JPS5978535A - Treating facility for many articles to be treated - Google Patents

Abstract

PURPOSE:To improve the workability of a treating device by reducing the loss or failure number of articles to be treated with many treating steps in a large quantity such as semiconductor wafers and managing the steps in high efficiency. CONSTITUTION:Warehouse 16 which has many boxes for temporarily containing and standing by articles to be treated such as semiconductor wafers or the like is provided. The articles are read out for their identification numbers for confirmation by a number reader 21 around the time when the articles are contained in the warehouse 16. The articles are then removed from the boxes, and distributed and treated in the treating blocks of the next steps such as a chemically treating block 9, a heat treating block 10, and a metal film depositing block 11. These steps are repeated to complete various treatments, and the delivery and conveyance of the articles thus treated and automatically performed by conveyors 17, 18 and 19. The reader 21, the conveyors and the treating units as well as the management of the treating steps for the articles to be treated are automatically controlled by a computer.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to processing equipment for processing objects such as semiconductor wafers, which are produced in large quantities and require many processing steps.

The manufacturing process of semiconductor wafers for semiconductor devices, especially ICs, LSIs, etc., consists of repeated heat treatments such as impurity diffusion and oxide film formation, and chemical and physical treatments such as photolithography, ion implantation, and metal film deposition. The total number of processing steps ranges from 100% to 2001%. Moreover,
These processes are not carried out in a so-called straight line by each processing device arranged in the order of the process, but are usually arranged in groups according to function, such as heat treatment equipment, photolithography equipment, etc. is processed while moving.

FIG. 1 is a plan view showing an example of a semiconductor wafer as an object to be processed. A cutout facet (la) is provided in a portion of the semiconductor wafer (1) to enable positioning. Semiconductor wafers (1) (in the case shown in Figure 2) (21 [24 or ij: 25 wafers) are stored in parallel at intervals 1, and are processed in units of f10 t for each processing step. .

Conventional semiconductor wafer processing equipment is 1/2 shown in Figure @2.
It looked like the Iaud diagram. In the figure, the blocks (3) to (8) are a collection of processing equipment Rft; A photosensitive processing block, (7) an etching processing block,
In (8), there is a test block f.

In the conventional processing equipment described above, in manufacturing ICs, LSIs, etc., the semiconductor wafer (1) is processed by repeatedly moving back and forth between the respective processing blocks several to several times. Furthermore, processing name No. 1 is performed in units of cassettes +21. Lot V, other lots and e each! % of the processing process, many lots processed in the same processing block can only be processed in the same processing block in the next process (8).For this reason, workers have to decide the next destination according to each lot. These instructions, transportation work, and work in each processing block amounted to a huge amount of work for each factory, and caused various problems. .

In other words, there is an increase in the number of work in progress due to incorrect work by workers, uneven work, a time lag between the completion of processing in a certain processing block and sending it to the next process processing block, and delays in the construction period due to this. There are problems such as contamination of wafers due to manual handling, and the fact that there are many lots, each requiring complicated processing steps, making process control difficult.

In order to deal with this, automation of transportation work, computer control of process management, division of individual processing units, etc. are being carried out as individual units, but unless the whole thing is automatic, The above problem has been resolved.

The purpose of this invention is to eliminate the above-mentioned drawbacks of the conventional equipment, reduce the number of scrapped products and the number of products in progress, and perform efficient process control to increase the operating rate of processing equipment. be. In other words, a storage with a large number of handlers is provided to temporarily store and wait for the items to be processed, and before and after storing the items in the storage, the identification numbers are read by a number reader and the items are read by a number reader. The products are fixed, stored in a designated place, taken out from the place, delivered to the second processing block, processed, and repeated to complete various processes. A computer-based control device controls the number reading #) device, the transportation device, and each processing device, as well as the processing process management of each processed item.
To provide processing equipment for a large number of items to be processed, in which fully automated processing is performed without touching the items to be processed.

Hereinafter, a processing equipment according to an embodiment of the present invention for processing semiconductor wafers will be explained with reference to FIGS. 4 to 7.

FIG. 4 is a schematic plan view of semiconductor wafer processing equipment. (9) is a chemical processing block that processes wafer (1) prior to heat treatment, +101 is a heat treatment block for impurity diffusion, oxide film formation, etc., aυ is a metal film deposition processing block for electrode formation, ('12 is an impurity injection processing block,
03ij Resist photosensitive processing block, such as resist coating, photosensitivity, etc.; 7j4) Etching processing block, which selectively etches the oxide film, gold hole layer, etc.; Indicates a test block.

αG#-1, a storage for storing raw conductor wafers (]) and cassettes (2) (1 shown in Figure 2). A stacker crane (A) is installed between the two. (jl'l is a lot number reading device that takes the barcode (no identification number) nπ engraved on the wafer + Il,
The famous sleds are placed in the mountain area. (A) is a barcode engraving device that engraves a barcode on a new wafer (11) brought into this automated processing facility.

In order to deliver all the cassettes (2) to each Yabukan and each processing block arranged as described above, the first transport path a and the second
A conveyance path (to) has been laid. There are a plurality of transport vehicles on transport path 0, which forms a circulation path. 1 is distributed and travels in the same direction, and one conveyance vehicle 01 is distributed on the conveyance path that forms a straight path. Stations are provided at the entrance and exit of each device and each processing block, and cassettes (2) are transferred to and from the transport vehicle 01. (To) is a central control unit equipped with a computer, which controls each processing unit of each processing block (9) to 0υ (not shown), each transport vehicle C11% rod number reading device D,
We perform all equipment control and process management, such as our own wJ warehouse consisting of barcode engraving R@, storage aQ and stacker crane (A), and process information centrally.

Next, each main part of the semiconductor wafer processing equipment will be explained in detail. FIG. 5 shows an additional perspective view of the automated warehouse section that takes out the cassettes (2) to storage ◇G. The storage 01 is provided with 70 valve parts (C), and each valve part (C) Vc can store up to four cassettes (2) in the depth direction. (1) is a clean air supply device that supplies clean air into each valve part (to),
) are kept clean. The stacker crane cA grasps the cassette (2) and moves it on the running rail between the no station (c) installed at both ends, the lot number reader Q]) and the valve part (c) of the storage shed 00, and Move the cassette (2) to position 0 lot number reader 21) Place the VC on top, and place the 4 cassettes (4 cassettes) 1)
21 t, the valve portions (c) instructed by the central controller vJ1/C are each injected with No. 1. The operation for storing is as follows. The stacker crane (e) moves to a position to the side of the lot number reader Q1). Next, the fork (a) advances onto the lot number reader Q1) and
+21 skeins) at the same time. Next, the fork holder is moved back and returned to its original position, and each cassette (2) is placed on the conveyor holder. The stacker crane crane vertically moves the valve part (C) position of the designated row in the storage warehouse OQ (moves K and onto the conveyor) to the valve part (C) position of the designated stage.

on the conveyor) on the cassette (phantom storage an VC)
−i portion is transferred to 9 squares (
(to). Next, in the same manner, by moving the stacker crane and moving the conveyor (4) up and down, the next cassette (2) on the conveyor (G) is placed in front of the valve part (to) position of the specified row and stage. It is stored in the designated valve part (A) by the advance movement of the conveyor group. In this way, each cassette (2
1 is stored in the valve part (a) at the position specified by h. Four cassettes (2) have the same next processing step and the same valve part (with specified column and stage).
b) If all four are stored in the VC. On the other hand, when removing the cassette +21 stored in the valve part (c),
Take out four pieces at the same time with a fork. This is because all four are processed at the same time.

Lot number reading device l2I installed next to storage QG
J is shown in a perspective view of FIG. 6 VC. This lot number reader Ql) is used to store a large number of wafers (1) with barcodes formed with grooves formed using a laser processing surface (l shown in the figure) into a cassette (only a portion of which is shown by a chain line in the figure). 2) It is possible to read the barcode while the device is stored in the device. ■ is an optical sensor consisting of a lighting device, an optical lens, and an image sensor, which is moved back and forth by a pulse motor of 0υV.
These two optical sensors (31) are in charge of two cassettes (2), which are moved horizontally by an induction motor. By (b), the units can be moved up and down independently.

(g) is a pair of Teflon rods rotatably supported via these cassette mounting tables G31vc bearings (h, not shown), which are rotated by a conductive N# machine (not shown). When the cassette (2) is placed on the cassette mounting table (2), each wafer 111 in the cassette hits the pair of Teflon rods (c) and is pushed up, rotating in an upright position. When the wafer (1) has a facet (la) with a flat part cut out on its outer periphery and reaches a pair of Teflon rods (g), it loses contact with the Teflon rods (to) and the wafer +
11 stops rotating and positioning is performed. (to) has no L engraving, and is rotatably supported by the support bin (not shown) Vc at the middle part of the cassette mounting table (to), and is pressed by a lever, and the tip is by a roller (c). , the OI is attached and rotated backward by the tension spring @, so that the cassette (2) on the cassette mounting table is pressed through the roller (to).The air cylinder (c) (to the cassette mounting table) rises, 4-ra (η is the fixed portrait plate θ1
The lever (to) rotates forward and the roller (7) separates from the cassette (2) ◇ Normally, the cassette mounting table (to) rises and the roller (
) is away from the cassette (2) position. In this state, when the stacker crane cAVc and the cassette set (2) are placed on the empty cassette mounting table (G),
The cassette mounting table (G) is lowered by the air cylinder ■, and the cassette (2) is pressed and fixed by the roller (C).
The Teflon rod (c) rotates for a certain period of time. The orientation of a large number of wafers (11) in the cassette (2) is determined by this ilc, and then the optical sensor (7) is moved by the pulse motor eDVC to read the barcode of wafer +11.

FIG. 7 shows a perspective view of the transport vehicle aI and the station (c) which constitute the transport device. The conveyance vehicle head accommodates up to four cassettes (2), has a traveling mechanism itself, a cassette delivery mechanism with the station shelf (2), and travels while being guided to the conveyance path α side. θυ is the transport vehicle QiK
It is a container that can simultaneously transfer and load 214 cassettes from inside the station shelf @4vc, or receive and store them from the station shelf @→, and is provided with forks 02tl- that move forward and backward. This container 01) is guided by the vertical movement guide body TL, and each station shelf θ→ position &
Move up and down. Station (c) has a 3-tier station shelf → and this station shelf θ Yukara cassette t2)? A cassette 1 and a cassette 21' (on the robot placed on the ff station shelf Q) are arranged to be taken out and processed in each processing block. (to the robot) has a chuck part θη that fully grips the cassette (2),
There is a robot main body part θQ, which has a built-in mechanism for moving the chuck part up and down and back and forth.

θ → A small conveyor is guided to the guide table 0 scratches and is moved between the station shelf ■ and the processing equipment in the processing block) t2
It is a t-sized one that is transported in units of 11 pieces. This small carrier (9
) simply runs with a cassette +21 on it.
At the exit of each processing device, there is a mechanism (not shown) for loading and unloading cassettes onto and from a 21ft small transport vehicle.

The operation of the processing equipment of one embodiment configured as described above will be explained with reference to FIGS. 4 to 7.

Newly introduced 1. Wafer III in cassette (2)
(7) Lot t", barcode' engraved MK (a)
A lot number is engraved onto the wafer (1) by the wafer (1), and is registered in the central control unit (c).The lot number reading device (7!)
After applying 1), it is stored p¥-au vc once. The allocation of the valve part (c) of the storage iI'J warehouse θG is the 9 central control unit that performs process control. Collect blocks with the same processing block. In this way, once the batch 1: (c) [IIM Ml a 7 or lot is assembled into the central control system f (c),
The optimum lot is delivered according to the process plan, and the lot number is confirmed using the lot number reading device (jl).If there is no mistake, the transfer vehicle 09V is sent to the station CJ of the target processing block. (-A!B1.Single conductor 1
-- C (The first treatment in step 11 is usually a chemical treatment in which dirt is removed using chemicals υ, which is first sent to the chemical treatment block (9).This chemical treatment block 191 VCN%
Similarly, each of the other processing blocks has several to twenty processing devices 011. (not shown) is provided,
In addition, each machine can process a wide variety of lots, batches, and lots with different processing specifications. Note that each processing device has a general-purpose function, is electrically connected to the central control device H, and performs processing corresponding to each lot. Furthermore, the handling of cassettes (2) within each processing block is automatically controlled by the central control unit. The cassette (2) sent to the chemical processing block (9) is
Move to the exit station (as shown by the arrow in the figure).
C), and then transported to the heat treatment block (lO) where it is placed in the next treatment block. This heat treatment must be carried out immediately after the above chemical treatment is completed, and when the rice is transported to the chemical treatment block (9), the empty state of the heat treatment block 110) must be checked in advance by the central controller (c). Make a good prediction. After the treatment in the heat treatment block (101) is completed, do not directly deliver to the next treatment block, press the lot number reading button t (Jl) again to confirm all lot numbers, and classify each lot into the next process treatment block. Then, move the cassette +21t resist photosensitive processing block (
13, the lot number is confirmed using the same (lot number reading 1tan) and delivered to station 12.J of the resist photosensitive processing block a3 using the transport path α force.

The resist photosensitive processing block 0.1 is delivered along four lines while adjusting the VC so that each line operates equally. In this resist photosensitive processing block 03, as shown in FIG. 4, the lot advances in the direction of the arrow and is transported to the etching processing block (14) using the transport path Oa. As with the relationship with the upper heat treatment block (10), the process is usually completed in a series and is processed without any intervention.In exceptional cases, other processes are performed during this period. is the transport path Q
It is returned to the storage <In using al.

When the processing in the etching processing block Q4) is completed,
Lot number reading device Qυf: After passing, the lot number is stored in the designated valve part (c) of the storage uO for each next process. Like this 1/'
c, sequential processing 'f: 1,194 return, barcode engraving device t (a) is installed, and the lever to finish all the processing is completed.

Chemical treatment block (9) and heat treatment block 1101N
5. Cassette t between processing blocks except between resist photosensitive processing block 03 and etching processing block 04)
When receiving the EL, read the lot number 1■n and the storage 00.
In particular, the process afi+ of one embodiment of the present invention involves a large number of semiconductor wafers, which involve a large number of items and a large number of repetitive operations. It is extremely effective to prevent processing mistakes and deliver the right lot at the right time and with the right 'fxR' to each processing block, making process control much easier and greatly reducing overall work-in-process silicon. can contribute.

Since the spinning and each process 5Iem are electrically connected to the central control device (c) and automated, work errors and processing unevenness are reduced 4, and the yield is greatly improved.

In addition, the above real 2II! In example i, all process management and equipment control are performed centrally by the central control unit R (c), but there is a provision to stop the central control unit, reduce the complexity of control, etc., and install multiple control units. It may also be controlled in a distributed manner.

In addition, in the above embodiment, a small transport tun (→) is used to transport the cassette (2) between the station (to) and the processing tomb, and a robot for receiving and receiving the cassette (21) is used at the exit of each processing device.
However, a mobile robot having both of these functions may be provided to transfer the processing device 1 to the station (c).

Furthermore, although the above embodiment describes the case of a semiconductor wafer (1) as a multi-item product that can be processed, it can also be applied to other processed products, such as mechanical parts, and can be applied to various machining processes. It can also be applied as a single investment, such as for processing.

At the start of this process, as explained above, all of the items to be disposed of are temporarily stored and a large number of needle parts are stored in a storage facility T'' for the next processing time.
The identification number is read by a number reading device before and after being stored in the storage cabinet, and the identification number is read and memorized by a number reading device. The products are delivered to the processing equipment in the process and then processed.This process is repeated to complete each process.The delivery and transportation of the processed items is automatically carried out by the transporting equipment, and the number reading equipment, transporting equipment, and each processing equipment control and processing process management of each processed item are performed by a computer-based control device 9LVC1.
ξ, many processed items are rejected (efficiency (processed) 1
4. Reduces work-in-progress and makes processing process management easier.
The operating rate of each processing device is also determined. This effect is particularly noticeable when processing a large number of products, such as semiconductor wafers, which require multiple processing steps and are multipolar.

[Brief explanation of the drawing]

FIG. 1 is a plan view of a semiconductor wafer, FIG. 2 is a perspective view of a cassette for storing all the semiconductor wafers shown in FIG. 1, and FIG. 3 is a block diagram showing the layout of conventional semiconductor wafer processing equipment. FIG. 4 is a schematic plan view showing the entire structure of semiconductor wafer processing equipment according to an embodiment of the present invention;
FIG. 5 is a perspective view of an automatic warehouse section having the storage warehouse shown in FIG. 4;
Figure 6 is a perspective view of the lot number reading device shown in Figure 5 of Chapter 5;
This figure is a perspective view of the conveyance vehicle and the station section of FIG. 4. ), +91...Chemical processing block, (10)...Heat treatment block, 0υ...Metal film deposition processing block, az
... Ion implantation processing block, θ'3 ... Resinut exposure processing block, (14) ... Etching processing block, 0, ... Inspection block, (I... Storage, (
(C)...transport path, α9...transport vehicle, t2D
+...Statistics 1/-n, <21)...Lot number reading Tfy, υ device, @...Barcode engraving device, (
C)...Station, CA...Central ttjlJ control device, (C)...Needle section, (B)...Fork, (7)
...Optical sensor, θυ...Container, (6)...Fork, (Foundation)...Vertical movement guide, 0◇...Station shelf, C...Robot, 0η...Chuck section, 0
→...It is a small transport vehicle. Note that the same reference numerals in the figures indicate the same or equivalent parts. Agent Shin Tameno (1 other person) Commissioner of the Japan Patent Office 1. Display of incident Patent application No. 1-190636 2.
Name of the invention Processing equipment for multiple products to be processed 3, Relationship to the case of the letter of amendment Patent applicant address 2-chome Marunouchi [12-3, Chiyoda-ku, Tokyo]
Name (601,) Mitsubishi Electric Corporation Representative Hitoshi Katayama Part 5, 4 ``Detailed Description of the Invention'' of the specification to be amended. 6. Contents of supplement (1) Meisho 1 Homare, page 7, line 14, page 8, degree 9
~ Correct 10 lines of 10 lines to ``all 10 lines'' 0 (2)
"70" on page 8, line 17 of the specification is corrected to "many". (3) Correct "Conduction motor" in the 5th line of page 11 of the 1414 Specification to "@Conduction motor". (4) Specification page 11 No. 11. -12 line "Contact or separation with Teflon □□□, delete -1.

Claims (1)

[Scope of Claims] +11 A number reading device for reading an identification number given to a workpiece is provided with a number of needle parts partitioned into a plurality of shelves, and the workpiece whose identification number has been read is placed in a predetermined position. There is a storage where the item to be processed is temporarily stored in the needle part and waited for the next process, and the item to be processed is stored in the needle part from the number reading device. A conveyance device is used to confirm the identification number by checking the reading device, and processing conditions are set by control commands.
Take it from the needle above and check the identification number.
Multiple types of processing equipment process the processed items, the processed items are transferred from the number reading device to the processing equipment in the next process, and the processed items are transferred between the processing equipment related to the processing. It has a conveyor device and a computer that transfers the FC processed product after the processing of the process is completed to the above-mentioned number reading device and confirms the identification number, and includes a computer and the above-mentioned processing devices, number reading device, and transportation. A processing facility for processing a large number of items to be processed, which is equipped with a control device that controls tools and conveyance devices, and registers identification numbers of each of the items to be processed to manage the process. (2) The equipment for processing a large number of items to be processed as set forth in claim 1, wherein the transportation device is a stacker crane having a forklift. (3) The transport device has a built-in mechanism for loading and unloading the items to be processed, and is equipped with a transport vehicle that runs along the transport path.
A processing equipment for processing multiple objects to be processed according to claim 1 or 2, characterized in that: (4) Rather than storing multiple items to be processed in the needle section of the storage compartment for each of the same processing process group, and waiting for storage again after each processing process, vc 1. A processing equipment for processing a large number of items to be processed as set forth in any one of claims 1 to 3, characterized by an octopus seven. (5) The product to be processed consists of eight semiconductor wafers, and a large number of them are stored in a cassette to make 10 pieces, and the processing is performed in units of lots. Processing equipment for a large number of items to be processed as described in Section 4. +61 W Several types of processing equipment are used for chemical processing blocks, heat processing blocks, metal vapor deposition processing blocks, ion implantation processing blocks, resist photosensitive processing blocks, and etching processing blocks. A processing equipment for processing a large number of items to be processed as set forth in claim 4.