JPS5978597A - Method of fixing printed board - Google Patents
Method of fixing printed boardInfo
- Publication number
- JPS5978597A JPS5978597A JP18837682A JP18837682A JPS5978597A JP S5978597 A JPS5978597 A JP S5978597A JP 18837682 A JP18837682 A JP 18837682A JP 18837682 A JP18837682 A JP 18837682A JP S5978597 A JPS5978597 A JP S5978597A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- case
- fixing
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、各種の電子部品を取付けた複数枚のプリント
基板を気密性よく、小型にしてケース内に実装すること
のできるプリント基板の固定方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for fixing printed circuit boards, which allows a plurality of printed circuit boards on which various electronic components are attached to be mounted in a case in a compact and airtight manner. It is something.
従来例の構成とその問題点
プリント基板を複数枚に分割し、ケースから着脱自在と
する構造は、小型化及び生産工程の面で多くのメリット
を有しており、各種の機器に利用されている。そして、
従来はマザーボードをプリント基板を装着するケースの
底部に固定し、ケースの内側にガイドレールを取付け、
プリント基板をそのガイドレール溝の中をスライドさせ
てケースから脱着させていた。しかし、このようなプリ
ント基板の固定方法では、以下に述べるようないくつか
の問題点が発生していた。まず、ガイドレールの厚みが
通常片側で６〜９甜、両側にすると１０〜１６咽もある
ため、実装するプリント基板の面積が減少し、小型化を
妨げると同時に経済性が悪いものである。また、ケース
の外側からビスでガイドレールを取付ける場合は、ビス
の頭の高さだけプリント基板面積が減少するものである
。Conventional configuration and its problems The structure in which the printed circuit board is divided into multiple pieces and can be detached from the case has many advantages in terms of miniaturization and production processes, and is used in various devices. There is. and,
Conventionally, the motherboard was fixed to the bottom of the case where the printed circuit board was installed, and guide rails were installed inside the case.
The printed circuit board was removed from the case by sliding it through the guide rail groove. However, this method of fixing a printed circuit board has caused several problems as described below. First, since the guide rail is usually 6 to 9 mm thick on one side and 10 to 16 mm thick on both sides, the area of the printed circuit board on which it is mounted is reduced, which impedes miniaturization and is not economical. Furthermore, when attaching the guide rail from the outside of the case with screws, the printed circuit board area is reduced by the height of the screw head.
さらに、ガイドレールをケースに取付けるにはケースに
穴を開けてガイドレールの突出部を挿入する場合が多く
、隙間が発生して気密が得られないものである。このた
め例えば戸外やほこりの多い場所へ設置して気密性を要
する場合、上記構造のガイトレールは使用できなく、も
し使用しても気密性対策が複雑とならざるを得ないもの
である。Furthermore, in order to attach the guide rail to the case, it is often necessary to make a hole in the case and insert the protruding part of the guide rail, which creates a gap and makes it impossible to achieve airtightness. For this reason, for example, when installing outdoors or in a dusty place and requiring airtightness, the guide rail of the above structure cannot be used, and even if it is used, airtightness measures must be complicated.
そして、ガイトレールの材料費が高くつき、コスト的に
不利である。Moreover, the cost of materials for the guide rail is high, which is disadvantageous in terms of cost.
発明の目的
本発明は上記のような従来の欠点を除去すべくなされた
もので、ケーゝスの小型化とプリント基板の活用効率の
向上を図り、かつケースの気密性を確保し、しかもコス
ト的に有利なプリント基板の固定方法を提供することを
目的とする。Purpose of the Invention The present invention has been made in order to eliminate the above-mentioned drawbacks of the prior art, and aims to reduce the size of the case, improve the efficiency of using printed circuit boards, ensure the airtightness of the case, and reduce the cost. It is an object of the present invention to provide a method for fixing a printed circuit board that is advantageous in terms of advantages.
発明の構成
この目的を達成するために本発明のプリント基板の固定
方法は、ケース内側にプリント基板の厚み方向の両側に
位置するように線状の突起をプレ・加工により複数列設
け、複数枚メルト基板をリント基板に取付けたコネクタ
をケース底部のマザーボードコネクタに挿入接続し、プ
リント基板を固定する構成としたものである。この構成
によれば、突起の占有面積が少ないため、小型化とプリ
ント基板面積を拡大することができ、また突起部は気密
構造なので環境の厳しい場所での使用が可能となり、さ
らにケースと一体に突起を設けるのでコスト的に有利な
構成が実現できることとなる。Structure of the Invention In order to achieve this object, the method of fixing a printed circuit board of the present invention is to provide a plurality of rows of linear protrusions by pre-processing so as to be located on both sides of the printed circuit board in the thickness direction inside the case. The connector, in which the melt board is attached to the lint board, is inserted and connected to the motherboard connector at the bottom of the case to secure the printed board. According to this configuration, the area occupied by the protrusion is small, making it possible to downsize and expand the printed circuit board area.The protrusion has an airtight structure, so it can be used in harsh environments, and it can be integrated with the case. Since the protrusion is provided, a cost-effective configuration can be realized.
実施例の説明
以下、本発明の一実施例について図面を参照して説明す
る。まず、それぞれ多数の電子部品が塔載されたプリン
ト基板１よりも０．５霜程度のクリアランスを設けたケ
ース２の内側の基板端面位置に、ガイドレールの代りを
せる線状の突起３，４を適宜の距離を隔てて同一軸線上
にプレス加工により設けている。これらの線状突起３，
４はそれぞれプリント基板１の厚み方向のそれぞれ両側
に１つ位置するようにして複数列設けられており、かつ
その高さはケース２の平板材厚以上とされている。上記
ケース２の底部にはコネクタ７を複数個実装したマザ、
−ボード５が設置されている。上記各プリント基板１の
下端にはコネクタ６がそれぞれ把料けられており、この
プリン）・基板１はケース２の−Ｌ面開口部から線状突
起３，４間をガイドとして通し、コネクタ６をマザーボ
ートコオクタ７に挿入接続することによりケース２内に
装着され、突起３，４とマザーボードコネクタ７により
着脱自在に取付けられる３゜
ここで、線状の突起３，４のプレス加工方法は、気密を
保つ構造にするため段押し工程とし、例えばケース２の
厚さｆｚ １ 、６ｍｍとすると、１段押しで高さ１．
０ｍ＋ｎ、次に２段押しを最終値とすることにより高さ
１＋８ｍｍとして、突起個所を変形、亀裂から防止でき
る。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. First, linear protrusions 3 and 4, which serve as guide rails, are installed at the edge of the board inside the case 2, which has a clearance of about 0.5 degrees from the printed circuit board 1 on which a large number of electronic components are mounted. are provided on the same axis at an appropriate distance by press working. These linear protrusions 3,
4 are provided in a plurality of rows, one on each side of the printed circuit board 1 in the thickness direction, and the height thereof is greater than the thickness of the flat plate of the case 2. The bottom of the case 2 has a motherboard with a plurality of connectors 7 mounted thereon.
- Board 5 is installed. A connector 6 is held at the lower end of each printed circuit board 1, and the printed circuit board 1 is passed through the -L side opening of the case 2 between the linear protrusions 3 and 4 as a guide, and the connector 6 It is installed in the case 2 by inserting and connecting it to the motherboard connector 7, and is removably attached by the projections 3, 4 and the motherboard connector 7. In order to create a structure that maintains airtightness, the step pressing process is used. For example, if the thickness of the case 2 is fz 1 and 6 mm, the height will be 1.5 mm with one step pressing.
By setting the final value to 0m+n and then two-step pressing, the height is set to 1+8mm, which can prevent the protrusion from deforming and cracking.
寸だ、プリント基板１をケース２から抜くときは、寸ず
プリント基板１ｆ：上方向に引張ってコネクタ６をマザ
ーボードコネクタ７から抜いて後にプリント基板１を突
起３，４間をスムーズにスライドさせて引張ることによ
り抜くことができる。。When removing the printed circuit board 1 from the case 2, pull the printed circuit board 1f upward to remove the connector 6 from the motherboard connector 7, and then slide the printed circuit board 1 smoothly between the protrusions 3 and 4. It can be removed by pulling. .
次に、上記したプリント基板１の取付は固定ブ５法では
、外部から振動が加わった場合にプリント基板１が振動
する恐れがあるので、そのときには第３図に示すように
ケース２の上面部でコ゛ム板等のクッション材８を介し
て上蓋９によりプリント基板１の上端を押さえるように
する。このようにするとプリント基板１がしっかりと固
定さｉｔ、Ｊｋ動が加わっても問題がなくなり、特に振
動によるコネクタ６．７の接触不良やプリント基板１上
の電子部品に対する微振動対策として効果的である。Next, when mounting the printed circuit board 1 as described above using the fixing plate 5 method, there is a risk that the printed circuit board 1 will vibrate if vibration is applied from the outside, so in that case, as shown in FIG. Then, the upper end of the printed circuit board 1 is held down by the upper cover 9 via a cushioning material 8 such as a comb board. In this way, the printed circuit board 1 is securely fixed and there is no problem even if it and Jk movements are applied, and it is particularly effective as a countermeasure against poor contact of the connectors 6 and 7 due to vibration and microvibration of the electronic components on the printed circuit board 1. be.
発明の効果
以上のように構成された本発明のフ′リント基４反の固
定方法によれば、突起の占有面積力よ少ないため、小型
化を図ることができる。このためクーース内の取付空間
が限定されている場合、４寺に気密ヤギと小型化が要求
されるものにおいてフ゛１）ント基４反面積を拡大でき
ることとなる。また、このように基板面積が拡大できる
ことはそれだけの効果にとどまらず、全体をまとめる構
成面に」りいて余裕のある吸口か可能となり品質が向上
し、さらには構成士余裕かとれた場合でも拡大面積に相
当する新しい機能を盛込んだ製品を作ることか可能であ
る。Effects of the Invention According to the method of fixing the four flint bases of the present invention configured as described above, the area force occupied by the protrusions is smaller than that of the protrusions, so that miniaturization can be achieved. For this reason, when the installation space in the cooce is limited, the surface area of the four font bases can be expanded in cases where miniaturization and airtightness are required. In addition, being able to expand the board area in this way is not only effective, but also improves quality by making it possible to create a mouthpiece with plenty of room in the overall structure, and even expands even when there is no room for the construction. It is possible to create a product that incorporates new functions corresponding to its area.
そして、突起部は気密構造なので環境の厳しい場所でも
使用でき、用途の拡大か図れることとなる。Furthermore, since the protrusion has an airtight structure, it can be used even in places with harsh environments, and its uses can be expanded.
さらに、振動を発生する環境においてもプリント基板を
動かないように構成できるので、コネクタの接触不良防
止や電子部品の耐振特性等の品質面において効果を有し
ている。、捷だ、ガイトレールの役目をケースに設けた
突起がもつため、部品点数が減り経済的に有利なもので
ある。Furthermore, since the printed circuit board can be constructed so as not to move even in an environment where vibrations occur, it is effective in terms of quality such as prevention of poor contact of connectors and vibration resistance characteristics of electronic components. Since the protrusion provided on the case serves as a guide rail, the number of parts is reduced and it is economically advantageous.
第１図は本発明方法を説明するだめのケースにプリント
基板を挿入する状態を示す分解斜視図、洋２図は同要部
拡大上面図、第３図は同要部拡大側断面図である。
１・・・・・プリント基板、２・・・・・ケース、３．
４・・・・線状の突起、５・・・・・・マザーボード、
６・・・・・コネクタ、７・・・・・マザーボードコネ
クタ、８・・・・・・り・ソション材、９・・・・・上
蓋。
第１図
第２図Fig. 1 is an exploded perspective view showing a state in which a printed circuit board is inserted into a case for explaining the method of the present invention, Fig. 2 is an enlarged top view of the same main part, and Fig. 3 is an enlarged side sectional view of the same main part. . 1...Printed circuit board, 2...Case, 3.
4... Linear protrusion, 5... Motherboard,
6...Connector, 7...Motherboard connector, 8...Rip/Solution material, 9...Top lid. Figure 1 Figure 2
Claims (2)
を設けたケースの内側の基板端面位置に、上記プリント
基板の厚み方向の両側に位置するように線状の突起をプ
レス加工により複数列設け、複数枚のプリント基板をそ
れぞれ上記突起間を通して上記ケース内に挿入し、各プ
リント基板の下端に取伺けたコネクタを上記ケース底部
に位置するマザーボードコネクタに挿入接続し、プリン
ト基板を固定することを特徴とするプリント基板の固定
方法。(1) Multiple rows of linear protrusions are formed by press processing on both sides of the printed circuit board in the thickness direction at the edge of the board inside the case with clearance for the printed circuit board to be mounted. Each of the printed circuit boards is inserted into the case through the protrusions, and the connector at the bottom end of each printed circuit board is inserted and connected to the motherboard connector located at the bottom of the case, thereby fixing the printed circuit board. How to fix printed circuit boards.
用いて固定してなる特許請求の範囲第１項記載のプリン
ト基板の固定方法。(2) The method for fixing a printed circuit board according to claim 1, wherein the upper end of the printed circuit board is fixed using a top cover and a cushioning material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18837682A JPS5978597A (en) | 1982-10-27 | 1982-10-27 | Method of fixing printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18837682A JPS5978597A (en) | 1982-10-27 | 1982-10-27 | Method of fixing printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5978597A true JPS5978597A (en) | 1984-05-07 |
Family
ID=16222531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18837682A Pending JPS5978597A (en) | 1982-10-27 | 1982-10-27 | Method of fixing printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5978597A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6315097U (en) * | 1986-07-15 | 1988-02-01 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS495638B1 (en) * | 1969-08-13 | 1974-02-08 | ||
| JPS5428609U (en) * | 1977-07-27 | 1979-02-24 |
-
1982
- 1982-10-27 JP JP18837682A patent/JPS5978597A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS495638B1 (en) * | 1969-08-13 | 1974-02-08 | ||
| JPS5428609U (en) * | 1977-07-27 | 1979-02-24 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6315097U (en) * | 1986-07-15 | 1988-02-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6101093A (en) | Wrap around clip for an electronic cartridge | |
| JPS5978597A (en) | Method of fixing printed board | |
| KR101860017B1 (en) | Housing with printed circuit board assemble structure | |
| JPH07183058A (en) | Structure for preventing slip-off of sub-printed board | |
| JPH0311913Y2 (en) | ||
| JP2001168555A (en) | Method for fixing printed circuit board in electronic equipment | |
| JPH0539668Y2 (en) | ||
| JP2734439B2 (en) | Printed circuit board shield structure | |
| JP7094774B2 (en) | Insulation sheet mounting structure and insulation sheet | |
| JPH0648949Y2 (en) | Shield cover mounting structure | |
| JPH0440304Y2 (en) | ||
| JPS62144389A (en) | Cubic printed wiring board | |
| JPS58175690U (en) | Board fixing device | |
| JPH0727189U (en) | Structure of module housing | |
| JPS5855791Y2 (en) | Printed circuit board storage device | |
| JPH05235565A (en) | Circuit board mounting apparatus | |
| JPH075661Y2 (en) | Detachable printed circuit board fixing structure | |
| JPH0749830Y2 (en) | Unit connector | |
| JPH067281U (en) | Laminated structure of electronic device housing | |
| JPH04139796A (en) | Fixing method of printed board | |
| JPS62214698A (en) | Latching device of cover, metal fittings or the like | |
| JPH0438560Y2 (en) | ||
| JPH02219299A (en) | Printed board mounting structure | |
| JPS61287300A (en) | High frequency block | |
| JPS62109400A (en) | Attachment of circuit board |