JPS5976662A - Jig for arraying and supporting object to be soldered - Google Patents
Jig for arraying and supporting object to be solderedInfo
- Publication number
- JPS5976662A JPS5976662A JP18634982A JP18634982A JPS5976662A JP S5976662 A JPS5976662 A JP S5976662A JP 18634982 A JP18634982 A JP 18634982A JP 18634982 A JP18634982 A JP 18634982A JP S5976662 A JPS5976662 A JP S5976662A
- Authority
- JP
- Japan
- Prior art keywords
- soldered
- support rods
- frame
- fixed
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は、被はんだ付は物たとえばＩＣのリードフレー
ムにはんだ付けを行うにあたって、多数のＩＣを整列支
持する治具に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a jig for aligning and supporting a large number of ICs when soldering to an object to be soldered, such as an IC lead frame.
本発明の出願人は、先に、特願昭５６−１７８６７３号
の出願忙おいて、ＩＣのリードフレームにはんだ付けを
行う忙あたって多数のＩＣを整列支持できる治具を提供
している。そのものは、ＩＣ本体の下側を支持する２本
１組の下側支持棒が枠体に固定されているのに対して、
ＩＣ本体の上側を押える２本１組の上側支持棒は、枠体
の挿入口に設けたゲート体に一端を止着してこのゲート
体ととも九一端を上下動できるようにし、ＩＣを上側お
よび下側の支持棒間忙挿入するときは、この上側支持棒
の挿入口側端を上方に開いてＩＣの挿不を容易忙してい
るが、このようにした場合は、かえって上側支持棒と下
側支持棒との間の間隔が全長にわたって開きすぎて、Ｉ
Ｃが上１ｊｊｌ支持棒と下側支持棒との間から外れやす
い問題がある。The applicant of the present invention, while filing Japanese Patent Application No. 56-178673, previously provided a jig capable of aligning and supporting a large number of ICs during soldering to IC lead frames. The two lower support rods that support the lower side of the IC body are fixed to the frame.
One set of two upper support rods that hold down the upper side of the IC body is fixed at one end to a gate body provided in the insertion opening of the frame body, so that the one end can move up and down with this gate body, and the IC is held in place. When inserting the IC between the upper and lower support rods, the end of the upper support rod on the insertion opening side is opened upward to facilitate the insertion and removal of the IC. and the lower support rod are too wide over the entire length,
There is a problem that C easily comes off from between the upper 1jjl support rod and the lower support rod.
本発明は、枠体間に設けられた複数本の平行の支持棒に
よって被はんだ付は物本体の下１１０および上側を整列
支持するものにおいて、被はんだ付は物を支持棒間に挿
入するときの被はんだ付は物の脱落を防止するのに有効
な治具を提供しようとするものである。The present invention aligns and supports the lower part 110 and the upper side of an object to be soldered by a plurality of parallel support rods provided between frames, and when the object to be soldered is inserted between the support rods. The purpose of soldering is to provide a jig that is effective in preventing objects from falling off.
本発明の治具の構成は、はんだ付はラインに沿って搬送
される枠体の一側部に被はんだ付は物挿入用の挿入口を
穿設し、この挿入口の下側部および上側部に被はんだ付
は物本体の下ｆＡｌｌおよび１狽）Ｋ位置する複数本の
平行Ｑ）支持棒の一端を固定し、この各支持棒の他端を
枠体σ）他側部に固定し、上記枠体の一側部の外面に上
記挿入口を開閉するゲート体を上下動自在に設けたこと
を特徴とするものである。The structure of the jig of the present invention is such that an insertion opening for inserting the object to be soldered is formed on one side of a frame body that is transported along a soldering line, and the lower and upper sides of this insertion opening are The parts to be soldered are fixed at one end of a plurality of parallel Q) support rods located below the body of the object, and the other end of each of these support rods is fixed to the other side of the frame σ). The present invention is characterized in that a gate body for opening and closing the insertion port is provided on the outer surface of one side of the frame so as to be movable up and down.
そうして、この泊れに被はんだ（＝Ｊ’ Ｈ−物として
のＩＣを装Ｓするときは、枠体をを工んだ付は時とをま
逆向きにしてゲート体を自重によりスライドさせて挿入
口を開くとともに、ＩＣの）でツケージをその内部のＩ
Ｃのリードフレームカモ上方を向くようにして挿入口に
連通させ、ＩＣ本体σ）背面をｉ＜ツケージ内等を安定
的にスライドさせて枠体の挿入口から全て固定の支持棒
間に挿入し、枠体を正転復帰させることによりゲート体
を自重でスライドさせて挿入口を閉じる。Then, when mounting an IC to be soldered (=J'H) on this board, the frame is turned in the opposite direction and the gate body is slid by its own weight. to open the insertion slot, and insert the IC inside the cage with
Connect the lead frame C to the insertion slot with the lead frame facing upward, and slide the back side of the IC body (σ) stably inside the cage etc. and insert it between the support rods that are all fixed through the insertion slot of the frame. By returning the frame to normal rotation, the gate body slides under its own weight and the insertion port is closed.
以下、本発明を図面に示す実施例を参照して詳細に陀明
する。Hereinafter, the present invention will be explained in detail with reference to embodiments shown in the drawings.
第１図に示すように、はんだ付はラインに沿って搬送さ
れる枠体（１）の−側部に被けん〜だ付は物挿入用の挿
入口（２）を所定間隔ごとに複数穿設する。As shown in Figure 1, the soldering process involves drilling a plurality of insertion holes (2) at predetermined intervals on the negative side of the frame body (1) that is transported along the line. Set up
またこの各挿入口（２）の下側部および上側部に５ｊ’
２図に示すように、被はんだ付は物としてのＩＣＷの本
体の下側および上側忙位置する計６本の平行の支持棒と
しての丸棒鋼線（３１（４１の一端を固定し、この各鋼
線＋３１ ＋４１の他端を枠体（１）の他側部に固定す
る。枠体（１）はチタン、鋼線＋３１ ＋４１はタング
ステンによって形成する。In addition, there are 5j' on the lower and upper sides of each insertion port (2).
As shown in Figure 2, the soldering target is a total of six round bar steel wires (31 (with one end of 41 fixed, The other end of the steel wires +31 and +41 is fixed to the other side of the frame (1).The frame (1) is made of titanium, and the steel wires +31 and +41 are made of tungsten.
＃＃４４． 、−− 、−− − −−また第
１図に示すように、枠体（１）の−側部忙一対の長大（
５）を上下方向に穿設し、この一対の長大（５）に内側
から段つきねじ（６）を上下動自在に嵌入して先端部を
外部圧突出させ、この両側の段つきねど（６）の先端部
に形成したねじ溝（７）釦、外側から凹形板状のゲート
体（８）の両側部の孔（９）を嵌合して、とのねじ溝（
７）に外側から螺合したナツト（圃によりゲート体（８
）を段つきねじ（６）の径大部（Ｉｌｌの端面に締付け
、この径大部旧）は長穴（５）内を自在にスライドでき
るようＫする。このようにして、枠体（１）の−側部の
外面に各挿入口（２）を同時に開閉するゲート体（８）
を上下動自在に設ける。第１図においてａ２は、はんだ
何けうインに沿って移動する搬送ホルダ（図示せず）釦
上方から係合するための折曲部であり、ａ３は把持部で
ある。##44. , -- , -- -- -- Also, as shown in FIG.
5) are bored in the vertical direction, and the stepped screws (6) are inserted into the pair of elongated screws (5) from the inside so that they can move up and down, so that the tips project outwardly. The screw groove (7) formed at the tip of the button (6) is fitted from the outside into the holes (9) on both sides of the concave plate-shaped gate body (8), and the screw groove (7) formed at the tip of the button is fitted from the outside.
7) from the outside (depending on the field, the gate body (8)
) to the end face of the large diameter part (Ill) of the stepped screw (6), and the large diameter part old is K so that it can freely slide within the elongated hole (5). In this way, the gate body (8) opens and closes each insertion port (2) at the same time on the outer surface of the negative side of the frame body (1).
is installed so that it can be moved up and down. In FIG. 1, a2 is a bending part for engaging from above a button of a transport holder (not shown) that moves along the solder insert, and a3 is a gripping part.
そうして、第３図に示すよう釦、との治具を反転して傾
動台（１４１の上面に固定すると、上記ゲート体（８）
は自重で下方にスライドして各挿入口（２）を完全に開
口する。この各挿入口（２）は、傾動台（１４）上の支
台０５１に固定された断面凹状の案内体（１６）を介し
て、この支台（１９上に固定された複数列のＩＣパッケ
ージ［Ｆ］にそれぞれ対向している。Then, as shown in Figure 3, when the jig with the button is inverted and fixed on the top surface of the tilting table (141), the gate body (8)
slides downward under its own weight to completely open each insertion port (2). Each of the insertion ports (2) is connected to a plurality of rows of IC packages fixed on this support (19) through a guide body (16) having a concave cross section fixed to the support 051 on the tilting table (14). They each face [F].
このＩＣパッケージψ）は、才４図に示すように、はぼ
■形断面の長尺容器で、内部に多数のＩＣ％Ｖ）を直列
的に収容し、一端の開口から外部に取出せるようになっ
ている。内部のＩＣ％Ｑは、そのリードフレーム（１）
を上方に向けて突出した姿勢でパッケージ［Ｆ］ごと支
台（１９上にセットされる。As shown in Fig. 4, this IC package ψ) is a long container with a rectangular cross section, and contains a large number of IC%V) in series, and can be taken out from an opening at one end. It has become. Internal IC%Q is its lead frame (1)
The package [F] is set on the support stand (19) with the package [F] pointing upward.
第３図に戻って、傾動台０４）を反時計方向に回動して
左側部が下降するように傾斜させると、各列のパッケー
ジ助内の各ＩＣ（ｆｉは、パッケージ■の底面をスライ
ドし、案内体（ｉｅ上をスライドし、各挿入口（２）か
ら各組の６本の固定鋼線＋３）（４）間に入り、鋼ｍ（
４）上をスライドして、第５図に示すように、鋼線１３
＋ （４１間に密に装填される。その際、ＩＣ［は、そ
の本体背面（α）を下にしてパッケージ（Ｐ）内、案内
体ａｅ上および鋼線（４）上を背面全体で安定的にスラ
イドするので、リードフレーム（Ａ’ｌを下眞してスラ
イドする場合に比べ、横ぶれが少なく、パッケージ■か
ら鋼線＋３１ ｆ４１にわたる受渡しもスムーズに行え
、鋼線（３１（４１間への挿入時の姿勢をパッケージ■
内と同様に確実に保持でき、リードフレーム（／１の形
状精度に左右されて銅線＋３＋ ！４１間への挿入に支
障をきたすようなおそれがない。なお案内体θｅの上方
にはＩＣ（ｆｉの本体腹面に対向してＩＣ１’ｌの浮上
りを防止するガイド部材ａ７）を設けておく。Returning to Fig. 3, when the tilting table 04) is rotated counterclockwise and the left side is tilted downward, each IC (fi is the bottom surface of the package Then, slide it on the guide body (ie, enter between each set of six fixed steel wires + 3) (4) from each insertion port (2), and insert the steel wire
4) Slide the top of the steel wire 13 as shown in Figure 5.
+ (In this case, the IC [is loaded tightly between Since the lead frame (A'l) slides vertically, there is less lateral wobbling compared to when sliding with the lead frame (A'l facing down), and the transfer from the package (■) to the steel wire +31 f41 can be performed smoothly. ■Package posture when inserting
The IC ( A guide member a7) is provided opposite to the ventral surface of the main body of fi to prevent the IC1'l from floating up.
最後に、第２図に示すように、上記治具を元の姿勢に戻
すと、ゲート体（８）は自重で下方にスライドして各挿
入口（２）の上部を閉じる。これによって鋼線１３１
（４１間のＩＣへ勢は外部に抜出ることがない。Finally, as shown in FIG. 2, when the jig is returned to its original position, the gate body (8) slides downward under its own weight and closes the upper part of each insertion port (2). As a result, the steel wire 131
(Those who enter the IC between 41 and 41 do not exit outside.
本発明によれば、被はんだ付は物本体を支持する下側お
よび上１１すのすべての支持棒を枠体間に平行釦固定し
、この支持棒間の一端の挿入口を開閉するゲート体を、
支持棒とは関係なく枠体の外面に上下動自在に設けたか
ら、いったん挿入口から枠体内に挿入された被はんだ付
は物は、一端から他端にわたって被はんだ付は物本体の
寸法に適合する一定間隔の支持棒間を安定的にスライド
して、支持棒間から脱落するおそれがない。またゲート
体のみを上下動自在に般けたから、枠体の反転によりゲ
ート体のみを自重で開いて被はんだ付は物を支持棒間に
挿入するとともに、この枠体を正転復帰させることによ
りゲート体のみを自重で閉じて被はんだ付は物の抜出し
を防止でき、特にゲート体を操作する必要がないととも
に、支持棒をゲート体とともに可動的に設けた場合のよ
うに治具反転厳禁の使用制限を受けることがなく、治具
を反転載支するとともＫｍはんだ付は物本体の背面を下
にして支持棒間に安定的にスライド挿入する方法をこの
治具によって行うことができる。According to the present invention, all of the lower and upper 11 support rods that support the object body are fixed between the frames with parallel buttons, and the gate body that opens and closes the insertion opening at one end between the support rods is soldered. of,
Since it is provided on the outer surface of the frame so that it can move up and down independently of the support rod, once the object to be soldered is inserted into the frame through the insertion port, the soldering object from one end to the other will conform to the dimensions of the object itself. It slides stably between support rods spaced at regular intervals, and there is no risk of it falling out from between the support rods. In addition, since only the gate body can be moved up and down, by reversing the frame, only the gate body can be opened by its own weight, and the object to be soldered can be inserted between the support rods, and the frame can be returned to normal rotation. By closing only the gate body under its own weight, soldering objects can be prevented from being pulled out, and there is no need to operate the gate body, and the jig is strictly prohibited from reversing, as in the case where the support rod is movable together with the gate body. There are no restrictions on use, and even if the jig is inverted and supported, Km soldering can be performed using this jig by stably sliding it between the support rods with the back side of the object facing down.
第１図は本発明の治具の一実施例を示す斜視図、第２図
はその要部の正面図、第３図はこの治具へのＩＣの挿入
方法を示す断面図、′ｙ１１４図はＩＣバツケージを示
す斜視図、′：４Ｐ５図は支持棒間に挿入されたＩＣの
斜視図である。
（１）嗜・枠体、（２）・・挿入口、 ＋３１（４）−
春支持棒としての鋼線、（８）・・ゲート体、帖乃・１
被はんだ付は物としてのＩＣ０Fig. 1 is a perspective view showing one embodiment of the jig of the present invention, Fig. 2 is a front view of its main parts, Fig. 3 is a sectional view showing the method of inserting an IC into this jig, and Fig. 114. is a perspective view showing the IC bagage, and Figure 4P5 is a perspective view of the IC inserted between the support rods. (1) Frame, (2) Insertion port, +31 (4) -
Steel wire as spring support rod, (8)...Gate body, Chono 1
The soldered object is IC0 as a thing.
Claims (1)
部に被はんだ付は物挿入用の挿入口を穿殺し、この挿入
口の下側部および上側部に被はんだ付は物本体の下側お
よび上１１１１に位置する複数本の平行の支持棒の一端
を固定し、この各支持棒の他端を枠体の他側部に固定し
、上記枠体の一側部の外面に上記挿入口を開ｑ１するゲ
ート体を上下動自在に設けたことを特徴とする被はんだ
付は物整列支持用の治具。(1) For soldering, an insertion hole for inserting the object to be soldered is punched on one side of the frame that is transported along the line, and the object to be soldered is inserted into the lower and upper sides of this insertion hole. One end of a plurality of parallel support rods located on the lower side and the upper part 1111 of the main body is fixed, the other end of each of these support rods is fixed to the other side of the frame, and the outer surface of one side of the frame is fixed. A jig for aligning and supporting objects to be soldered, characterized in that a gate body for opening the insertion opening q1 is provided to be movable up and down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18634982A JPS5976662A (en) | 1982-10-22 | 1982-10-22 | Jig for arraying and supporting object to be soldered |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18634982A JPS5976662A (en) | 1982-10-22 | 1982-10-22 | Jig for arraying and supporting object to be soldered |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5976662A true JPS5976662A (en) | 1984-05-01 |
| JPS612468B2 JPS612468B2 (en) | 1986-01-24 |
Family
ID=16186796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18634982A Granted JPS5976662A (en) | 1982-10-22 | 1982-10-22 | Jig for arraying and supporting object to be soldered |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5976662A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0171257A2 (en) * | 1984-07-30 | 1986-02-12 | Sun Industrial Coatings Private Ltd. | Apparatus for holding electrical or electronic components during the application of solder |
| JPS62108564A (en) * | 1985-10-31 | 1987-05-19 | アメリカン・マイクロシステムズ・インコ−ポレイテツド | Solder covering of electric lead wire |
| JPS6411067A (en) * | 1987-07-06 | 1989-01-13 | Tamura Seisakusho Kk | Jig for lining up and supporting object to be soldered |
-
1982
- 1982-10-22 JP JP18634982A patent/JPS5976662A/en active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0171257A2 (en) * | 1984-07-30 | 1986-02-12 | Sun Industrial Coatings Private Ltd. | Apparatus for holding electrical or electronic components during the application of solder |
| US4677937A (en) * | 1984-07-30 | 1987-07-07 | Sun Industrial Coatings Private Ltd. | Apparatus for holding electrial or electronic components during the application of solder |
| JPS62108564A (en) * | 1985-10-31 | 1987-05-19 | アメリカン・マイクロシステムズ・インコ−ポレイテツド | Solder covering of electric lead wire |
| JPS6411067A (en) * | 1987-07-06 | 1989-01-13 | Tamura Seisakusho Kk | Jig for lining up and supporting object to be soldered |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS612468B2 (en) | 1986-01-24 |
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