JPS5996268A - マグネトロンスパツタ装置 - Google Patents
マグネトロンスパツタ装置Info
- Publication number
- JPS5996268A JPS5996268A JP20596382A JP20596382A JPS5996268A JP S5996268 A JPS5996268 A JP S5996268A JP 20596382 A JP20596382 A JP 20596382A JP 20596382 A JP20596382 A JP 20596382A JP S5996268 A JPS5996268 A JP S5996268A
- Authority
- JP
- Japan
- Prior art keywords
- base material
- film
- high frequency
- magnetron sputtering
- target
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001755 magnetron sputter deposition Methods 0.000 title claims description 18
- 239000000758 substrate Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 abstract description 32
- 239000010408 film Substances 0.000 abstract description 29
- 239000002245 particle Substances 0.000 abstract description 13
- 239000010409 thin film Substances 0.000 abstract description 11
- 230000015572 biosynthetic process Effects 0.000 abstract description 7
- 238000009826 distribution Methods 0.000 abstract description 7
- 238000001816 cooling Methods 0.000 abstract description 6
- 239000000126 substance Substances 0.000 abstract description 6
- 238000004804 winding Methods 0.000 abstract description 3
- 229920006254 polymer film Polymers 0.000 abstract description 2
- 230000002349 favourable effect Effects 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 description 17
- 238000004544 sputter deposition Methods 0.000 description 11
- 238000001704 evaporation Methods 0.000 description 9
- 230000008020 evaporation Effects 0.000 description 9
- 239000007789 gas Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 3
- 230000005284 excitation Effects 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- 238000007738 vacuum evaporation Methods 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 238000005513 bias potential Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229920000298 Cellophane Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 210000003746 feather Anatomy 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000005289 physical deposition Methods 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20596382A JPS5996268A (ja) | 1982-11-26 | 1982-11-26 | マグネトロンスパツタ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20596382A JPS5996268A (ja) | 1982-11-26 | 1982-11-26 | マグネトロンスパツタ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5996268A true JPS5996268A (ja) | 1984-06-02 |
| JPS6353261B2 JPS6353261B2 (enrdf_load_stackoverflow) | 1988-10-21 |
Family
ID=16515603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20596382A Granted JPS5996268A (ja) | 1982-11-26 | 1982-11-26 | マグネトロンスパツタ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5996268A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6357764A (ja) * | 1986-08-27 | 1988-03-12 | Teijin Ltd | マグネトロンスパツタ装置 |
| JPH02197556A (ja) * | 1989-01-27 | 1990-08-06 | Tdk Corp | マグネタイト膜の製造方法および製造装置 |
-
1982
- 1982-11-26 JP JP20596382A patent/JPS5996268A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6357764A (ja) * | 1986-08-27 | 1988-03-12 | Teijin Ltd | マグネトロンスパツタ装置 |
| JPH02197556A (ja) * | 1989-01-27 | 1990-08-06 | Tdk Corp | マグネタイト膜の製造方法および製造装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6353261B2 (enrdf_load_stackoverflow) | 1988-10-21 |
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