JPS598722A - 半導体封止用液状エポキシ樹脂組成物 - Google Patents

半導体封止用液状エポキシ樹脂組成物

Info

Publication number
JPS598722A
JPS598722A JP11938182A JP11938182A JPS598722A JP S598722 A JPS598722 A JP S598722A JP 11938182 A JP11938182 A JP 11938182A JP 11938182 A JP11938182 A JP 11938182A JP S598722 A JPS598722 A JP S598722A
Authority
JP
Japan
Prior art keywords
epoxy resin
liquid epoxy
resin composition
phenol
semiconductor encapsulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11938182A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6244015B2 (enExample
Inventor
Norimoto Moriwaki
森脇　紀元
Torahiko Ando
虎彦 安藤
Yuzo Kanegae
鐘ケ江　裕三
Takamitsu Fujimoto
隆光 藤本
Shohei Eto
江藤　昌平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP11938182A priority Critical patent/JPS598722A/ja
Publication of JPS598722A publication Critical patent/JPS598722A/ja
Publication of JPS6244015B2 publication Critical patent/JPS6244015B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Organic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP11938182A 1982-07-07 1982-07-07 半導体封止用液状エポキシ樹脂組成物 Granted JPS598722A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11938182A JPS598722A (ja) 1982-07-07 1982-07-07 半導体封止用液状エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11938182A JPS598722A (ja) 1982-07-07 1982-07-07 半導体封止用液状エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS598722A true JPS598722A (ja) 1984-01-18
JPS6244015B2 JPS6244015B2 (enExample) 1987-09-17

Family

ID=14760096

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11938182A Granted JPS598722A (ja) 1982-07-07 1982-07-07 半導体封止用液状エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS598722A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01298752A (ja) * 1988-05-27 1989-12-01 Abisare:Kk 導電回路用の封止剤
US6495270B1 (en) 1998-02-19 2002-12-17 Hitachi Chemical Company, Ltd. Compounds, hardening accelerator, resin composition, and electronic part device
WO2012111652A1 (ja) * 2011-02-14 2012-08-23 住友ベークライト株式会社 液状封止樹脂組成物および液状封止樹脂組成物を用いた半導体装置
KR20180125513A (ko) * 2016-03-15 2018-11-23 훈츠만 어드밴스트 머티리얼스 라이센싱 (스위처랜드) 게엠베하 전기공학용 절연 시스템의 제조 방법, 이로부터 수득된 물품 및 이의 용도

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01298752A (ja) * 1988-05-27 1989-12-01 Abisare:Kk 導電回路用の封止剤
US6495270B1 (en) 1998-02-19 2002-12-17 Hitachi Chemical Company, Ltd. Compounds, hardening accelerator, resin composition, and electronic part device
WO2012111652A1 (ja) * 2011-02-14 2012-08-23 住友ベークライト株式会社 液状封止樹脂組成物および液状封止樹脂組成物を用いた半導体装置
KR20180125513A (ko) * 2016-03-15 2018-11-23 훈츠만 어드밴스트 머티리얼스 라이센싱 (스위처랜드) 게엠베하 전기공학용 절연 시스템의 제조 방법, 이로부터 수득된 물품 및 이의 용도
JP2019515979A (ja) * 2016-03-15 2019-06-13 ハンツマン・アドヴァンスト・マテリアルズ・ライセンシング・（スイッツランド）・ゲーエムベーハー 電気工学用の絶縁系の製造方法、それから得られる製品及びその使用

Also Published As

Publication number Publication date
JPS6244015B2 (enExample) 1987-09-17

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