JPS5996115A - Photocurable resin composition - Google Patents
Photocurable resin compositionInfo
- Publication number
- JPS5996115A JPS5996115A JP20518682A JP20518682A JPS5996115A JP S5996115 A JPS5996115 A JP S5996115A JP 20518682 A JP20518682 A JP 20518682A JP 20518682 A JP20518682 A JP 20518682A JP S5996115 A JPS5996115 A JP S5996115A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- acryloyl group
- epoxy
- resin composition
- photosensitizer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 13
- 239000003822 epoxy resin Substances 0.000 claims abstract description 16
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 16
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims abstract description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000003504 photosensitizing agent Substances 0.000 claims abstract description 7
- 239000000178 monomer Substances 0.000 claims abstract description 5
- 239000000126 substance Substances 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 abstract description 6
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 abstract description 5
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 abstract description 4
- 244000028419 Styrax benzoin Species 0.000 abstract description 3
- 235000000126 Styrax benzoin Nutrition 0.000 abstract description 3
- 235000008411 Sumatra benzointree Nutrition 0.000 abstract description 3
- -1 acrylate ester Chemical class 0.000 abstract description 3
- 229960002130 benzoin Drugs 0.000 abstract description 3
- 125000003700 epoxy group Chemical group 0.000 abstract description 3
- 235000019382 gum benzoic Nutrition 0.000 abstract description 3
- 239000004593 Epoxy Substances 0.000 abstract description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000010292 electrical insulation Methods 0.000 abstract 1
- 239000000203 mixture Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 229920006305 unsaturated polyester Polymers 0.000 description 2
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- ZTEHOZMYMCEYRM-UHFFFAOYSA-N 1-chlorodecane Chemical compound CCCCCCCCCCCl ZTEHOZMYMCEYRM-UHFFFAOYSA-N 0.000 description 1
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- DZZAHLOABNWIFA-UHFFFAOYSA-N 2-butoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCCCC)C(=O)C1=CC=CC=C1 DZZAHLOABNWIFA-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- POYODSZSSBWJPD-UHFFFAOYSA-N 2-methylprop-2-enoyloxy 2-methylprop-2-eneperoxoate Chemical compound CC(=C)C(=O)OOOC(=O)C(C)=C POYODSZSSBWJPD-UHFFFAOYSA-N 0.000 description 1
- AXYQEGMSGMXGGK-UHFFFAOYSA-N 2-phenoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(=O)C(C=1C=CC=CC=1)OC1=CC=CC=C1 AXYQEGMSGMXGGK-UHFFFAOYSA-N 0.000 description 1
- DXIJHCSGLOHNES-UHFFFAOYSA-N 3,3-dimethylbut-1-enylbenzene Chemical compound CC(C)(C)C=CC1=CC=CC=C1 DXIJHCSGLOHNES-UHFFFAOYSA-N 0.000 description 1
- JIGUICYYOYEXFS-UHFFFAOYSA-N 3-tert-butylbenzene-1,2-diol Chemical compound CC(C)(C)C1=CC=CC(O)=C1O JIGUICYYOYEXFS-UHFFFAOYSA-N 0.000 description 1
- 229920003319 Araldite® Polymers 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 241000257303 Hymenoptera Species 0.000 description 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（発明の技術分野）
本発明は紫外線などの光照射によって硬化し得るＶｊＪ
脂組成物に係り、特に金属などの表面に塗布した場合、
￥Ｔｔ気絶気絶中性熱性等に優れた被膜を形成し得る小
飽和ポリエステル系光硬化性樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION (Technical Field of the Invention) The present invention provides VjJ that can be cured by irradiation with light such as ultraviolet rays.
Regarding fat compositions, especially when applied to surfaces such as metals,
￥Tt This invention relates to a lightly saturated polyester photocurable resin composition that can form a film with excellent neutral thermal properties.
（発明の技術的背景）
近年、省資源、省エネルギーおよび無公害化などの要求
に基づき、種々の新しい絶縁組成物或いは絶縁電線製造
法が提案されている。(Technical Background of the Invention) In recent years, various new insulating compositions or methods for producing insulated wires have been proposed based on demands for resource conservation, energy conservation, and pollution-free production.
これらのなかで紫外線などの光照射により架橋硬化可能
な樹脂或いは樹脂組成物は、前記要求を全て満足させる
ものとして脚光を浴びつつある。Among these, resins or resin compositions that can be crosslinked and cured by irradiation with light such as ultraviolet rays are attracting attention as they satisfy all of the above requirements.
このような光硬化性樹脂或いは樹脂組成物としては、従
来からエポキシアクリレート、エポキシメタクリレート
、ポリエステルアクリレート、ウレタンアクリレ−トな
どのアクリレート類、゛または不飽和ポリエステルを主
成分としたものが知られている。As such photocurable resins or resin compositions, those mainly composed of acrylates such as epoxy acrylate, epoxy methacrylate, polyester acrylate, and urethane acrylate, or unsaturated polyester have been known. There is.
（背景技術の問題点）
しかしながら前記アクリレート系の光姓化性樹脂或いは
その組成物は、金属に対する密着性が悪いという欠点が
あり、また不飽和ポリエステル系のものは耐熱性が低い
という欠点があるため、いずれも実用面で用途が限定さ
れていた。(Problems with the Background Art) However, the acrylate-based photochromic resin or its composition has a drawback of poor adhesion to metals, and the unsaturated polyester-based resin has a drawback of low heat resistance. Therefore, their practical uses were limited.
（発明の目的）
本発明はこれらの欠点を解消するためなされたもので、
密着性や耐熱性をはじめ電気的機械的特性に優れた光硬
化性樹脂組成物を提供することを目的とする。(Object of the invention) The present invention has been made to eliminate these drawbacks.
The purpose of the present invention is to provide a photocurable resin composition that has excellent electrical and mechanical properties including adhesion and heat resistance.
（発明の概要）
すなわち本発明は、（４）エポキシ樹脂と、化学式％式
％（１）
で表わされるアルコールとを反応させて得られる末端ア
クリロイル基含有エポキシ樹脂に、（ト）α、β不飽和
二重結合を分子中に有する重合性単量体と、
（０光増感剤とを添加混合してなることを特徴とする光
硬化性ｆｕＪ ｌｌ１７組成物である。(Summary of the Invention) That is, the present invention provides an epoxy resin containing a terminal acryloyl group obtained by reacting (4) an epoxy resin with an alcohol represented by the chemical formula This is a photocurable fuJll17 composition characterized by being formed by adding and mixing a polymerizable monomer having a saturated double bond in its molecule and a photosensitizer.
本発明において（Ａ）成分の製造に用いられるエポキシ
樹脂としては、例えば米国シェル化学社のエポン、英国
シェル化学社のエピコート、スイスチバ社のアラルダイ
ト等がある。Examples of the epoxy resin used in the production of component (A) in the present invention include Epon manufactured by Shell Chemical Company in the United States, Epicote manufactured by Shell Chemical Company in the United Kingdom, and Araldite manufactured by Swiss Ciba.
これらのエポキシ樹脂と前記化学式（Ｉ）で表わされる
アクリロイル基含有アルコールを反応させると、エポキ
シ樹脂のエポキシ基に前記アルコールの水酸基が反応し
てエポキシ基の開環が起こり、末端にアクリロイル基を
含有するエポキシ樹脂が得られる。When these epoxy resins are reacted with the acryloyl group-containing alcohol represented by the chemical formula (I), the hydroxyl group of the alcohol reacts with the epoxy group of the epoxy resin, ring-opening of the epoxy group occurs, and an acryloyl group-containing alcohol is formed at the end. An epoxy resin is obtained.
この反応におけるエポキシ樹脂とアクリロイル基含有ア
ルコールの配合割合は、エポキシ当量でほぼ１：１の割
合とするのが望ましい。The mixing ratio of the epoxy resin and the acryloyl group-containing alcohol in this reaction is preferably approximately 1:1 in terms of epoxy equivalent.
また反応湿度は１００〜１２０°Ｃとするのが望ましい
。Further, it is desirable that the reaction humidity is 100 to 120°C.
本発明において（ト）成分であるα、β不飽和二重結合
を有する重合性単量体としては、スチレン、ビニルトル
エン、α−メチルスチレン、クロルスチレン、ｔ−ブチ
ルスチレン、ビニルナフタレン、アクリル酸或いはメタ
クリル酸のエステル、酢酸或いはプロピオン酸のビニル
エステル、マレイン酸、フマ／Ｉ／酸およびイタコン酸
のエステルなどがあり、これらを単独で或いは２種以上
組み合わせて使用する。In the present invention, the polymerizable monomers having α,β unsaturated double bonds, which are component (g), include styrene, vinyltoluene, α-methylstyrene, chlorostyrene, t-butylstyrene, vinylnaphthalene, and acrylic acid. Alternatively, there are esters of methacrylic acid, vinyl esters of acetic acid or propionic acid, esters of maleic acid, fuma/I/acid, and itaconic acid, and these may be used alone or in combination of two or more.
而して本発明における前記（４）成分とこれらの（Ｂ成
分の配合比は、重量比で１００：５０〜７ｏのれないた
めである。This is because the blending ratio of the component (4) and these components (B) in the present invention is 100:50 to 7o in terms of weight ratio.
本発明において（Ｏの光増感剤は、前記（４）成分と（
ト）成分との重合開始剤としての役目を果たすものでア
リ、ベンゾイン、ベンゾインメチルエーテル、ベンゾイ
ンエチルエーテル、ベンゾインイソプロピルエーテル、
ベンゾインブチルエーテル、ベンゾインフェニルエーテ
ルなどのベンゾインエーテル類、ベンゾインチオエーテ
ル、アセトフェノン、ベンゾフェノン、２−エチルアン
トラキノン、ベンジル、塩化デシルなどがある。In the present invention, the photosensitizer (O) is the component (4) and (
g) A substance that serves as a polymerization initiator with component ants, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether,
Examples include benzoin ethers such as benzoin butyl ether and benzoin phenyl ether, benzointhioether, acetophenone, benzophenone, 2-ethylanthraquinone, benzyl, and decyl chloride.
これらの（Ｑ光増感剤の添加量は、以下の理由で全重合
性成分（ｃＡ）、（ηおよび必要に応じて加えた他の硬
化性樹脂の総量＞に対して０．５〜１０重量％程度とす
ることが望ましい。The amount of these (Q photosensitizers added is 0.5 to 10% relative to the total amount of polymerizable components (cA), (total amount of η and other curable resins added as necessary) for the following reasons. It is desirable to set it to approximately % by weight.
すなわち（Ｏ光増感剤の添加量が０．５重量％未満では
硬化速度が遅くなりすぎ、反対に゛１０重量％を越える
と造膜性に乏しくなるため、０．５〜１０爪景％より好
ましくは１〜５重量％の範囲とする。That is, if the amount of O photosensitizer added is less than 0.5% by weight, the curing speed becomes too slow, and on the other hand, if it exceeds 10% by weight, the film-forming property becomes poor. More preferably, it is in the range of 1 to 5% by weight.
本発明に係るｔｌ＋Ｊ脂組成物は、以上の（４）成分、
（ト）成分および（Ｏ成分を混合することにより得られ
るが、必要に応じて熱による重合を祭止する効果をもつ
ハイドロキノン、ｔ−ブチルカテコール、ベンゾキノン
のような安定剤を少量添加混合することができる。The tl+J fat composition according to the present invention comprises the above (4) component,
It can be obtained by mixing component (G) and component (O), but if necessary, a small amount of a stabilizer such as hydroquinone, t-butylcatechol, or benzoquinone, which has the effect of inhibiting polymerization due to heat, may be added and mixed. I can do it.
またベンゾイルパーオキサイド、ｔ−ブチルパーオキサ
イド、ジクミルパーオキサイド等のラジカル重合開始剤
全適宜併用してもよい。In addition, all radical polymerization initiators such as benzoyl peroxide, t-butyl peroxide, and dicumyl peroxide may be used in combination as appropriate.
（発明の実施例） 次に本発明の実施例について記載する。(Example of the invention) Next, examples of the present invention will be described.
実施例
乏
述の化学式（Ｉ）で表わされるアクリロイル基含有アル
コール３６９ｇを仕込み、１００”Ｃで０．５時間反応
を行なった後、これに含有割合が３８重貴重になるまで
スチレンを加え、さらにこれら全体の２重量％のベンゾ
インメチルエーテルを加えて均一に混合し樹脂組成物を
調製した。After charging 369 g of an acryloyl group-containing alcohol represented by the chemical formula (I) described in Examples and carrying out a reaction at 100"C for 0.5 hours, styrene was added to this until the content became 38 times more valuable. 2% by weight of benzoin methyl ether was added and mixed uniformly to prepare a resin composition.
また比較のために化学式（Ｉ）のアクリロイル基含有ア
ルコール３６９りに代えてアクリル酸７２９を用いる他
は実施例と全く同様にして樹脂組成物を調製した。For comparison, a resin composition was prepared in exactly the same manner as in the example except that acrylic acid 729 was used in place of acryloyl group-containing alcohol 369 of chemical formula (I).
これらの樹脂組成物を直径０，３８鰭の軟鋼線上に被膜
し、８０Ｗ／Ｃｍの集光型水銀ランプを光源を硬化させ
た。These resin compositions were coated on a mild steel wire having a diameter of 0.38 fins, and a light source of a condensing mercury lamp of 80 W/Cm was used to harden the resin composition.
こうして得られた硬化膜を有する絶縁電線の特性を測定
した。The characteristics of the insulated wire having the cured film thus obtained were measured.
測定結果を次表に示す。The measurement results are shown in the table below.
表
（発明の効果）
以上の実施例からも明らかなように、本発明に係る樹脂
組成物は、紫外線などの光照射により容易に硬化し、硬
化被膜は優れた耐熱性、耐摩耗性、電気絶縁性および金
属との密着性を示す。Table (Effects of the Invention) As is clear from the examples above, the resin composition according to the present invention is easily cured by irradiation with light such as ultraviolet rays, and the cured film has excellent heat resistance, abrasion resistance, and electrical resistance. Shows insulation properties and adhesion to metals.
９９99
Claims (1)
ルコールとを反応させて得られる末端アクリロイル基含
有エポキシ樹脂に、（ト）α、β不飽和二重結合を分子
中に有する重合性単量体と、 （Ｑ光増感剤とを添加混合してなることを特徴とする光
硬化性樹脂組成物。[Claims] 1. (A) An epoxy resin containing a terminal acryloyl group obtained by reacting an epoxy resin with an alcohol represented by the chemical formula, and (g) α, β unsaturated double bonds in the molecule. A photocurable resin composition characterized by being formed by adding and mixing a polymerizable monomer having the following: and a Q photosensitizer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20518682A JPS5996115A (en) | 1982-11-22 | 1982-11-22 | Photocurable resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20518682A JPS5996115A (en) | 1982-11-22 | 1982-11-22 | Photocurable resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5996115A true JPS5996115A (en) | 1984-06-02 |
Family
ID=16502830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20518682A Pending JPS5996115A (en) | 1982-11-22 | 1982-11-22 | Photocurable resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5996115A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60147425A (en) * | 1984-01-11 | 1985-08-03 | Nitto Electric Ind Co Ltd | Curable resin composition |
| JPS62207309A (en) * | 1986-03-07 | 1987-09-11 | Tatatomi Nishikubo | Photocurable composition |
| US5210157A (en) * | 1989-08-15 | 1993-05-11 | Akzo N.V. | Interpenetrating network of ring-containing allyl polymers and epoxy resin, and a laminate prepared therefrom |
-
1982
- 1982-11-22 JP JP20518682A patent/JPS5996115A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60147425A (en) * | 1984-01-11 | 1985-08-03 | Nitto Electric Ind Co Ltd | Curable resin composition |
| JPH0155651B2 (en) * | 1984-01-11 | 1989-11-27 | Nitto Denko Corp | |
| JPS62207309A (en) * | 1986-03-07 | 1987-09-11 | Tatatomi Nishikubo | Photocurable composition |
| JPH0548764B2 (en) * | 1986-03-07 | 1993-07-22 | Tatatomi Nishikubo | |
| US5210157A (en) * | 1989-08-15 | 1993-05-11 | Akzo N.V. | Interpenetrating network of ring-containing allyl polymers and epoxy resin, and a laminate prepared therefrom |
| US5391435A (en) * | 1989-08-15 | 1995-02-21 | Akzo Nobel N.V. | Interpenetrating network of ring-containing allyl polymers and epoxy resin laminate |
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