JPS5988862A - 接続用金属への金属突起物形成方法 - Google Patents

接続用金属への金属突起物形成方法

Info

Publication number
JPS5988862A
JPS5988862A JP57199205A JP19920582A JPS5988862A JP S5988862 A JPS5988862 A JP S5988862A JP 57199205 A JP57199205 A JP 57199205A JP 19920582 A JP19920582 A JP 19920582A JP S5988862 A JPS5988862 A JP S5988862A
Authority
JP
Japan
Prior art keywords
metallic
metal
substrate
projections
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57199205A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0129061B2 (enExample
Inventor
Kenzo Hatada
畑田　賢造
Isamu Kitahiro
北広　勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP57199205A priority Critical patent/JPS5988862A/ja
Publication of JPS5988862A publication Critical patent/JPS5988862A/ja
Publication of JPH0129061B2 publication Critical patent/JPH0129061B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H01J9/04—Manufacture of electrodes or electrode systems of thermionic cathodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
JP57199205A 1982-11-12 1982-11-12 接続用金属への金属突起物形成方法 Granted JPS5988862A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57199205A JPS5988862A (ja) 1982-11-12 1982-11-12 接続用金属への金属突起物形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57199205A JPS5988862A (ja) 1982-11-12 1982-11-12 接続用金属への金属突起物形成方法

Publications (2)

Publication Number Publication Date
JPS5988862A true JPS5988862A (ja) 1984-05-22
JPH0129061B2 JPH0129061B2 (enExample) 1989-06-07

Family

ID=16403881

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57199205A Granted JPS5988862A (ja) 1982-11-12 1982-11-12 接続用金属への金属突起物形成方法

Country Status (1)

Country Link
JP (1) JPS5988862A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230268312A1 (en) * 2022-02-18 2023-08-24 Bae Systems Information And Electronic Systems Integration Inc. Soft touch eutectic solder pressure pad

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230268312A1 (en) * 2022-02-18 2023-08-24 Bae Systems Information And Electronic Systems Integration Inc. Soft touch eutectic solder pressure pad

Also Published As

Publication number Publication date
JPH0129061B2 (enExample) 1989-06-07

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