JPS598055B2 - Semiconductor slice holder - Google Patents

Description

[Detailed description of the invention] The present invention relates to a holder for semiconductor slices.

In the manufacture of semiconductor devices, starting materials such as silicon or germanium are subjected to various treatments such as heat treatment for diffusion, etching treatment, and cleaning treatment in the sliced state during intermediate steps of manufacture. By the way, in these processing steps, there is also the problem of workability9, and a slice holder is required, which consists of two or three pieces made of quartz.
Point support types have been known for some time.

That is, as shown in a perspective view in FIG. 1 and a cross-sectional view in FIG.
A quartz rod 2, 3 having grooves 4, 4' at two or three points circumscribing the quartz rod 2 is placed on a quartz table 1, and a semiconductor slice is placed in the grooves 4, 4' of the quartz rod 2. The edges of the semiconductor slice 5 are fitted together to support the semiconductor slice 5.

10 However, especially in the heat treatment process, because there is a difference between the coefficient of thermal expansion of quartz and that of slicing, thermal distortion may occur at the contact part with the holder, and sticky substances generated during the treatment may The cutting edge entered the gap between the cutting groove and the slice, causing the slice to become stuck, resulting in the slice being damaged when the slice was removed from the supporter 15.

In addition, in the thermal diffusion process, lattice defects occur due to the thermal strain, and the convection of impurity gas is poor, resulting in variations in diffusion parameters within the slice.
It had 0. The present invention has been made in view of these drawbacks, and an object of the present invention is to provide a support for semiconductor slices that does not cause thermal distortion in the slices, allows easy removal of the slices, and allows uniform processing. The purpose is 25.

The semiconductor slice support device of the present invention supports one semiconductor slice by a support groove provided in a quartz rod located below.
The support 30 is supported at a point, and supported 30 on the sides by an auxiliary groove in a loose-fitting manner while maintaining a mutual spacing.

Next, embodiments of the present invention will be described with reference to the drawings.

explain. As shown in FIG. 3, the semiconductor slice support according to the embodiment of the present invention consists of a plate-shaped quartz base 1 with 35
A first quartz rod 6 with a diameter of 10φ is placed in the center, and second and third quartz rods 2 and 3 are placed in parallel on both sides, and on the top surface of the first quartz rod 6, A support groove 7 having a flat bottom surface is formed, and auxiliary grooves 14 and 145 are formed deep and large on the inside of the second and third quartz rods 2 and 3.

As shown in FIG. 4, which shows a cross section of the support with the slice 5 placed on it, the gravity of the slice 5 is applied only to one point on the bottom of the support groove 7, and the auxiliary grooves 14, 1
The opposing spacing of 4" is set to the extent that the slices are held loosely. Therefore, the slices are supported with a degree of freedom in all directions, and the slices can be fitted into the kerfs. This effectively eliminates the disadvantages that exist in conventional holders that support the quartz rods, especially the occurrence of lattice defects due to thermal strain.
'' serves as an auxiliary guide. When boron was diffused into a silicon slice with a diameter of 50φ using a holder with such a structure, the incidence of lattice defects was 500 cases/
d, which was reduced to 1 when using a conventional holder.
Therefore, when, for example, a transistor is formed using a semiconductor slice that has been subjected to a diffusion process using the holder of the present invention, the leakage current of the completed transistor is significantly reduced. Furthermore, the diffusion parameter within this slice, for example, the sheet resistance, is conventionally 1.5±0.7Ω/(: -Fi
t became 1.5±0.3Ω/CTlt, which greatly reduced the variation in power, making it easier to control the direct current amplification factor (HFE) of the transistor. These effects are such that in the slice holder of the present invention, the lower end of the slice is supported at one point by the support groove 7 provided in the quartz rod 6, and the peripheral edge of the slice is supported in the auxiliary grooves 14, 145 provided on the sides. The auxiliary grooves 14, 14'', which are partially loosely fitted, therefore act only as guides, so that support of the slices is provided with freedom in all directions. Furthermore, such a semiconductor slice holder can be used not only during thermal diffusion but also during cleaning, etching, and other processes.

As explained above, the semiconductor slice holder of the present invention not only suppresses the occurrence of thermal strain during the heat treatment process, but also facilitates the attachment and detachment of slices, resulting in improved workability. Moreover, the inconvenience of the slice being damaged during removal is also eliminated.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a conventional semiconductor slice holder. FIG. 2 is a sectional view of the holder. FIG. 3 is a perspective view of a semiconductor slice holder according to an embodiment of the present invention. FIG. 3 is a cross-sectional view of the holder shown in the figure. 1...stand, 2...second quartz rod, 3.
...Third quartz rod, 14,14''...Auxiliary groove, 5...Slice, 6...First quartz rod, 7... ...Support groove.

Claims (1)

[Claims] 1. A quartz rod in which the lower peripheral edge of the semiconductor slice is inserted and grooves that support it at one point are arranged in parallel on the upper surface, and grooves that loosely support both side peripheral edges of the semiconductor slice are arranged in parallel. A holder for a semiconductor slice, comprising two quartz rods.