JPS59932A - Supporting structure for microscope on bonding device - Google Patents

Abstract

PURPOSE:To enable to make simultaneous observation on a plurality of devices as well as to make observation on the device of large size without reducing magnification by a method wherein a microscope is movably provided in parallel with the direction in which semiconductor parts are conveyed. CONSTITUTION:A sliding shaft 40 is fixed on a parallel shifting block 29, a sliding block 43 is slidably inserted to the shaft 40, and a microscope shaft 50 is fixed to the block 23. When observation is going to be made, a rocking block 22 is contacted to a stopper 23, set screws 24 and 34 are tightened, and the block 43 is shifted along the shaft 40 in the state wherein a set screw 48 is loosened, thereby enabling to make simultaneous observation on a plurality of devices. As the microscope 51 can be shifted in the C and D directions which are at right angle to the direction wherein a lead frame is fed, observation of a large-sized lead frame can be made easily.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a support structure for a microscope for viewing the surface of a semiconductor component in a wire bonding device, a die bonding device, or the like.

A microscope is attached to the bonding apparatus in order to observe the bonding state of the semiconductor components. Conventionally,
The microscope is rotatably supported by a microscope mounting shaft fixed to a fixed part of the bonding device in a direction away from the bonding part.

Therefore, the microscope can only see one spot on the surface of the semiconductor component. Therefore, in order to observe the bonding state, it is necessary to observe until the bonding of one device (for example, an IIC part of a semiconductor component is called a device) is completed, which is very inconvenient. Furthermore, there is an inconvenience in that the device part that has already been bonded and sent out from the bonding part cannot be observed. Also, because large devices can only be observed partially,
This method has the disadvantage that bonding defects and the like cannot be sufficiently checked. Therefore, in the case of large-sized semiconductor components, it is necessary to lower the magnification of the microscope so that the parts fall within the field of view of the microscope. If the magnification is lowered, the bonding state cannot be observed accurately.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a support structure for a microscope in a bonding apparatus that allows semiconductor components to be viewed over a wide range.

Another object of the present invention is to provide a support structure for a microscope in a bonding apparatus that allows observation of large-sized semiconductor components without reducing magnification.

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

As shown in FIGS. 1 and 3, the lead frame 11 to which the pellets 10 are pasted at regular intervals is intermittently fed by means not shown along guide rails 12 and 13 arranged opposite to each other. . A heat block 14 that comes into contact with the lead frame 11 and heats the lead frame 11 is provided below the bonding part A so as to be movable up and down by means not shown. Further, above the bonding part A, a presser plate 15 for pressing the lead frame 11 against the heat block 14# is provided so as to be movable up and down by means not shown.

As shown in FIGS. 1 to 6, a stand 20 is fixed to a fixed portion of a bonding device (not shown) near the bonding section A. As shown in FIGS. A fulcrum shaft 21 is fixed to the upper surface of the stand 20, and a swing block 22 is rotatably fitted into the fulcrum shaft 21. Further, a stopper 23 for positioning the swing block 22 is fixed to the upper end of the stand 20 on the guide rail 12.13 side and protrudes upward. The swing block 22 is fixed to the fulcrum shaft 21 by tightening a set screw 24 screwed into the swing block 22. Pins 25 and 26 are fixed to the swing block 22, and link pieces 27 and 28 are rotatably fitted into the pins 25 and 26, respectively. The link pieces 27 and 28 are also rotatably fitted into pins 30 and 31 fixed to the parallel movement block 29. That is, since the swing block 22 and the parallel movement block 29 are connected in a parallel link manner by the pins 25, 26, 30° 31 via the link pieces 27, 28, the translation block 29 is connected by the pins 25, 26, 30° 31. Can be translated in parallel around the center.

A swing block 22 is provided on the upper surface of the parallel movement block 29.
A plate 32 extending toward the upper side is fixed by a fixing screw 33. The lead frame 11 is attached to the plate 32.
A long relief groove 32a is formed in a direction perpendicular to the feeding direction B, and a set screw 34 is screwed onto the upper surface of the swing block 22 by passing through this relief circumference 532a. Therefore, when the set screw 34 is tightened, the plate 32 is pressed against the swing block 22 by the lower surface of the flange 34a of the set screw 34, and the parallel movement block 29 is fixed to the swing block 22. Further, a roller 35 is rotatably attached to the end surface of the stand 2o so as to support the lower surface of the parallel movement block 29.

A slide shaft 4° is fixed to the parallel movement block 29 with a fixing screw 41, and this slide shaft 40 is parallel to the feed direction B of the lead frame 11 when the swing block 22 is brought into contact with the stopper 23. It is set up to be. A slide block 43 is slidably inserted into the slide shaft 40 via a bearing 42. Further, a stopper 44 for regulating the movement of the slide block 43 is fixed to the end of the slide shaft 40.

Further, a detent block 45 is fixed to the slide shaft 40, and a guide plate 46 in which a guide groove 46a is formed parallel to the slide shaft 40 is fixed to the detent block 45. A roller 47 rotatably attached to the slide block 43 is slidably fitted into the guide groove 46a, thereby preventing the slide block 43 from rotating. Further, a set screw 48 is screwed into the slide block 43, and when the set screw 48 is tightened, the slide block 43 is fixed to the slide shaft 40.

A microscope shaft 5o is fixed to the slide block 43, and a microscope 51 is fixed to the microscope shaft 50. The microscope 51 is designed to focus on the bonding portion A.

Next, the effect will be explained. In the bonding section A, the wire 16 is connected to the pellet 10 and the lead part 11a of the lead frame 11 by a bonding device (not shown), and bonding of one device is completed. The next device is positioned at bonding part A, and bonding is performed.

By the way, when observing the bonding state, the swing block 22 is brought into contact with the stopper 23, and the set screw 24 is
．． 34 and loosening the setscrew 48, the slide block 43 is moved along the slide shaft 40. This allows multiple devices to be observed at once.

Furthermore, there is no need to continue observing a single device until bonding is completed, and devices that have been bonded can be viewed at any time, which is very convenient.

Also, when the set screw 34 is loosened and the parallel movement block 29 is pushed in the direction of arrow C, the parallel movement block 29 is moved to the pin 25.2.
6 via link pieces 27 and 28.

As a result, the pins 30 and 31 are located at positions 3 and 31', and the slide shaft 40 is moved in parallel by t to move closer to the lead frame 11.

Thereby, the center line 52 of the microscope 51 is positioned above the point. Also, if you push the parallel movement block 29 in the direction of the arrow,
The pins 30 and 31 are located at positions 30'' and 31'', and the slide shaft 40 moves in parallel by t in a direction 9 away from the lead frame 11 side from the state shown by the solid line in the opposite direction. As a result, the center line 52 of the microscope 51 is located on the point A''. In this way, the microscope 51 can be moved in directions C and D perpendicular to the feed direction B of the lead frame 11, so that large-sized leads can be Frame 11 can also be easily observed.

As is clear from the above description, according to the present invention, multiple devices can be observed at once.

Also, large devices can be observed without lowering the magnification.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing an embodiment of a support structure for a microscope in a bonding device according to the present invention, FIG. 2 is a front view of FIG. 1, FIG. 3 is a right side view of FIG. 2, and FIG. Figure 4 is a cross-sectional view taken along the line 4-4 in Figure 2, Figure 5 is a cross-sectional view taken along the line 5-5 in Figure 2,
Figure 6 shows 6-10 in Figure 2...pellets,
]l... Lead frame, 12.13... Guide rail, 20... Stand, 21... Fulcrum shaft,
22... Swing block, 25.26... Pin, 27.28... Link piece, 29... Parallel movement block, 30.31... Pin, 40...
Slide shaft, 43...Slide block, 46
... Guide plate, 50 ... Microscope axis, 51
···microscope. Figure 3 Figure 4 Figure 5 Figure 6 = 141

Claims (2)

[Claims] (1) A support structure for a microscope in a bodding device, in which a microscope for observing semiconductor components sent to a bonding section of the boding device is movably provided in parallel to the direction in which the semiconductor components are fed. (2) If a microscope for observing semiconductor components sent to the bonding section of a bonding device is provided so as to be movable in parallel to the feeding direction of the semiconductor components, the microscope can be moved in a direction perpendicular to the feeding direction of the semiconductor components. A support structure for a microscope in a bonding device provided therein.