JPS5987069A - Resist coater - Google Patents

Abstract

PURPOSE:To form a uniform film free from unevenness in film thickness on a wafer, by fixing a supporting plate for a disc moving up and down above a sample and a table for mounting a sample thereon to the same rotary shaft. CONSTITUTION:A supporting plate 17 for supporting a disc 15 moving up and down above a sample such as a wafer 11 and a wafer holder 12 for mounting a sample such as a wafer 11 on it are fixed to the same rotary shaft 13 and rotated as a unitary body. Hence, by pressing a dropped liquid resist or the like onto the wafer or the like with the disc, uniform film thickness is obtained, and the amount of the liquid resist can be remarkably reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to an improvement in a resist cloth device that applies a resist solution using a spin foot method in a photoprocessing process.

(b) Background of the technology Photoetching is a technique in which unnecessary parts are removed by optical and chemical processing in order to obtain a desired pattern on a wafer. A protective film against etching is required. Resist is applied as this protective film, but it is necessary to form a resist film of uniform thickness on wafers, which are becoming increasingly large in size. When the resist 8 layer becomes thinner, it is advantageous for forming fine patterns, but on the other hand, pinholes are more likely to occur and the performance of the pattern becomes more expensive.

0 PRIOR ART AND PROBLEMS The film thickness obtained by the SHINYA-) method is determined by the viscosity of the resist solution, the rotational speed of the spinner, the solvent of the resist solution, and the initial rotational acceleration of the spinner. - With the recent development of microfabrication technology, there has been a trend towards high density and high integration. ρ Frame Printing Poet Wide Diameter q Guji φ
is used, making it difficult to apply the film to a uniform thickness. Moreover, the film thickness formed on the wafer by the dropped resist liquid is several microns, and the amount of deposited resist liquid is only a few percent of the total resist liquid, which is inefficient. FIG. 1 is a block diagram showing a conventional resist coating apparatus. 1 in the diagram
is a resist coating device that coats a resist solution onto a wafer 3 using a spin code method in a clean booth 2,
A bellows pump 6 is passed from the resist tank 4 through the cylinder 5.
iC constant fi+7) The resist solution is fed, and the Perot pump 6 is pressed to drop a certain amount of the resist solution onto the wafer 3. ζ due to the rotation of the wafer holder 7 on which the wafer 3 is placed
The resist liquid dropped onto the wafer 3 is diffused from the center to the periphery. The piping system is provided with a cylinder 5 and a slow-moving check pulp VIBV2, which flows in the direction shown by the arrow. To fill the bellows pump 6 with resist, iVl is opened and V2 is closed. Apply resist solution (Vl is closed,
V2 becomes open. A needle valve 8 is provided to adjust the flow rate of the resist solution so that the excess resist solution does not get onto the rotating wafer 3 when the resist solution is diffused. Additionally, a PAja 9 is provided for removing dust present in the resist solution.

The amount of resist liquid to be filled into the Perot pump 6 is specified so as to obtain the desired film thickness, but it is not easy to obtain a uniform film thickness with large diameter wafers, and the film tends to be thick at the center and thin at the periphery. . Furthermore, air currents generated on a wafer rotating at high speed may cause radial film thickness unevenness, so-called separation.

(d) Object of the Invention In view of the above-mentioned drawbacks, the present invention aims to provide a coating means for forcefully diffusing the resist solution by pressing a disc onto the surface of the resist solution dropped onto a wafer, and further performing spin coding.

(e) Structure of the Invention The above object according to the present invention has a disk that moves up and down over a sample, and a support plate that supports the disk and a table on which the sample is placed Cfi are on the same rotation axis. This is achieved by providing a mechanism that rotates integrally with the fixed position.

(f) Examples of the invention Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 2 is a side view showing a coating mechanism according to an embodiment of the present invention.

In the figure, a rotating system consisting of a wafer holder 12 fixed to a rotating shaft 13 and holding a wafer 11, a cylinder 15 that moves a disk 14 up and down, and a disk system consisting of a vacuum suction device 16 are constructed. Furthermore, a support plate 17 that supports the disk 14
is fixed to the rotating shaft 13 (the substrate 11 and the disc 14 are a coating mechanism that rotates using the same rotating shaft system. The operating procedure is as follows: First, the cylinder 18 is in contact with the upper surface of the disc 14, and the disc 14 is fixed to the rotating shaft 13. However, after σ, the pressurized air pulp v1 of the cylinder 15 is opened and v2 is closed to operate the cylinder 15, thereby floating the disk 14. The resist liquid is introduced from the inlet 14a provided at the center of the disk 14. Wafer 11
drip onto the main surface. By slightly returning the cylinder/dar 15 to the rest position, the resist liquid surface of the disk 14:'ff is pressed and the resist liquid is spread from the center to the periphery of the wafer 11. The disc 14 (1) is held by a stopper 17mea provided on the disc support plate 17, and the disc 14 and the wafer 11 are positioned so as to form a fixed amount of one system.Therefore, the resist liquid ε is applied without a certain gap hll. -C7C7 Niha1 is diffused.

However, if the suction chuck 18 is opened and the cylinder 15 is operated again, spin coding is performed in the illustrated state. In this embodiment, the composition of the disc 14 is
A uniform film thickness was obtained by using a Teflon material with low adhesion to K and setting the gap between the disk 14 and the wafer 11 to 0.11. However, it has the advantage of greatly reducing the amount of resist liquid compared to the conventional method. Since the disk is interposed with a minute gap above the spin-coding material, it is possible to prevent unevenness in film thickness due to radial separation. Further, although a vacuum suction machine is used as a holding mechanism for the disc, other methods may be used, for example, a magnetic chuck may be used to attract water-breaking resin to a disc made of a coach knob to hold and release the disc.

@Effects of the Invention As explained in detail above, the coating mechanism of the present invention provides a uniform film thickness with no unevenness in the film formed on the wafer, improving reliability and making it easier to use resist liquid than conventional resist solutions. This has the effect of significantly reducing costs compared to .

[Brief explanation of the drawing]

Fig. 1 shows a conventional resist coating apparatus; Fig. 2 shows a side view of a coating apparatus according to an embodiment of the present invention.・Queha holder) 13... Oral transmission axis, 14...
・Disc, 15・Old...Cylinder 16...
Vacuum suction machine, 17...Support plate, 18...
・・Adsorption Teyanoku, '0 几

Claims (1)

[Claims] The machine has a disk that moves up and down over the sample, and a support plate that supports the disk and a holder that places the sample are fixed to the same rotation axis and rotate integrally. A resist coating device featuring: