JPS5991800A - Manufacture of ultrasonic wave probe - Google Patents
Manufacture of ultrasonic wave probeInfo
- Publication number
- JPS5991800A JPS5991800A JP57201494A JP20149482A JPS5991800A JP S5991800 A JPS5991800 A JP S5991800A JP 57201494 A JP57201494 A JP 57201494A JP 20149482 A JP20149482 A JP 20149482A JP S5991800 A JPS5991800 A JP S5991800A
- Authority
- JP
- Japan
- Prior art keywords
- thin plate
- ceramic
- oscillator
- matching layer
- ultrasonic wave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title abstract description 21
- 239000000523 sample Substances 0.000 title abstract description 17
- 239000000919 ceramic Substances 0.000 claims abstract description 40
- 239000006096 absorbing agent Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 abstract description 9
- 230000001070 adhesive effect Effects 0.000 abstract description 9
- 230000002950 deficient Effects 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 239000011888 foil Substances 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 206010011416 Croup infectious Diseases 0.000 description 3
- 201000010549 croup Diseases 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000001902 propagating effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 238000002604 ultrasonography Methods 0.000 description 2
- 101100008044 Caenorhabditis elegans cut-1 gene Proteins 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2437—Piezoelectric probes
- G01N29/245—Ceramic probes, e.g. lead zirconate titanate [PZT] probes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Mechanical Engineering (AREA)
- Ceramic Engineering (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、超音波診断装置などに便用される超音波探触
子の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method of manufacturing an ultrasound probe conveniently used in ultrasound diagnostic equipment and the like.
従来例の構成とその問題点
まず、超音波探触子の基体的な構造を第1図に示して説
明する。図において、1はセラミック振動子で、複数個
並べて設け、その3個づつのセラミック振動子A1.A
2.A3、B1.B2.B3、cl。Conventional Structure and Problems First, the basic structure of an ultrasonic probe will be described with reference to FIG. 1. In the figure, 1 is a ceramic resonator, and a plurality of ceramic resonators are arranged side by side, and each of the three ceramic resonators A1. A
2. A3, B1. B2. B3, cl.
C2,C3、・・・・・・・にょって振動子グループA
、B。C2, C3, ... Nyote vibrator group A
,B.
C2・・・・・・を形成する。2ばその各セラミック振
動子1の上面電極、3はその下面電極である。上面電極
2は共通のリード線4によって接続し、その上を合成樹
脂又は゛ガラス等よりなる1層又は多層の音響マツチン
グ層5により被覆している。下面電極3は各グループ毎
にケープ/L=5によって接続し、これらを超音波吸収
体7上に設けて支持している。8a、8b、8c、8d
・・川・はそれぞれグループA、B、C,D・・・・・
・の制御用のスイッチングである。C2... is formed. 2 is an upper surface electrode of each ceramic vibrator 1, and 3 is a lower surface electrode thereof. The upper electrodes 2 are connected by a common lead wire 4, and are covered with one or more acoustic matching layers 5 made of synthetic resin, glass, or the like. The lower surface electrodes 3 are connected to each group by a cape/L=5, and these are provided and supported on the ultrasonic absorber 7. 8a, 8b, 8c, 8d
...Rivers are in groups A, B, C, D, respectively.
・This is switching for control.
かかる構成により、セラミック振動子1は高周波電気信
号を印加すると振動し、超酢波を発生する。そのうち下
方向へ伝播する超音波は超音波吸収体7によって吸収さ
れ、上方向に伝播する超音波はマツチング層5を通過し
て生体等の被検体に入射される。被検体力・ら反射され
た超音波はマツチング層6を通過してセラミック振動子
1により再び電気信号に変換され、スイッチ8a、8b
、8c。With this configuration, the ceramic vibrator 1 vibrates when a high-frequency electric signal is applied, and generates a superacoustic wave. The ultrasonic waves propagating downward are absorbed by the ultrasonic absorber 7, and the ultrasonic waves propagating upward pass through the matching layer 5 and are incident on a subject such as a living body. The ultrasonic waves reflected from the subject's physical strength pass through the matching layer 6 and are converted back into electrical signals by the ceramic vibrator 1, and the switches 8a and 8b
, 8c.
8d・・・・・・を介して超音波診断装置等に入力され
る。The signal is input to an ultrasonic diagnostic device or the like via 8d...
従って、たとえばスイッチ8a、8bを閉じてセラミッ
ク振動子グループA、Hに高周波パルスの電気信号を入
力して超音波を発生させその反射信号を受信し、その後
一定の時間をおいてスイッチ8aを開きスイッチ8b、
scを閉じて同様に動作させ、さらに一定時間後にスイ
ッチ8bを開きスイッチ8c、8dを閉じて同様に動作
させる、というように;1操り返すと、この超音波探触
子の長手方向に順次超音波の発生位置をずらせることが
でき、その長手方向と平行な面での断層像が得られる。Therefore, for example, the switches 8a and 8b are closed, a high-frequency pulse electric signal is input to the ceramic transducer groups A and H to generate ultrasonic waves, and the reflected signals are received, and then the switch 8a is opened after a certain period of time. switch 8b,
SC is closed and operated in the same way, and after a certain period of time, switch 8b is opened and switches 8c and 8d are closed and operated in the same way; The generation position of the sound wave can be shifted, and a tomographic image in a plane parallel to the longitudinal direction can be obtained.
このような超音波探触子の従来の製造方法の一例を第2
図によって説明する。An example of the conventional manufacturing method of such an ultrasonic probe is shown in the second example.
This will be explained using figures.
この製造方法では、まず、(イ)のように上下両面に電
極2,3を設けたセラミック振動板8の下面電極3とケ
ーブル6とを接続し、これを超音波吸収体7のJ=’に
固定する′。次に、(ロ)のように共通のり−ト線4と
なる金属箔10をセラミック振動板1の上面電極2の端
部に接続し折り曲げ、絶縁性接着剤11によりセラミッ
ク撮動板9及び超音波吸収体7に固定する。その後、(
ハ)のようにセラミック振動板9を上下面の電極2,3
を含めて金属箔10と共に所定の間隔をおいて切断する
。12は各グループA +、 B・・・・内での振動子
1間の切断溝で下面の電極3までを切断しており、13
はそれぞれのクループとグループとの間の切断溝でケー
ブル5も含めて切断している。最後に、このようにガラ
ス等からなる音響マツチング層5を上面電極2の上に形
成し、切断溝13の上に当る部分14を切断して、超音
波探触子を完成する。このように音響マツチング層5を
分断するのは、隣接するクルーズのセラミック振動子1
に超音波が伝播するのを阻止するためである。In this manufacturing method, first, as shown in (a), the lower surface electrode 3 of the ceramic diaphragm 8, which has electrodes 2 and 3 provided on both the upper and lower surfaces, is connected to the cable 6, and this is connected to the cable 6 of the ultrasonic absorber 7. to be fixed at′. Next, as shown in (B), the metal foil 10 that will become the common glue wire 4 is connected to the end of the upper surface electrode 2 of the ceramic diaphragm 1 and bent, and the ceramic pickup plate 9 and the It is fixed to the sound wave absorber 7. after that,(
As shown in c), the ceramic diaphragm 9 is connected to the electrodes 2 and 3 on the upper and lower surfaces.
are cut along with the metal foil 10 at predetermined intervals. 12 is a cutting groove between the vibrators 1 in each group A +, B, etc., which cuts up to the electrode 3 on the lower surface, and 13
The cable 5 is also cut at the cutting groove between each croup. Finally, the acoustic matching layer 5 made of glass or the like is formed on the upper electrode 2, and the portion 14 corresponding to the cutting groove 13 is cut to complete the ultrasonic probe. The acoustic matching layer 5 is divided in this way by the adjacent Cruze ceramic vibrator 1.
This is to prevent ultrasonic waves from propagating to.
また、セラミック振動板9を切断する前にセラミック振
動板9の上面電極2に金属箔1oを接続固定するのは、
切1frf糸に接続固定すると、金属箔を固定する接着
剤11が切断溝1.2.13Kまで侵入してセラミック
振動子1の上面電極2に付着してしまい、音響マツチン
グ層5を上面電極2上に密着させて貼ることができなく
なって超音波の透過率が低下してしまうからである0
しかしながら、上記のような従来の製造方法では、セラ
ミック撮動板9を切断する時に金属箔10も同時に切断
するので、切断後のセラミック振動子1の上面電極2と
金属箔10の接続部との幅を0,1〜0 、3 mm程
度と細くする場合には、切断応力のために電気的な接続
不良が発生しやすくなり、幅の狭いセラミック振動子1
を有する探触子を製造することが困難となるという欠点
があった。Furthermore, before cutting the ceramic diaphragm 9, the metal foil 1o is connected and fixed to the top electrode 2 of the ceramic diaphragm 9.
When the cut 1 frf thread is connected and fixed, the adhesive 11 for fixing the metal foil penetrates into the cutting groove 1.2.13K and adheres to the top electrode 2 of the ceramic vibrator 1, causing the acoustic matching layer 5 to be attached to the top electrode 2. However, in the conventional manufacturing method as described above, when cutting the ceramic imaging plate 9, the metal foil 10 is also removed. Since they are cut at the same time, if the width of the connection between the top electrode 2 of the ceramic vibrator 1 and the metal foil 10 after cutting is made as thin as about 0.1 to 0.3 mm, the electrical Ceramic resonators with narrow widths are more likely to cause connection failures.
This has the disadvantage that it is difficult to manufacture a probe with this.
発明の目的
本発明は、上記のような従来の欠点を解消して、セラミ
ック振動子の幅を狭ぐした超音波探触子を容易に製造す
ることのできる製造方法を提供することを目的とする。OBJECTS OF THE INVENTION An object of the present invention is to provide a manufacturing method that can easily manufacture an ultrasonic probe with a narrow ceramic transducer by eliminating the above-mentioned conventional drawbacks. do.
発明の構成
本発明の製造方法においては、まず、超音波吸収体の上
に上下両面に電極を有するセラミック振動子を所定間隔
で配列させる。次いで、そのセラミック振動子の群の上
面電極の一方の端部に導電性で、かつ容易に折り曲げが
可能な/i!7板をその薄板の一部が上面電極と重なり
合うように接着する。Structure of the Invention In the manufacturing method of the present invention, first, ceramic vibrators having electrodes on both upper and lower surfaces are arranged at predetermined intervals on an ultrasonic absorber. Next, conductive and easily bendable /i! 7 plates are glued together so that a portion of the thin plate overlaps the top electrode.
次に、この薄板をセラミック振動子及び超音波吸収体に
接着する部分にセラミック振動子の間の溝に吸い込まれ
ない程度の高粘度の絶縁性の接着剤を塗布し、その薄板
をセラミック振動子の群の端部の近傍で折り曲げて超音
波吸収体及びセラミック振動子に接着する。その後、マ
ツチング層を上面電極上に接着し、セラミック振動子の
複数個で構成される振動子グループの中間の位置でマツ
チング層と薄板とを同時に切断することによりグループ
に分けるようにして、超音波探触子を製造する。Next, an insulating adhesive with a high viscosity that does not get sucked into the groove between the ceramic vibrators is applied to the part where this thin plate is attached to the ceramic vibrator and the ultrasonic absorber, and the thin plate is attached to the ceramic vibrator. Bend it near the end of the group and glue it to the ultrasonic absorber and ceramic vibrator. After that, the matching layer is glued onto the top electrode, and the matching layer and the thin plate are simultaneously cut at the middle position of a vibrator group consisting of a plurality of ceramic vibrators to separate them into groups. Manufacture the probe.
実施例の説明
以下本発明の超音波探触子の製造方法を実施した一実施
例を第3図に従って説明する。この製造方法では、まず
第3図(イ)に示すように、超音波吸収体14の上に、
上下両面に電極15,16を付し、かつ下面の電極15
が3個1組のクループA。DESCRIPTION OF EMBODIMENTS An embodiment of the method for manufacturing an ultrasonic probe according to the present invention will be described below with reference to FIG. In this manufacturing method, first, as shown in FIG. 3(a), on the ultrasonic absorber 14,
Electrodes 15 and 16 are attached to both the upper and lower surfaces, and the electrode 15 is attached to the lower surface.
is croup A, which is a set of three.
B、C・・・・毎に共通のケーブル1六希続されている
セラミック振動子18を所定間隔で1列に並べ同様にケ
ーブルとセラミック振動板とを重ねで固着してから、各
クループA、B、C・・・・・内では下面の電極16を
切断する深さまで切断して切断溝19を設け、各グルー
プA、B、C・・・・・・の間ではケーブル17まで切
断する深さまで切断して切断溝20を設けるようにする
ことにより、配列構成するとよい。For each croup A, the ceramic oscillators 18 connected with 16 common cables are arranged in a row at predetermined intervals, and the cables and ceramic diaphragms are stacked and fixed in the same way. , B, C...... cut to the depth to cut the electrode 16 on the lower surface to provide a cutting groove 19, and between each group A, B, C...... cut to the cable 17. It is preferable to form an arrangement by cutting to a depth to provide the cutting grooves 20.
次に、(ロ)のように上面電極15の一方の端部に共通
のリード線としての導電性で容易に折り曲げが01′能
な薄板21をその一部が電極16と重なり合うようにし
てハンダ付けあるいは導′屯性接着剤その他の方法で接
着する。次いで、この薄板21を超音波吸収体14及び
セラミック振動子18に接着する側面の部分に切断溝1
9,20に吸い込まれないような高粘度の絶縁性接着剤
22を塗布する。その段、(ハ)のように薄板21をセ
ラミック振動子18の端部の近傍で折り曲げ薄板21を
セラミック振動子18及び超音波吸収体14に接着固定
する。このとき、高粘度の絶縁性接着剤22の粘度は、
塗布してから硬化するまでに切断溝19゜20に浸透し
ていかない程度の高粘度を持つものとする。Next, as shown in (b), a conductive and easily bendable thin plate 21 as a common lead wire is attached to one end of the upper surface electrode 15 so that a part thereof overlaps with the electrode 16, and soldered. Adhesive or adhesive with conductive adhesive or other method. Next, cut grooves 1 are formed in the side surfaces of the thin plate 21 to be bonded to the ultrasonic absorber 14 and the ceramic vibrator 18.
Apply a high viscosity insulating adhesive 22 that will not be sucked into the parts 9 and 20. At that stage, as shown in (c), the thin plate 21 is bent near the end of the ceramic vibrator 18 and the thin plate 21 is adhesively fixed to the ceramic vibrator 18 and the ultrasonic absorber 14. At this time, the viscosity of the high viscosity insulating adhesive 22 is
The viscosity should be so high that it does not penetrate into the cutting grooves 19 and 20 between application and hardening.
さらに、このように上面電極15の上に合成樹脂又はガ
ラス等による音響マツチング層23を密着して設けた後
、(ホ)のように音響マツチング層23を切断溝2oの
位置で薄板21と共に切断することにより、超音波探触
子を完成する。このようにすると、第3図(ホ)に示す
ように、切断された薄板21の幅を従来に比較して大き
くすることができ(図示実施例では3倍)、薄板21と
上面電極15との接着部(で働く切断応力を極めて小さ
くすることができるので電気的な接続不良の発生を少な
くすることができ、セラミック振動子18の幅を狭くし
ても良好な超酢彼探弧(子に製造することかできる。Furthermore, after the acoustic matching layer 23 made of synthetic resin or glass is provided in close contact with the top electrode 15, the acoustic matching layer 23 is cut together with the thin plate 21 at the cutting groove 2o as shown in (E). By doing this, the ultrasonic probe is completed. In this way, as shown in FIG. 3(E), the width of the cut thin plate 21 can be increased compared to the conventional method (three times in the illustrated embodiment), and the width of the thin plate 21 and the upper electrode 15 can be increased. Since the cutting stress acting on the bonded part (of Can be manufactured to
発明の効果
このように、本発明によれば、セラミック振動子の幅寸
法の小さい超音波探触子でも、マツチング層と薄板とを
接触不良を生じないように切断することができ、極めて
容易に製造できるすぐれた効果を有する。Effects of the Invention As described above, according to the present invention, even an ultrasonic probe with a small ceramic transducer width can cut the matching layer and the thin plate without causing poor contact, and it is possible to cut the matching layer and the thin plate very easily. It has excellent manufacturing effects.
第1図は一般的な超音波探触子の(I11面図、第2図
は従来の一例の超音波探触子の製造方法による製造過程
を示す斜視図、第3図は本発明の一実施例における超音
波探触子の製造方法による製造過程を示す斜視図および
側面図である。
14・・・・・超音波吸収体、16・・・・・・上面電
極、17・・・・・・ケーブル、18 ・・・・セラミ
ック振動子、19.20・・・・・・切断溝、21・・
・・・薄板、22・・・・・・絶縁性接着剤、23 ・
・・・音響マツチング層。Fig. 1 is a (I11) side view of a general ultrasonic probe, Fig. 2 is a perspective view showing the manufacturing process according to a conventional example of an ultrasonic probe manufacturing method, and Fig. 3 is a perspective view showing a manufacturing process according to an example of the conventional ultrasonic probe manufacturing method. It is a perspective view and a side view showing the manufacturing process by the manufacturing method of the ultrasonic probe in the example. 14... Ultrasonic absorber, 16... Upper surface electrode, 17... ... Cable, 18 ... Ceramic resonator, 19.20 ... Cutting groove, 21 ...
... Thin plate, 22 ... Insulating adhesive, 23 ・
...Acoustic matching layer.
Claims (1)
振動子を所定間隔で配列させ、前記セラミック振動子の
群の上面電極の一方の端部に導電性でかつ谷筋に折り曲
げが可能な薄板をその薄板の一部が前記上面電極と重な
り合うようにして接着し、前記薄板を前記超音波吸収体
及びセラミック振動子に接着する部分に前記振動子の間
の溝に吸い込まれない程度の高粘度の絶縁性接着剤を塗
布した後、1)7J記薄板を前記セラミック場動子の群
の端部の近傍で折り曲げて前記薄板を前記セラミック振
動子及び超音波吸収体に接着し、さらにマツチング層を
前記上面電極上に接着し、しかる後に前記セラミック振
動子の複数個で構成される振動子グループの中間の位置
で前記マツチング層と前記薄板とを同時に切断すること
を特徴とする超音波探触子の製造方法。Ceramic transducers having electrodes on both upper and lower surfaces are arranged at predetermined intervals on the ultrasonic absorber, and a thin plate that is conductive and can be bent into valleys is attached to one end of the upper electrode of the group of ceramic transducers. is bonded so that a part of the thin plate overlaps with the top electrode, and the thin plate is bonded to the ultrasonic absorber and the ceramic vibrator with a high viscosity that does not get sucked into the groove between the vibrators. 1) Bend the 7J thin plate near the end of the group of ceramic field elements to bond the thin plate to the ceramic vibrator and ultrasonic absorber, and then apply a matching layer. is bonded onto the upper surface electrode, and then the matching layer and the thin plate are simultaneously cut at an intermediate position of a vibrator group made up of a plurality of the ceramic vibrators. Method of producing children.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57201494A JPS5991800A (en) | 1982-11-16 | 1982-11-16 | Manufacture of ultrasonic wave probe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57201494A JPS5991800A (en) | 1982-11-16 | 1982-11-16 | Manufacture of ultrasonic wave probe |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5991800A true JPS5991800A (en) | 1984-05-26 |
JPH034160B2 JPH034160B2 (en) | 1991-01-22 |
Family
ID=16441982
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57201494A Granted JPS5991800A (en) | 1982-11-16 | 1982-11-16 | Manufacture of ultrasonic wave probe |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5991800A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103371850A (en) * | 2012-04-23 | 2013-10-30 | 三星电子株式会社 | Ultrasonic transducer, ultrasonic probe, and ultrasound image diagnosis apparatus |
JP2014180402A (en) * | 2013-03-19 | 2014-09-29 | Konica Minolta Inc | Ultrasonic probe and ultrasonic image diagnostic apparatus |
-
1982
- 1982-11-16 JP JP57201494A patent/JPS5991800A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103371850A (en) * | 2012-04-23 | 2013-10-30 | 三星电子株式会社 | Ultrasonic transducer, ultrasonic probe, and ultrasound image diagnosis apparatus |
US9408589B2 (en) | 2012-04-23 | 2016-08-09 | Samsung Electronics Co., Ltd. | Ultrasonic transducer, ultrasonic probe, and ultrasound image diagnosis apparatus |
JP2014180402A (en) * | 2013-03-19 | 2014-09-29 | Konica Minolta Inc | Ultrasonic probe and ultrasonic image diagnostic apparatus |
Also Published As
Publication number | Publication date |
---|---|
JPH034160B2 (en) | 1991-01-22 |
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