JPS598353Y2 - Surface protection agent coating equipment for semiconductor devices - Google Patents

Surface protection agent coating equipment for semiconductor devices

Info

Publication number
JPS598353Y2
JPS598353Y2 JP1978180954U JP18095478U JPS598353Y2 JP S598353 Y2 JPS598353 Y2 JP S598353Y2 JP 1978180954 U JP1978180954 U JP 1978180954U JP 18095478 U JP18095478 U JP 18095478U JP S598353 Y2 JPS598353 Y2 JP S598353Y2
Authority
JP
Japan
Prior art keywords
drum
surface protection
protection agent
protective agent
coating equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1978180954U
Other languages
Japanese (ja)
Other versions
JPS5596648U (en
Inventor
忠雄 羽山
Original Assignee
富士電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士電機株式会社 filed Critical 富士電機株式会社
Priority to JP1978180954U priority Critical patent/JPS598353Y2/en
Publication of JPS5596648U publication Critical patent/JPS5596648U/ja
Application granted granted Critical
Publication of JPS598353Y2 publication Critical patent/JPS598353Y2/en
Expired legal-status Critical Current

Links

Landscapes

  • Coating Apparatus (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【考案の詳細な説明】 本考案は円筒形の半導体素子の信頼性の向上のために施
こす表面保護剤の塗布装置に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for applying a surface protective agent to improve the reliability of cylindrical semiconductor devices.

半導体素子の半導体表面に対する外部からの電荷又は不
純物の影響を阻止し、半導体素子の信頼性を向上するた
めに、シリコーンワニスあるいはシリコーンゴムなどの
樹脂から戒る表面保護剤で表面を被覆し、その後例えば
合戒樹脂で封止することが行われる。
In order to prevent the influence of external charges or impurities on the semiconductor surface of a semiconductor element and improve the reliability of the semiconductor element, the surface is coated with a surface protective agent made from resin such as silicone varnish or silicone rubber, and then For example, sealing with a resin is performed.

これらの表面保護剤を半導体表面に塗布するには手塗り
によることもあるが、量産の為には自動塗布装置が用い
られる。
These surface protective agents may be applied by hand to the semiconductor surface, but automatic coating equipment is used for mass production.

この装置は第1図のように表面保護剤1の付着したドラ
ム2の上側において、ドラムに接するように支持枠3内
に支持された半導体素子4をコンベヤ5により矢印の方
向に進行方向と同じ方向に、すなわち図の例では時計方
向に回転させる。
As shown in FIG. 1, this device carries a semiconductor element 4 supported in a support frame 3 so as to be in contact with the drum on the upper side of a drum 2 to which a surface protection agent 1 has been adhered, by a conveyor 5 in the direction of the arrow. direction, that is, clockwise in the example shown.

素子4はこのドラム2に接して反時計方向に回転しなが
ら通過し、表面保護剤が全側面に塗布される必要がある
ので、その形状は円筒形であり、その軸がドラム2の軸
に平行になるようにして支持枠3に回転自在に支持され
る。
The element 4 passes in contact with this drum 2 while rotating counterclockwise, and since the surface protection agent needs to be applied to all sides, its shape is cylindrical, and its axis is aligned with the axis of the drum 2. It is rotatably supported by the support frame 3 so as to be parallel to each other.

円筒形の半導体素子4は第2図に示すように半導体円板
6にはタングステン、モリブテ゛ンあるいはコバールな
どの熱膨張係数が半導体に近い材料の円筒形電極体7が
両側に固着され、この電極体7にリード線8が接続され
ている。
As shown in FIG. 2, the cylindrical semiconductor element 4 has cylindrical electrode bodies 7 fixed to both sides of a semiconductor disk 6 made of a material such as tungsten, molybdenum, or kovar whose coefficient of thermal expansion is close to that of the semiconductor. A lead wire 8 is connected to 7.

しかしこのようなドラムを用いて塗布した場合、表面保
護剤9の厚さが第3図のように不均一となり、樹脂封止
の際に合戒樹脂層に割れを生じたり、あるいは素子の使
用中に熱歪などにより保護剤層に割れを生じたりするこ
とがある。
However, when such a drum is used for coating, the thickness of the surface protective agent 9 becomes uneven as shown in Figure 3, which may cause cracks in the resin layer during resin sealing, or may cause problems in the use of the device. In some cases, cracks may occur in the protective agent layer due to thermal distortion.

本考案の目的は、このような表面保護剤の被覆が均一に
できるようにする塗布装置を提供することにある。
An object of the present invention is to provide a coating device that enables uniform coating of such a surface protective agent.

この目的は塗布装置が円筒形半導体素子をその軸の周り
に回転自在に支持して軸と直角方向に進行させる運搬手
段と、素子の進行方向に順次配列される回転軸がその進
行方向に直角で進行方向に回転する表面保護剤塗布用の
第1ドラムおよび回転軸が同じく進行方向に直角で進行
方向と逆に回転する過剰表面保護剤除去用の第2ドラム
とから或ることによって達或される。
The purpose of this is to provide a conveying means in which the coating device rotatably supports cylindrical semiconductor devices around its axis and to move the devices in a direction perpendicular to the axis, and a rotating shaft that is sequentially arranged in the direction of movement of the devices to be perpendicular to the direction of movement of the devices. The first drum for applying the surface protective agent rotates in the direction of travel, and the second drum for removing excess surface protective agent rotates at right angles to the direction of travel and opposite to the direction of travel. be done.

以下第4図に従って本考案の実施例を説明する。An embodiment of the present invention will be described below with reference to FIG.

図示のようにこの装置は第1図のドラム2と同様な第l
ドラム11のほかに半導体素子4のコンベヤ5による進
行方向の先の方に第2ドラム12が設けられる。
As shown, this device is similar to drum 2 in FIG.
In addition to the drum 11, a second drum 12 is provided further forward in the direction in which the semiconductor elements 4 travel on the conveyor 5.

第1ドラム11を表面保護剤1を付着して素子4に接触
し、その側面を表面保護剤9で被覆する。
The first drum 11 is brought into contact with the element 4 with the surface protection agent 1 attached thereto, and its side surface is coated with the surface protection agent 9.

半導体素子4は第2図に示すような円筒形でその軸をド
ラム11の軸方向に平行コしてそのリード線部8で支持
する支持枠3内に回転自在に配置され、コンベヤ5によ
り矢印方向に運ばれ、時計方向に回転するドラム11に
接触して反時計方向に回転しながら表面保護剤9で被覆
される。
The semiconductor element 4 has a cylindrical shape as shown in FIG. The surface protectant 9 is coated with the surface protective agent 9 while being brought into contact with the clockwise rotating drum 11 and rotating counterclockwise.

素子4はさらに進行して第2ドラム12に接触する。The element 4 advances further and contacts the second drum 12.

第2ドラム12は回転方向が第1ドラム11と逆方向で
反時計方向であり、素子4の進行方向と逆に回転する。
The second drum 12 rotates in a counterclockwise direction opposite to that of the first drum 11, and rotates in the opposite direction to the advancing direction of the element 4.

素子4がこのドラム12に接触すると時計方向に自転し
、表面保護剤9の過剰の厚さの部分はこのドラム12に
拭いとられて均一な厚さになる。
When the element 4 comes into contact with this drum 12, it rotates clockwise, and the excess thickness of the surface protection agent 9 is wiped off by this drum 12, resulting in a uniform thickness.

この場合第2ドラム12の表面を、例えばキシレンのよ
うな溶剤13で濡らしてから接触させると、表面保護剤
層9の厚さの均一化はより促進される。
In this case, if the surface of the second drum 12 is wetted with a solvent 13 such as xylene and then brought into contact with it, the thickness of the surface protective agent layer 9 will be more uniform.

さらに表面保護剤の確実な塗布とその均一化を保証する
ためには、このような一対のロールをさらにもう一連コ
ンベヤの進行方向の先の方に配置して同様な操作をくり
返すことも有効である。
Furthermore, in order to ensure reliable application and uniformity of the surface protective agent, it is also effective to place another pair of rolls further along the conveyor and repeat the same operation. It is.

上述のように本考案に基づく塗布装置は、表面保護剤塗
布のロールのほかに逆回転の過剰表面保護剤除去用ロー
ルを設けることにより、表面保護剤の均一な自動塗布を
可能にし、完或した半導体素子の信頼性を一層高めるも
のである。
As mentioned above, the coating device based on the present invention enables uniform automatic coating of the surface protection agent by providing a counter-rotating roll for removing excess surface protection agent in addition to the roll for applying the surface protection agent. This further improves the reliability of semiconductor devices.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の表面保護剤塗布装置の断面図、第2図は
塗布される円筒形半導体素子の側面図、第3図は第1図
の装置により塗布された表面保護剤の不均一な状態を示
す半導体素子の縦断面図、第4図は本考案の一実施例の
塗布装置の断面図である。 1・・・・・・表面保護剤、4・・・・・・半導体素子
、5・・・・・・コンベヤ、9・・・・・・表面保護剤
層、11・・・・・・表面保護剤塗布用ドラム、12・
・・・・・過剰表面保護剤除去用ドラム。
Figure 1 is a cross-sectional view of a conventional surface protective agent coating device, Figure 2 is a side view of a cylindrical semiconductor device being coated, and Figure 3 shows the unevenness of the surface protective agent applied by the device shown in Figure 1. FIG. 4 is a longitudinal cross-sectional view of a semiconductor element showing the state of the semiconductor element, and FIG. 4 is a cross-sectional view of a coating apparatus according to an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1...Surface protection agent, 4...Semiconductor element, 5...Conveyor, 9...Surface protection agent layer, 11...Surface Drum for applying protective agent, 12.
...Drum for removing excess surface protection agent.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 円筒形半導体素子をその軸の囲りに回転自在に支持して
軸と直角方向に進行させる運搬手段と、該素子の進行方
向に順次配列される回転軸が該進行方向に直角で進行方
向に回転する表面保護剤塗布用の第1ドラムおよび回転
軸が前記進行方向に直角で進行方向と逆に回転する過剰
表面保護剤除去用の第2ドラムとから或ることを特徴と
する半導体素子の表面保護剤塗布装置。
A conveying means that rotatably supports a cylindrical semiconductor element around its axis and moves the element in a direction perpendicular to the axis, and a rotating shaft that is sequentially arranged in the direction of movement of the element and extends in the direction of movement perpendicular to the direction of movement of the element. A semiconductor device comprising: a rotating first drum for applying a surface protective agent; and a second drum for removing excess surface protective agent, the rotating shaft of which rotates at right angles to the traveling direction and opposite to the traveling direction. Surface protection agent coating equipment.
JP1978180954U 1978-12-25 1978-12-25 Surface protection agent coating equipment for semiconductor devices Expired JPS598353Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1978180954U JPS598353Y2 (en) 1978-12-25 1978-12-25 Surface protection agent coating equipment for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1978180954U JPS598353Y2 (en) 1978-12-25 1978-12-25 Surface protection agent coating equipment for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS5596648U JPS5596648U (en) 1980-07-04
JPS598353Y2 true JPS598353Y2 (en) 1984-03-15

Family

ID=29192637

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1978180954U Expired JPS598353Y2 (en) 1978-12-25 1978-12-25 Surface protection agent coating equipment for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS598353Y2 (en)

Also Published As

Publication number Publication date
JPS5596648U (en) 1980-07-04

Similar Documents

Publication Publication Date Title
SE8502064L (en) DEVICE FOR APPLICATION OF A LIQUID ON A CURRENT RANGE
JPH0661280A (en) Device for manufacturring semiconductor device
JPS598353Y2 (en) Surface protection agent coating equipment for semiconductor devices
US3145126A (en) Method of making diffused junctions
JPS55154743A (en) Semiconductor device and method of fabricating the same
JP3077117B2 (en) Substrate transfer and transport device
JPS59117123A (en) Resist remover
JP3309079B2 (en) Film forming apparatus and film forming method
JP3210744B2 (en) Application method
JP3320865B2 (en) Apparatus for applying conductive paste and coating method using the same
US2718616A (en) Semi-conductive device
JPH05135987A (en) Coating method for varnish of coil
JPS59120271A (en) Coating method using resin solution
JPH02178664A (en) Production of electrophotographic organic photosensitive body
JPS6039100Y2 (en) Roller shaft primer coating device
JP2964987B2 (en) Method and apparatus for forming protective coating layer of diode element
JPS6218035Y2 (en)
JPS639958Y2 (en)
JP2679230B2 (en) Electronic parts painting method and painting equipment
MX151804A (en) IMPROVED METHOD FOR DEPOSITING CONDUCTIVE FILM OF TIN OXIDE ON THE INTERIOR SURFACE OF GLASS PIPE
JPS55107258A (en) Electrode construction for semiconductor element
JPS6111792B2 (en)
JPH05146728A (en) Primer coating applicator
JP2816220B2 (en) Photoresist coating method
JPS54137967A (en) Fabrication method of semiconductor device