomponent to be contained has a functional group that can be cationically polymerized by ultraviolet rays; The information recording carrier according to claim 2 or 3, wherein the lacquer is also of a cationic polymerization type.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57206917A JPS5998330A (en) | 1982-11-27 | 1982-11-27 | Information recording carrier |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57206917A JPS5998330A (en) | 1982-11-27 | 1982-11-27 | Information recording carrier |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5998330A true JPS5998330A (en) | 1984-06-06 |
Family
ID=16531215
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57206917A Pending JPS5998330A (en) | 1982-11-27 | 1982-11-27 | Information recording carrier |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5998330A (en) |
-
1982
- 1982-11-27 JP JP57206917A patent/JPS5998330A/en active Pending
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