JPS5979986A - Junction malfunction detector for card edge contact - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the bonding of a printed circuit package and a corresponding side entry type ZIF connector, and more particularly to a device for detecting bonding failures caused by contact misalignment in connectors that connect a large number of ICs.

Contact alignment between a conventional side-entry type ZIF connector and a printed circuit package to be VC bonded is as follows: A package abutment surface is provided deep inside the package housing of the ZF connector, and the dimension from this abutment surface to the center of the connector contact is determined. This is achieved by matching the dimensions from the tip of the package to the center of the edge contact. Therefore, the tip of the package is ZIF
If the connector contacts are closed without being inserted all the way to the package abutting surface of the connector, a connection failure will occur due to the positional deviation Vc of the contacts. A bonding failure was detected for the first time when the package did not operate normally even after the power was turned on, and there was a lack of preventive measures against work errors.

The purpose of the present invention is to detect the connection state between the edge contact of a 7-lint path package using a side entry type ZI)i' connector and the ZIF connector contact at the t-current conduction time, thereby preventing the above-mentioned connection failure. It is possible to prevent card edge contact bonding failure detection by providing #j, #, t-.

Unlike general card edge type connectors, where the positions of the contacts are regulated by using both sides of the connector opening as guides, side entry type ZIF connectors are designed with In the present invention, among the edge contacts of the printed circuit package, one or two facing each other on the front and back are made into linear contacts having a narrower width than the other contacts. , B-cage? When inserted into a ZIF connector and brought into a connected state, by detecting that the wire contact and the ZIF connector contact that corresponds to this VC are connected before the full energization operation, other processes can be performed at the center of the contact. This is to confirm that the contacts of the VcZIF connector are connected.Next, the present invention will be described in detail with reference to the drawings of the embodiment of the present invention.0 Figure 1 shows the wFBl of the first embodiment of the present invention. 1 is a perspective view showing a printed circuit bar 1. The state before the cage is inserted into the ZIF connector. FIG. 1 shows the adhesive layer and the inventive concept is a ZIF connector 11, a printed circuit board inserted and connected thereto, a socket 2, and a printed circuit board for connecting between the ZIF device and the package and between the connector and the outside. A motherboard 3 with a circuit, a power source connector 4 for detection, a switch 5 for detecting power ON/OFF, a package 21C, a wire contact 6 that is narrower than the other contacts, and a package 21C. , an LED 8 that indicates whether the connection with the connector contact 7 is good or bad. Note that 9 indicates a guide rail tube into which the package 2 is inserted. In addition, the linear contact 6 is cut out in the cutout package 2, and the pattern l is cut out.
One pair of the ZIF connector contacts 7 on the motherboard 3 are connected to the detection power supply pattern 11 etched out on the motherboard 3.
Reference numeral 612 connected to is a detection power supply wiring.

In Fig. 1, the contact 7 of the ZIF connector l is in the open state. □ In this state, the tip of the package 2rt is
Push-out surface 1 of F connector 1. It is inserted until it hits llC. FIG. 2 is a perspective view showing a state in which the package 2 is inserted into the ZIF connector 1, the contacts 7 are closed, and the connection is completed. Therefore, switch 5t-ON as shown in the figure.
If so, the LED 8 will light up, and you can confirm that the contacts are in contact with each other in the correct position. However, the package 2 has not been inserted sufficiently, and the linear contact 6
If the connector contact 7 is closed with a deviation of 1/2 or more of the 0 width, the IC will not turn on the LED even if the switch 5 is turned on.
8 is ideal for detecting all bonding defects without turning on. At this time, Vcfi connector contact 7? Return to the state of opening,
After pushing the package 2 until the tip reaches the abutment point 13, close the connector contact 7◎
' Even if a poor connection is detected, there is a possibility that another contact wider than the linear contact 6 has been successfully connected, but the VCk of the present invention is especially suitable for connectors with a large number of connections. Determine the width of the linear contact 6 by taking into account all the manufacturing errors in the contact parts 6 and 6 in the case of
/(F) This guarantees the exact connection of all contacts.

FIG. 3 is a perspective view of a second embodiment of the present invention, showing a case where a general card edge connector is attached to the front end of the package in a direction perpendicular to the ZIF connector. C. Compared to the first embodiment, which does not require socket input, the second embodiment requires insertion force for the connector at the tip, and there is a possibility that the package will not be inserted all the way to the abutment surface of the ZIF connector. As a result, the effects of the present invention are further exhibited.

The present invention includes the installation surface of the linear contact on either the surface μ surface, the shank or both sides, and the installation position shall be determined as appropriate in consideration of the component arrangement and print pattern of each device. Also, Table 7rSr is not restricted to LEDs.

As explained above, the present invention has the effect of preventing bonding defects of other contacts by detecting the bonding state of the linear contact.

[Brief explanation of the drawing]

Fig. 1 is a configuration diagram showing one embodiment of the present invention, and Fig. 2 is a block diagram showing an embodiment of the present invention.
FIG. 3 is a perspective view of the printed circuit package after it has been inserted into a ZIF storage container in the illustrated embodiment. FIG. 3 is a perspective view of another embodiment of the present invention. In the figure, 1...ZIF connector, 2...
Printed circuit bar, cage, 3...motherboard, 4...power connector, 5...switch, 6...wire contact, 7... ...Connector contact, 8...LED. 9...Guide rail, 10...Print pattern, 11...Turtle, full term print pattern, 12...1! L source wiring, 13...Group/Abutting surface〇

Claims (1)

[Claims] Of the edge contacts of a printed circuit package used for all side entry type zero insertion force connectors, two that face each other on the IX or surface layer are made into narrow linear contacts that are similar to the other contacts L, and the package is attached to the zero insertion force connector. When inserted into a bonded state, the linear contact and its corresponding ZI
Closed sound detects that F connector contacts are joined (
(b) A device for detecting poor connection of card edge contacts, which includes a closed circuit VC power source and an indicator.